DS34T101, DS34T102, DS34T104, DS34T108
Single/Dual/Quad/Octal TDM-Over-Packet Chip
Supports CESoPSN, SAToP, and TDMoIP Transport Over a Packet-Switched Network for Up to 8 E1/T1 Ports
Status
Active: In Production.
Description
These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards-based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. With built-in full-featured E1/T1 framers and LIUs. These ICs encapsulate the TDM-over-packet solution from analog E1/T1 signal to Ethernet MII while preserving options to make use of TDM streams at key intermediate points. The high level of integration available with the DS34T10x devices minimizes cost, board space, and time to market.
An evaluation kit is available:
DS34T108DK
Key Features
Applications/Uses
Full-Featured IC Includes E1/T1 LIUs and Framers, TDMoP Engine, and 10/100 MAC
Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks
Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS
Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes
On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable
Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments
64 Independent Bundles/Connections
Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet
VLAN Support According to 802.1p and 802.1Q
10/100 Ethernet MAC Supports MII/RMII/SSMII
Selectable 32-Bit, 16-Bit or SPI Processor Bus
Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing
Glueless SDRAM Buffer Management
Low-Power 1.8V Core, 3.3V I/O
TDM Circuit Extension Over PSN Leased-Line Services Over PSN TDM Over G/E-PON TDM Over Cable TDM Over WiMAX Cellular Backhaul Over PSN Multiservice Over Unified PSN HDLC-Based Traffic Transport Over PSN
Key Specifications: TDM-Over-Packet
Part Number
Integrated T1/E1 LIU+Framer
T1/E1/Serial Streams
T3/E3, STS-1 Serial Ports
Mapping Methods
PSN Encapsulation Protocols
10/100 MAC Interface
Processor Interface
Package/Pins
Smallest Available Pckg.2 )
Price
max w/pins
See Notes
DS34T101 1
1
1
AAL1 CESoPSN HDLC SAToP Structured Structured with CAS TDMoIP Unstructured
L2TPv3 (IPv4, IPv6) MEF-8 MPLS RTP UDP (IPv4, IPv6)
529
$35.31 @1k
DS34T102 2
2
$43.03 @1k
DS34T104 4
4
$52.97 @1k
DS34T108 8
8
$79.45 @1k
See All TDM-Over-Packet (9)
Application Notes
Application Note 3963: How to Install NISTnet Software and Configure TDMoP Products to Run with It - DS34T101, DS34T102, DS34T104, DS34T108 Application Note 4115: How to Use Jitter Buffers on TDMoP Products to Compensate for Packet-Delay Variation (PDV) - DS34T101, DS34T102, DS34T104, DS34T108 Application Note 4158: Interoperability of Maxim's TDM-over-Packet (TDMoP) Devices with Other Vendors' TDMoP Devices - DS34T101, DS34T102, DS34T104, DS34T108 Application Note 4248: G.8261 Compliance Report - DS34T108 Application Note 4319: FDL Network Loopback Support Using TDMoP Devices - DS34T101, DS34T102, DS34T104, DS34T108
Ordering Information
Notes:
Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales .
Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions .
* Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.
Free
Buy
Status
Package:
TYPE PINS FOOTPRINT
DRAWING CODE/VAR *
Temp
RoHS/Lead-Free?
DS34T101GN+
Active
BGA;484 pin;529 mm²
21-0447 (PDF)
90-0310 (PDF)*
-40°C to +85°C
RoHS/Lead-Free: Lead Free
Materials Analysis
DS34T101GN
Active
BGA;484 pin;529 mm²
21-0447 (PDF)
90-0310 (PDF)*
-40°C to +85°C
RoHS/Lead-Free: No
Materials Analysis
Free
Buy
Status
Package:
TYPE PINS FOOTPRINT
DRAWING CODE/VAR *
Temp
RoHS/Lead-Free?
DS34T102GN+
Active
BGA;484 pin;529 mm²
21-0447 (PDF)
90-0310 (PDF)*
-40°C to +85°C
RoHS/Lead-Free: Lead Free
Materials Analysis
DS34T102GN
Active
BGA;484 pin;529 mm²
21-0447 (PDF)
90-0310 (PDF)*
-40°C to +85°C
RoHS/Lead-Free: No
Materials Analysis
Free
Buy
Status
Package:
TYPE PINS FOOTPRINT
DRAWING CODE/VAR *
Temp
RoHS/Lead-Free?
DS34T104GN
Active
BGA;484 pin;529 mm²
21-0447 (PDF)
90-0310 (PDF)*
-40°C to +85°C
RoHS/Lead-Free: No
Materials Analysis
DS34T104GN+
Active
BGA;484 pin;529 mm²
21-0447 (PDF)
90-0310 (PDF)*
-40°C to +85°C
RoHS/Lead-Free: Lead Free
Materials Analysis
Free
Buy
Status
Package:
TYPE PINS FOOTPRINT
DRAWING CODE/VAR *
Temp
RoHS/Lead-Free?
DS34T108GN+
Active
BGA;484 pin;529 mm²
21-0366 (PDF)
90-0283 (PDF)*
-40°C to +85°C
RoHS/Lead-Free: Lead Free
Materials Analysis
DS34T108GN
Active
BGA;484 pin;529 mm²
21-0366 (PDF)
90-0283 (PDF)*
-40°C to +85°C
See data sheet
Related Products
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Didn't Find What You Need?
Document Ref.: 19-4835;
2009-08-21
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