| Key Features |
|
Applications/Uses |
- Single (DS3171), Dual (DS3172), Triple
(DS3173), or Quad (DS3174) Single-Chip
Transceiver for DS3 and E3
- All Four Devices are Pin Compatible for Ease of Port Density Migration in the Same Printed
Circuit Board Platform
- Each Port Independently Configurable
- Performs Receive Clock/Data Recovery and
Transmit Waveshaping for DS3 and E3
- Jitter Attenuator can be Placed Either in the
Receive or Transmit Paths
- Interfaces to 75Ω Coaxial Cable at Lengths Up to
380 meters, or 1246 feet (DS3) or 440 meters, or
1443 feet (E3)
- Uses 1:2 Transformers on Both Tx and Rx
- On-Chip DS3 (M23 or C-Bit) and E3 (G.751 or
G.832) Framer(s)
- Ports Independently Configurable for DS3, E3
- Built-In HDLC Controllers with 256-Byte FIFOs
for the Insertion/Extraction of DS3 PMDL, G.751
Sn Bit, and G.832 NR/GC Bytes
- On-Chip BERTs for PRBS and Repetitive Pattern
Generation, Detection, and Analysis
- Large Performance-Monitoring Counters for
Accumulation Intervals of at Least 1 Second
- Flexible Overhead Insertion/Extraction Ports for
DS3, E3 Framers
- Loopbacks Include Line, Diagnostic, Framer,
Payload, and Analog with Capabilities to Insert
AIS in the Directions Away from Loopback
Directions
- Ports can be Disabled to Reduce Power
- Integrated Clock Rate Adapter to Generate the
Remaining Internally Required 44.736MHz (DS3)
and 34.368MHz (E3) from a Single Clock
Reference Source at One of Three Standard
Frequencies (DS3, E3, STS-1)
- Pin Compatible with the DS318x Family of
Devices and the DS316x Family of Devices
- 8-/16-Bit Generic Microprocessor Interface
- Low-Power (~1.73W) 3.3V Operation (5V
Tolerant I/O)
- Small High-Density Thermally Enhanced Chip-
Scale BGA Packaging (TE-CSBGA) with 1.27mm
Pin Pitch
- Industrial Temperature Operation: -40°C to
+85°C
- IEEE1149.1 JTAG Test Port
|
|
|
| Access Concentrators
| | Digital Cross Connect
| | Integrated Access Device (IAD)
| | Multiservice Access Platform (MSAP)
| | Multiservice Protocol Platform (MSPP)
| | PBXs
| | PDH Multiplexer/Demultiplexer
| | Routers and Switches
| | SONET/SDH ADM and Muxes
| | Test Equipment
|
|
|
| DS3171 |
Free
Sample |
Buy |
Status |
|
Package:
|
TYPE PINS FOOTPRINT
|
| |
DRAWING CODE/VAR *
|
|
Temp |
RoHS/Lead-Free?
Materials Analysis |
DS3171
|
|
|
Active
|
PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
|
0°C to +70°C
|
See data sheet
|
DS3171N
|
|
|
Active
|
PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
|
-40°C to +85°C
|
See data sheet
|
| DS3172 |
Free
Sample |
Buy |
Status |
|
Package:
|
TYPE PINS FOOTPRINT
|
| |
DRAWING CODE/VAR *
|
|
Temp |
RoHS/Lead-Free?
Materials Analysis |
DS3172
|
|
|
Active
|
PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
|
0°C to +70°C
|
See data sheet
|
DS3172N
|
|
|
Active
|
PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
|
-40°C to +85°C
|
See data sheet
|
DS3172+
|
|
|
Active
|
PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T+2*
|
0°C to +70°C
|
RoHS/Lead-Free: Lead Free
Materials Analysis
|
DS3172N+
|
|
|
Active
|
PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T+2*
|
-40°C to +85°C
|
RoHS/Lead-Free: Lead Free
Materials Analysis
|
| DS3173 |
Free
Sample |
Buy |
Status |
|
Package:
|
TYPE PINS FOOTPRINT
|
| |
DRAWING CODE/VAR *
|
|
Temp |
RoHS/Lead-Free?
Materials Analysis |
DS3173
|
|
|
Active
|
PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
|
0°C to +70°C
|
See data sheet
|
DS3173N
|
|
|
Active
|
PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
|
-40°C to +85°C
|
See data sheet
|
| DS3174 |
Free
Sample |
Buy |
Status |
|
Package:
|
TYPE PINS FOOTPRINT
|
| |
DRAWING CODE/VAR *
|
|
Temp |
RoHS/Lead-Free?
Materials Analysis |
DS3174
|
|
|
Active
|
PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
|
0°C to +70°C
|
See data sheet
|
DS3174N
|
|
|
Active
|
PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
|
-40°C to +85°C
|
See data sheet
|
DS3174+
|
|
|
Active
|
PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T+2*
|
0°C to +70°C
|
RoHS/Lead-Free: Lead Free
Materials Analysis
|
DS3174N+
|
|
|
Active
|
PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T+2*
|
-40°C to +85°C
|
RoHS/Lead-Free: Lead Free
Materials Analysis
|
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