ENGLISH 简体中文 日本語 한국어  

    Login | Register 


   
 
Enter keywords or part number    



DS33M30, DS33M31, DS33M33
Ethernet Over SONET/SDH Mapper

Provide the Industry's Most Compact and Efficient Solution for Transporting Ethernet Traffic Over SONET/SDH


  QuickView     Technical Documents     Ordering Info     More Information     User Comments (0)     All  
Status
Active: In Production.

Data Sheet
ABRIDGED DATA SHEET (PDF, 512kB)
Download this datasheet in PDF formatDownload
Request Full Data Sheet


Description
ABRIDGED DATA SHEET (PDF, 512kB)
Download this datasheet in PDF formatDownload Request Full Data Sheet
The DS33M30 family of products provides a compact and efficient solution for transporting Gigabit Ethernet traffic over OC-3/STM-1 optical networks. With the addition of an optical transceiver, Ethernet PHY, DDR SDRAM, and host processor, a complete solution of GbE over OC-3/STM-1 can be implemented. The family supports Ethernet over SONET/SDH (EoS) at VC-4, "Next-Generation" EoS higher order mapping with multiple concatenated VC-3s, and Ethernet over PDH over SONET/SDH (EoPoS) with up to three virtually concatenated DS3/E3 tributaries. The supported frame encapsulations include GFP-F, HDLC, cHDLC, and X.86 (LAPS).

An evaluation kit is available:  DS33M30DK   DS33M33DK  

Key Features
  • Support for EoS in One STS-3c/VC-4, EoS Over Up to Three Concatenated STS-1/VC-3s, and EoPoS Over Up to Three Concatenated DS-3s
  • Two Independent 155.52Mbps SerDes Ports
  • One 10/100/1000 IEEE 802.3 Ethernet MAC Port
  • Configurable MII/RMII/GMII MAC Interface
  • GFP/LAPS/HDLC/cHDLC Encapsulation
  • IEEE 802.1Q VLAN and Q-in-Q Support
  • Add/Drop OAM Frames from µP Interface
  • Quality of Service (QoS) Support
  • Traffic Policing Through CIR/CBS
  • Classification Through PCP or DSCP
  • Supports Up to 512Mb DDR SDRAM Buffer
  • SPI™ and Parallel Microprocessor Interfaces
  • 1.8V, 2.5V, 3.3V Supplies

Key Specifications:  T/E Carrier & Packetized Products
Part Number Transmission Standard Functions Channels VSUPPLY
(V)
Package/Pins Smallest Available Pckg.
(mm2)
Price
max w/pins See Notes
DS33M30  OC-3/STM-1 Ethernet Mapper 1 3.3
CSBGA/144
104 $61.54 @1k
DS33M31 
1
2
CSBGA/256
289 $72.00 @1k
DS33M33 
1
2
CSBGA/256
289 $80.00 @1k
See All T/E Carrier & Packetized Products (102)

Application Notes
  • Application Note 4102: Using Ethernet over PDH in SONET/SDH Networks - DS33M30, DS33M31, DS33M33

    Evaluation Kits
  • DS33M30DK
  • DS33M33DK

    Design Guides
  • Communications (PDF)

    Reliability Reports
  • Reliability Report: DS33M33.pdf DS33M31.pdf DS33M30.pdf

    Software/Models
  • DS33M30 IBIS Model
  • DS33M30 Logical Symbol-XML Format
  • DS33M30 Orcad Logical Symbol
  • DS33M31 IBIS Model
  • DS33M33 Logical Symbol-XML Format
  • DS33M33 Orcad Logical Symbol
  • DS33M33 IBIS Model

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-4 of 4

    DS33M30 Free
    Sample
    Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    DS33M30N+  
    Active CSBGA;144 pin;104 mm²
    Outline Drawing: 21-0169 (PDF)
    Land Pattern: 90-0289 (PDF)
    Use pkgcode/variation: X14400+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS33M31 Free
    Sample
    Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    DS33M31N+  
    Active CSBGA;256 pin;289 mm²
    Outline Drawing: 21-0315 (PDF)
    Land Pattern: 90-0271 (PDF)
    Use pkgcode/variation: X256+6*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS33M33 Free
    Sample
    Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    DS33M33N+  
    Active CSBGA;256 pin;289 mm²
    Outline Drawing: 21-0315 (PDF)
    Land Pattern: 90-0271 (PDF)
    Use pkgcode/variation: X256+6*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS33M33N+W    
    Active CSBGA;256 pin;289 mm²
    Outline Drawing: 21-0315 (PDF)
    Land Pattern: 90-0271 (PDF)
    Use pkgcode/variation: X256+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis

    More Information
  • New Product Press Release 2009-03-23 

    Related Products
    DS33W11, DS33W41, DS33X11, DS33X161, DS33X162, DS33X41, DS33X42, DS33X81, DS33X82 Ethernet Over PDH Mapping Devices

    More Like This: View Product Families for Similar Products

    Didn't Find What You Need?
  • Next Day Product Selection Assistance from Applications Engineers
  • Parametric Search
  • Applications Help
  •  QuickView   Technical Documents   Ordering Info   More Information  
     Description 
     Key Features 
     Applications/Uses 
     Key Specifications 
     Diagram 

     Data Sheet 
     Application Notes 
     Design Guides 
     Engineering Journals 
     Reliability Reports 
     Software/Models 
     Evaluation Kits 

     Price and Availability 
     Samples 
     Buy Online 
     Package Information 
     Lead-Free Information 

     Related Products 
     Notes and Comments 
     Evaluation Kits 

    2009-01-09
    This page last modified: 2009-01-09


            •         •         •     Privacy Policy     •     Legal Notices

        Copyright © 2009 by Maxim Integrated Products