ENGLISH • 简体中文 • 日本語 • 한국어  

    Login | Register 


   
 
Enter keywords or part number    


What's New Products Solutions Design AppNotes Support Sales About Us Members

Maxim > Products > [T/E Carrier and Packetized Communications] 
DS3251, DS3252, DS3253, DS3254
Single/Dual/Triple/Quad DS3/E3/STS-1 LIUs


  QuickView     Technical Documents     Ordering Info     More Information     User Comments (0)     All  
Status
Active: In Production.

Data Sheet
FULL DATA SHEET (PDF, 908kB)
Download this datasheet in PDF formatDownload   Send this datasheet to any email addressE-Mail

Errata
  • Errata DS3251 325XA2.pdf 
  • Errata DS3252 325XA2.pdf 
  • Errata DS3253 325XA2.pdf 
  • Errata DS3254 325XA2.pdf 
  • Errata DS3251 325XA3.pdf 
  • Errata DS3252 325XA3.pdf 
  • Errata DS3253 325XA3.pdf 
  • Errata DS3254 325XA3.pdf 

    • Description
    The DS3251 (single), DS3252 (dual), DS3253 (triple), and DS3254 (quad) line interface units (LIUs) perform the functions necessary for interfacing at the physical layer to DS3, E3, or STS-1 lines. Each LIU has independent receive and transmit paths and a built-in jitter attenuator. An on-chip clock adapter generates all line-rate clocks from a single input clock. Control interface options include 8-bit parallel, SPI, and hardware mode.

    An evaluation kit is available:  DS3254DK  

    Key Features   Applications/Uses
  		• Pin-Compatible Family of Products
  		• Each Port Independently Configurable
  		• Receive Clock and Data Recovery for up to 380 meters (DS3), 440 meters (E3), or 360 meters (STS-1) of 75 Coaxial Cable
  		• Standards-Compliant Transmit Waveshaping
  		• Three Control Interface Options: 8-Bit Parallel, SPI, and Hardware Mode
  		• Built-In Jitter Attenuators can be Placed in Either the Receive or Transmit Paths
  		• Jitter Attenuators Have Provisionable Buffer Depth: 16, 32, 64, or 128 Bits
  		• Built-In Clock Adapter Generates All Line-Rate Clocks from a Single Input Clock (DS3, E3, STS-1, OC-3, 19.44MHz, 38.88MHz, 77.76MHz)
  		• B3ZS/HDB3 Encoding and Decoding
  		• Minimal External Components Required
  		• Local and Remote Loopbacks
  		• Low-Power 3.3V Operation (5V Tolerant I/O)
  		• Industrial Temperature Range: -40°C to +85°C
  		• Small Package: 144-Pin, 13mm x 13mm Thermally Enhanced CSBGA
  		• Drop-In Replacement for DS3151/DS3152/DS3153/DS3154 LIUs
  		• IEEE 1149.1 JTAG Support

    		  
  		• Access Concentrators
  		• ATM and Frame Relay Equipment
  		• CSUs/DSUs
  		• Digital Cross-Connects
  		• DSLAMs
  		• PBXs
  		• Routers/Switches
  		• SONET/SDH and PDH Multiplexers

    Key Specifications:  T/E Carrier & Packetized Products
    Part Number Transmission Standard Functions Channels VSUPPLY
    (V)    		 EV Kit Package/Pins Smallest Available Pckg.
    (mm2)    		 Price
    max w/pins See Notes
    DS3251 
    STS-1
    T3/E3
    		 LIU 1 3.3 -
    TECSBGA/144
    		 169 $16.00 @1k
    DS3252  2 -
    TECSBGA/144
    		 $32.40 @1k
    DS3253  3 Yes
    TECSBGA/144
    		 $48.00 @1k
    DS3254  4 Yes
    TECSBGA/144
    		 $57.60 @1k
    See All T/E Carrier & Packetized Products (102)

    Diagram
    DS3251, DS3252, DS3253, DS3254: Functional Diagram
    Functional Diagram

    Application Notes
  		• Application Note 404: Modifying the E3 Template Compliance of the DS3150, DS315x and DS325x - DS3251, DS3252, DS3253, DS3254
  		• Application Note 3410: Guidelines for Laying Out T3 and E3 Network Interfaces - DS3251, DS3252, DS3253, DS3254
  		• Application Note 3547: Measuring Return Loss on T3/E3/STS-1 LIUs - DS3251, DS3252, DS3253, DS3254
  		• Application Note 3556: Configuring Dallas Semiconductor LIUs Without a Microcontroller - DS3251, DS3252, DS3253, DS3254
  		• Application Note 3609: Clock-Rate-Adapter (CLAD) Features for DS325X, DS316X, DS317X, and DS318X - DS3251, DS3252, DS3253, DS3254
  		• Application Note 3670: Measuring Return Loss Using the Advantest R3132 Spectrum Analyzer - DS3251, DS3252, DS3253, DS3254
  		• Application Note 3777: Using Software to Shape the Transmit Pulse of the DS325x LIUs - DS3251, DS3252, DS3253, DS3254

    Evaluation Kits
  		• DS3254DK

    Design Guides
  		• Communications (PDF)

    Reliability Reports
  		• Reliability Report: DS3251.pdf DS3252.pdf DS3253.pdf DS3254.pdf

    Software/Models
  		• DS3251 IBIS Model
  		• DS3251 BSDL Model
  		• DS3252 BSDL Model
  		• DS3252 IBIS Model
  		• DS3253 BSDL Model
  		• DS3253 IBIS Model
  		• DS3254 BSDL Model
  		• DS3254 IBIS Model
  		• DS3254 Cadence Allegro Symbol
  		• DS3254 Cadence Concept Symbol

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-16 of 16

    DS3251 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS3251N  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		-20°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3251N+  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3251+  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3252 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS3252N  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3252N+  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3252+  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3253 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS3253N#    
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3253N  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3253DK    
    		Active

    Land Pattern: Not Available

    		0°C to +70°C See data sheet
    DS3253+  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3253N+  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3254 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS3254NA3  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3254N#    
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3254N    
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3254+  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3254N+  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis

    More Information
  		• Product Ad: Download
  		• DS3254 Demo Kit

    Related Products

    More Like This: View Product Families for Similar Products

    Didn't Find What You Need?
  • Next Day Product Selection Assistance from Applications Engineers
  • Parametric Search
  • Applications Help

    •  QuickView   Technical Documents   Ordering Info   More Information  
     Description 
     Key Features 
     Applications/Uses 
     Key Specifications 
     Diagram 

    		 Data Sheet 
     Errata 
     Application Notes 
     Design Guides 
     Engineering Journals 
     Reliability Reports 
     Software/Models 
     Evaluation Kits 

    		 Price and Availability 
     Samples 
     Buy Online 
     Package Information 
     Lead-Free Information 

    		 Related Products 
     Notes and Comments 
     Evaluation Kits 

    2006-03-02
    This page last modified: 2009-10-06


            •         •         •     Privacy Policy     •     Legal Notices

        Copyright © 2009 by Maxim Integrated Products