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Industry's Only Surface-Mount, Single-Piece Nonvolatile SRAM Module with Integrated RTC
| Note to Editor: Dallas Semiconductor is the first and only company offering a single-piece NVSRAM module with RTC. As a single-piece module, all hand soldering or two-piece assembly is eliminated. Competitive solutions cannot make the same claim. Available in multiple densities, these modules can grow in density while maintaining the same footprint, another feature unique to the Company's offerings. |
DALLAS, TX-October 31, 2005-Dallas Semiconductor (NASDAQ: MXIM) introduces the industry's first and only single-piece, surface mountable nonvolatile SRAM (NVSRAM) modules with an integrated real-time clock (RTC), the new DS3030/DS3045/DS3050/DS3065. These modules augment the Company's existing NVSRAM module family (static RAM plus a NV controller). They provide a fully integrated and convenient method to protect mission-critical data from unexpected and unscheduled power loss. Packaged in a 27mm x 27mm, 256-ball BGA, these parts are completely sealed from the outside environment.
The new DS3030/DS3045/DS3050/DS3065 also contain a reflowable battery. Due to integrated intelligent circuitry, the Vcc is constantly monitored for an out-of-tolerance condition. When such a condition occurs, the lithium battery is automatically switched on and write protection is unconditionally enabled to prevent data corruption.
The RTC in these new modules contains a full-function, year 2000-compliant (Y2KC) clock/calendar with an RTC alarm, watchdog timer, battery monitor, and power monitor. RTC registers contain century, year, month, date, day, hours, minutes, and seconds data in a 24-hour BCD format. Corrections for day of the month and leap year are made automatically
There is no limit to the number of write cycles that can be executed with these memory modules, and no additional support circuitry is required for microprocessor interfacing. These devices can be used in place of SRAM, EEPROM, or flash components.
These 3.3V modules are available in densities from 32k x 8 bits to 1M x 8 bits, all having the same footprint and pinout. This enables the product to grow in density, while still keeping the same footprint.
Handling the DS3030/DS3045/DS3050/DS3065 modules in standard assembly processes is uncomplicated and convenient. Single-piece construction is the reason. These parts can be pick-and-placed from their shipping trays, using existing pick-and-place machines. They are compatible with standard SMT processes, and withstand reflow temperatures to a peak temperature of +225°C +0°C /-5°C for 30 seconds. After reflow, the modules can be washed in an aqueous-based cleaning solution with no special precautions.
Part Selector Guide:
| Part |
Memory Density (bits) |
RTC |
Supply Voltage (V) |
| New Single-Piece NVSRAM Modules with RTC |
| DS3030 |
32k x 8 |
Yes |
3.3 |
| DS3045 |
128k x 8 |
Yes |
3.3 |
| DS3050 |
512k x 8 |
Yes |
3.3 |
| DS3065 |
1M x 8 |
Yes |
3.3 |
| Existing Single-Piece NVSRAM Modules |
| DS2030 |
32k x 8 |
No |
3.3/5.0 |
| DS2045 |
128k x 8 |
No |
3.3/5.0 |
| DS2050 |
512k x 8 |
No |
3.3 |
| DS2065 |
1M x 8 |
No |
3.3 |
|
