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Maxim > Products > [T/E Carrier and Packetized Communications] 
DS34S101, DS34S102, DS34S104, DS34S108
Single/Dual/Quad/Octal TDM-Over-Packet Transport Devices

Smallest, Most Robust, Lowest Cost Choice for Delivering TDM Services Over Pseudowires


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Status
Active: In Production.

Data Sheet
ABRIDGED DATA SHEET (PDF, 264kB)
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Description
ABRIDGED DATA SHEET (PDF, 264kB)
Download this datasheet in PDF formatDownload Request Full Data Sheet
These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards-based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. The high level of integration available with the DS34S10x devices minimizes cost, board space, and time to market.

An evaluation kit is available:  DS34T108DK  

Key Features
  • Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks
  • Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS
  • Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes
  • On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable
  • Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments
  • 64 Independent Bundles/Connections
  • Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet
  • VLAN Support According to 802.1p and 802.1Q
  • 10/100 Ethernet MAC Supports MII/RMII/SSMII
  • Selectable 32-Bit, 16-Bit or SPI Processor Bus
  • Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing
  • Glueless SDRAM Buffer Management
  • Low-Power 1.8V Core, 3.3V I/O

Key Specifications:  TDM-Over-Packet
Part Number T1/E1/Serial Streams T3/E3, STS-1 Serial Ports Mapping Methods PSN Encapsulation Protocols 10/100 MAC Interface Processor Interface Package/Pins Smallest Available Pckg.
(mm2)		 Price
max w/pins See Notes
DS34S101  1 1
AAL1
CESoPSN
HDLC
SAToP
Structured
Structured with CAS
TDMoIP
Unstructured
L2TPv3 (IPv4, IPv6)
MEF-8
MPLS
RTP
UDP (IPv4, IPv6)
MII
RMII
SSMII
16-Bit
32-Bit
SPI
CSBGA/256
 289 $28.69 @1k
DS34S102  2
CSBGA/256
 289 $33.66 @1k
DS34S104  4
CSBGA/256
 289 $40.83 @1k
DS34S108  8
BGA/484
 529 $59.59 @1k
See All TDM-Over-Packet (9)

Application Notes
  		• Application Note 3963: How to Install NISTnet Software and Configure TDMoP Products to Run with It - DS34S101, DS34S102, DS34S104, DS34S108
  		• Application Note 4115: How to Use Jitter Buffers on TDMoP Products to Compensate for Packet-Delay Variation (PDV) - DS34S101, DS34S102, DS34S104, DS34S108
  		• Application Note 4158: Interoperability of Maxim's TDM-over-Packet (TDMoP) Devices with Other Vendors' TDMoP Devices - DS34S101, DS34S102, DS34S104, DS34S108
  		• Application Note 4248: G.8261 Compliance Report - DS34S108

    Evaluation Kits
  		• DS34T108DK

    Design Guides
  		• Communications (PDF)

    Reliability Reports
  		• Reliability Report: DS34S104.pdf DS34S108.pdf
  		• Request Reliability Report for:

    Software/Models
  		• Request the Software Development Package
  		• DS34S101 BSDL Model
  		• DS34S101 IBIS Model
  		• DS34S102 IBIS Model
  		• DS34S104 BSDL Model
  		• DS34S104 IBIS Model
  		• DS34S108 BSDL Model

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-9 of 9

    DS34S101 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS34S101GN+    
    		Active CSBGA;256 pin;289 mm²
    Outline Drawing: 21-0315 (PDF)
    Land Pattern: 90-0271 (PDF)
    Use pkgcode/variation: X256+9*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS34S101GN    
    		Active CSBGA;256 pin;289 mm²
    Outline Drawing: 21-0315 (PDF)
    Land Pattern: 90-0271 (PDF)
    Use pkgcode/variation: X256-9*
    		-40°C to +85°C See data sheet
    DS34S102 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS34S102GN    
    		Active CSBGA;256 pin;289 mm²
    Outline Drawing: 21-0315 (PDF)
    Land Pattern: 90-0271 (PDF)
    Use pkgcode/variation: X256-9*
    		-40°C to +85°C See data sheet
    DS34S102GN+  
    		Active CSBGA;256 pin;289 mm²
    Outline Drawing: 21-0315 (PDF)
    Land Pattern: 90-0271 (PDF)
    Use pkgcode/variation: X256+9*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS34S104 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS34S104GN+  
    		Active CSBGA;256 pin;289 mm²
    Outline Drawing: 21-0315 (PDF)
    Land Pattern: 90-0271 (PDF)
    Use pkgcode/variation: X256+9*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS34S104GN    
    		Active CSBGA;256 pin;289 mm²
    Outline Drawing: 21-0315 (PDF)
    Land Pattern: 90-0271 (PDF)
    Use pkgcode/variation: X256-9*
    		-40°C to +85°C See data sheet
    DS34S108 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS34S108DK-L7    
    		Active

    Land Pattern: Not Available

    		0°C to +70°C See data sheet
    DS34S108GN+  
    		Active BGA;484 pin;529 mm²
    Outline Drawing: 21-0447 (PDF)
    Land Pattern: 90-0310 (PDF)
    Use pkgcode/variation: V484T+4*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS34S108GN  
    		Active BGA;484 pin;529 mm²
    Outline Drawing: 21-0447 (PDF)
    Land Pattern: 90-0310 (PDF)
    Use pkgcode/variation: V484T-4*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis

    Related Products
    DS34T101, DS34T102, DS34T104, DS34T108 Single/Dual/Quad/Octal TDM-Over-Packet Chip

    More Like This: View Product Families for Similar Products

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    2008-11-10
    This page last modified: 2009-03-26


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