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DS34T101*, DS34T102, DS34T104, DS34T108
Single/Dual/Quad/Octal TDM-Over-Packet Chip

Supports CESoPSN, SAToP, and TDMoIP Transport Over a Packet-Switched Network for Up to 8 E1/T1 Ports

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    Data Sheet
    ABRIDGED DATA SHEET (PDF, 1.2MB)
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    Errata
  • Errata DS34T101 34T10XA1.pdf 
  • Errata DS34T102 34T10XA1.pdf 
  • Errata DS34T104 34T10XA1.pdf 
  • Errata DS34T108 34T10XA1.pdf 
  • Errata DS34T101 34T10x_B1.pdf 
  • Errata DS34T102 34T10x_B1.pdf 
  • Errata DS34T104 34T10x_B1.pdf 
  • Errata DS34T108 34T10x_B1.pdf 
  • Description
    These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3 or STS-1 stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards-based TDM-over-packet mapping methods are supported. Frame-based serial HDLC data flows are also supported. With built-in full-featured E1/T1 framers and LIUs. These ICs encapsulate the TDM-over-packet solution from analog E1/T1 signal to Ethernet MII while preserving options to make use of TDM streams at key intermediate points. The high level of integration available with the DS34T10x devices minimizes cost, board space, and time to market.

    Key Features   Applications/Uses
    • Full-Featured IC Includes E1/T1 LIUs and Framers, TDMoP Engine, and 10/100 MAC
    • Transport of E1, T1, E3, T3 or STS-1 TDM Signals Over Packet Networks
    • Full Support for All Mapping Methods: SAToP, CESoPSN, TDMoIP, HDLC, Unstructured, Structured, Structured with CAS, AAL1, AAL2
    • Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes
    • On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable
    • Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments
    • 64 Independent Bundles/Connections
    • Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet
    • VLAN Support According to 802.1p and 802.1Q
    • 10/100 Ethernet MAC Supports MII/RMII/SSMII
    • Selectable 32-Bit, 16-Bit or SPI Processor Bus
    • Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing
    • Glueless SDRAM Buffer Management
    • Low-Power 1.8V Core, 3.3V I/O

     
  • TDM Circuit Extension Over PSN
  • Leased-Line Services Over PSN
  • TDM Over G/E-PON
  • TDM Over Cable
  • TDM Over WiMAX
  • Cellular Backhaul Over PSN
  • Multiservice Over Unified PSN
  • HDLC-Based Traffic Transport Over PSN

    Application Notes
  • Application Note 3963: How to Install NISTnet Software and Configure TDMoP Products to Run with It - DS34T101, DS34T102, DS34T104, DS34T108
  • Application Note 4115: How to Use Jitter Buffers on TDMoP Products to Compensate for Packet-Delay Variation (PDV) - DS34T101, DS34T102, DS34T104, DS34T108
  • Application Note 4158: Interoperability of Maxim's TDM-over-Packet (TDMoP) Devices with Other Vendors' TDMoP Devices - DS34T101, DS34T102, DS34T104, DS34T108
  • Application Note 4248: G.8261 Compliance Report - DS34T108

    Evaluation Kits
    none

    Design Guides
  • COMMUNICATIONS (PDF)

    Reliability Reports
  • Reliability Report: DS34T101.pdf DS34T102.pdf DS34T108.pdf
  • Request Reliability Report for:

    Software/Models
  • DS34S108 IBIS Model
  • DS34T108 IBIS Model
  • DS34T108 BSDL Model

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-12 of 12

    DS34T101 Free
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      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    DS34T101GN  



    -40°C to +85°C See data sheet
    DS34T101GN+  



    -40°C to +85°C See data sheet
    DS34T102 Free
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    Temp RoHS/Lead-Free?
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    DS34T102GN  



    -40°C to +85°C See data sheet
    DS34T102GN+  



    -40°C to +85°C See data sheet
    DS34T104 Free
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    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
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    DS34T104GN  



    -40°C to +85°C See data sheet
    DS34T104GN+  



    -40°C to +85°C See data sheet
    DS34T108 Free
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    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    DS34T108GN  



    -40°C to +85°C See data sheet
    DS34T108GN+  



    -40°C to +85°C See data sheet
    DS34T108DK-L1  



    0°C to +70°C See data sheet
    DS34T108DK-L2  



    0°C to +70°C See data sheet
    DS34T108DK-L4  



    0°C to +70°C See data sheet
    DS34T108DK-L5  



    0°C to +70°C See data sheet

    More Information
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    2008-08-08
    This page last modified: 2008-08-08



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