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Active: In Production.

Data Sheet

ABRIDGED DATA SHEET (PDF, 264kB) Download Request Full Data Sheet

Description

ABRIDGED DATA SHEET (PDF, 264kB) Download Request Full Data Sheet These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards-based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. The high level of integration available with the DS34S10x devices minimizes cost, board space, and time to market.

An evaluation kit is available:  DS34T108DK  

Key Features

Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments 64 Independent Bundles/Connections Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet VLAN Support According to 802.1p and 802.1Q 10/100 Ethernet MAC Supports MII/RMII/SSMII Selectable 32-Bit, 16-Bit or SPI Processor Bus Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing Glueless SDRAM Buffer Management Low-Power 1.8V Core, 3.3V I/O

Application Notes

Application Note 3963: How to Install NISTnet Software and Configure TDMoP Products to Run with It - DS34S101, DS34S102, DS34S104, DS34S108 Application Note 4115: How to Use Jitter Buffers on TDMoP Products to Compensate for Packet-Delay Variation (PDV) - DS34S101, DS34S102, DS34S104, DS34S108 Application Note 4158: Interoperability of Maxim's TDM-over-Packet (TDMoP) Devices with Other Vendors' TDMoP Devices - DS34S101, DS34S102, DS34S104, DS34S108 Application Note 4248: G.8261 Compliance Report - DS34S108

Evaluation Kits

DS34T108DK

Design Guides

Communications (PDF)

Reliability Reports

Reliability Report: DS34S104.pdf DS34S108.pdf Request Reliability Report for: DS34S101 DS34S102

Software/Models

Request the Software Development Package DS34S101 BSDL Model DS34S101 IBIS Model DS34S102 IBIS Model DS34S104 BSDL Model DS34S104 IBIS Model DS34S108 BSDL Model

Ordering Information

Notes: Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.

Devices: 1-9 of 9

DS34S101	Free Sample	Buy	Status	Package: TYPE PINS FOOTPRINT   DRAWING CODE/VAR *	Temp	RoHS/Lead-Free? Materials Analysis
DS34S101GN+			Active	CSBGA;256 pin;289 mm² Outline Drawing: 21-0479 (PDF) Land Pattern: 90-0271 (PDF) Use pkgcode/variation: X256+9*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
DS34S101GN			Active	CSBGA;256 pin;289 mm² Outline Drawing: 21-0479 (PDF) Land Pattern: 90-0271 (PDF) Use pkgcode/variation: X256-9*	-40°C to +85°C	See data sheet
DS34S102	Free Sample	Buy	Status	Package: TYPE PINS FOOTPRINT   DRAWING CODE/VAR *	Temp	RoHS/Lead-Free? Materials Analysis
DS34S102GN			Active	CSBGA;256 pin;289 mm² Outline Drawing: 21-0479 (PDF) Land Pattern: 90-0271 (PDF) Use pkgcode/variation: X256-9*	-40°C to +85°C	See data sheet
DS34S102GN+			Active	CSBGA;256 pin;289 mm² Outline Drawing: 21-0479 (PDF) Land Pattern: 90-0271 (PDF) Use pkgcode/variation: X256+9*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
DS34S104	Free Sample	Buy	Status	Package: TYPE PINS FOOTPRINT   DRAWING CODE/VAR *	Temp	RoHS/Lead-Free? Materials Analysis
DS34S104GN+			Active	CSBGA;256 pin;289 mm² Outline Drawing: 21-0479 (PDF) Land Pattern: 90-0271 (PDF) Use pkgcode/variation: X256+9*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
DS34S104GN			Active	CSBGA;256 pin;289 mm² Outline Drawing: 21-0479 (PDF) Land Pattern: 90-0271 (PDF) Use pkgcode/variation: X256-9*	-40°C to +85°C	See data sheet
DS34S108	Free Sample	Buy	Status	Package: TYPE PINS FOOTPRINT   DRAWING CODE/VAR *	Temp	RoHS/Lead-Free? Materials Analysis
DS34S108DK-L7			Active	Land Pattern: Not Available	0°C to +70°C	See data sheet
DS34S108GN+			Active	BGA;484 pin;529 mm² Outline Drawing: 21-0447 (PDF) Land Pattern: 90-0310 (PDF) Use pkgcode/variation: V484T+4*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
DS34S108GN			Active	BGA;484 pin;529 mm² Outline Drawing: 21-0447 (PDF) Land Pattern: 90-0310 (PDF) Use pkgcode/variation: V484T-4*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis

Related Products

DS34T101, DS34T102, DS34T104, DS34T108 Single/Dual/Quad/Octal TDM-Over-Packet Chip More Like This: View Product Families for Similar Products See All TDM-Over-Packet (9 Products)

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