DS3171, DS3172, DS3173, DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers

Description

The DS3171 (single), DS3172 (dual), DS3173 (triple), and DS3174 (quad) perform framing, formatting, and line transmission and reception. These devices contain integrated LIU(s), framer/formatter for M23 DS3, C-bit DS3, G.751 E3, G.832 E3, or a combination of the above signal formats.

Each LIU has independent receive and transmit paths. The receiver LIU block performs clock and data recovery from a B3ZS- or HDB3-coded AMI signal and monitors for loss of the incoming signal, or can be bypassed for direct clock and data inputs. The receiver LIU block optionally performs B3ZS/HDB3 decoding. The transmitter LIU drives standard pulse-shape waveforms onto 75Ω coaxial cable or can be bypassed for direct clock and data outputs. The jitter attenuator can be placed in either transmit or receive data path when the LIU is enabled. The DS3/E3 framers transmit and receive serial data in properly formatted M23 DS3, C-bit DS3, G.751 E3, or G.832 E3 data streams. Unused functions can be powered down to reduce device power. The DS317x DS3/E3 SCTs conform to the telecommunications standards listed in Section 4.

An evaluation kit is available: DS3174DK

Key Features

Applications/Uses

Single (DS3171), Dual (DS3172), Triple (DS3173), or Quad (DS3174) Single-Chip Transceiver for DS3 and E3
All Four Devices are Pin Compatible for Ease of Port Density Migration in the Same Printed Circuit Board Platform
Each Port Independently Configurable
Performs Receive Clock/Data Recovery and Transmit Waveshaping for DS3 and E3
Jitter Attenuator can be Placed Either in the Receive or Transmit Paths
Interfaces to 75Ω Coaxial Cable at Lengths Up to 380 meters, or 1246 feet (DS3) or 440 meters, or 1443 feet (E3)
Uses 1:2 Transformers on Both Tx and Rx
On-Chip DS3 (M23 or C-Bit) and E3 (G.751 or G.832) Framer(s)
Ports Independently Configurable for DS3, E3
Built-In HDLC Controllers with 256-Byte FIFOs for the Insertion/Extraction of DS3 PMDL, G.751 Sn Bit, and G.832 NR/GC Bytes
On-Chip BERTs for PRBS and Repetitive Pattern Generation, Detection, and Analysis
Large Performance-Monitoring Counters for Accumulation Intervals of at Least 1 Second
Flexible Overhead Insertion/Extraction Ports for DS3, E3 Framers
Loopbacks Include Line, Diagnostic, Framer, Payload, and Analog with Capabilities to Insert AIS in the Directions Away from Loopback Directions
Ports can be Disabled to Reduce Power
Integrated Clock Rate Adapter to Generate the Remaining Internally Required 44.736MHz (DS3) and 34.368MHz (E3) from a Single Clock Reference Source at One of Three Standard Frequencies (DS3, E3, STS-1)
Pin Compatible with the DS318x Family of Devices and the DS316x Family of Devices
8-/16-Bit Generic Microprocessor Interface
Low-Power (~1.73W) 3.3V Operation (5V Tolerant I/O)
Small High-Density Thermally Enhanced Chip- Scale BGA Packaging (TE-CSBGA) with 1.27mm Pin Pitch
Industrial Temperature Operation: -40°C to +85°C
IEEE1149.1 JTAG Test Port

	Access Concentrators
	Digital Cross Connect
	Integrated Access Device (IAD)
	Multiservice Access Platform (MSAP)
	Multiservice Protocol Platform (MSPP)
	PBXs
	PDH Multiplexer/Demultiplexer
	Routers and Switches
	SONET/SDH ADM and Muxes
	Test Equipment

Key Specifications: T/E Carrier & Packetized Products

Part Number

Transmission Standard

Functions

Channels

V_SUPPLY
(V)

EV Kit

Package/Pins

Smallest Available Pckg.
(mm²)

Price

max w/pins

See Notes

DS3171

T3/E3

Framer + LIU

3.3

729

DS3172

DS3173

DS3174

Yes

PBGA/400

$124.00 @1k

See All T/E Carrier & Packetized Products (102)

Diagram

Functional Diagram

Application Notes

Application Note 3410: Guidelines for Laying Out T3 and E3 Network Interfaces - DS3171, DS3172, DS3173, DS3174
Application Note 3547: Measuring Return Loss on T3/E3/STS-1 LIUs - DS3171, DS3172, DS3173, DS3174
Application Note 3609: Clock-Rate-Adapter (CLAD) Features for DS325X, DS316X, DS317X, and DS318X - DS3171, DS3172, DS3173, DS3174
Application Note 3670: Measuring Return Loss Using the Advantest R3132 Spectrum Analyzer - DS3171, DS3172, DS3173, DS3174
Application Note 3763: Measuring and Improving Return Loss on the DS317x and DS318x T3/E3/STS-1 LIUs - DS3171, DS3172, DS3173, DS3174

Evaluation Kits

DS3174DK

Design Guides

Communications (PDF)

Reliability Reports

Reliability Report: DS3171.pdf DS3172.pdf DS3173.pdf DS3174.pdf

Software/Models

DS3171 A2 BSDL Model

DS3171 IBIS Model

DS3172 A2 BSDL Model

DS3172 IBIS Model

DS3173 A2 BSDL Model

DS3173 IBIS Model

DS3174 A2 BSDL Model

DS3174 IBIS Model

Ordering Information

Notes:

Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
* Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.

Devices: 1-12 of 12

DS3171 Free
Sample Buy Status

Package: TYPE PINS FOOTPRINT

DRAWING CODE/VAR *

Temp RoHS/Lead-Free?
Materials Analysis

DS3171

Active PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
0°C to +70°C See data sheet

DS3171N

Active PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
-40°C to +85°C See data sheet

DS3172 Free
Sample Buy Status

Package: TYPE PINS FOOTPRINT

DRAWING CODE/VAR *

Temp RoHS/Lead-Free?
Materials Analysis

DS3172

Active PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
0°C to +70°C See data sheet

DS3172N

Active PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
-40°C to +85°C See data sheet

DS3172+

Active PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T+2*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis

DS3172N+

Active PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T+2*
-40°C to +85°C RoHS/Lead-Free: Lead Free
Materials Analysis

DS3173 Free
Sample Buy Status

Package: TYPE PINS FOOTPRINT

DRAWING CODE/VAR *

Temp RoHS/Lead-Free?
Materials Analysis

DS3173

Active PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
0°C to +70°C See data sheet

DS3173N

Active PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
-40°C to +85°C See data sheet

DS3174 Free
Sample Buy Status

Package: TYPE PINS FOOTPRINT

DRAWING CODE/VAR *

Temp RoHS/Lead-Free?
Materials Analysis

DS3174

Active PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
0°C to +70°C See data sheet

DS3174N

Active PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T-2*
-40°C to +85°C See data sheet

DS3174+

Active PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T+2*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis

DS3174N+

Active PBGA;400 pin;729 mm²
Outline Drawing: 21-0306 (PDF)
Land Pattern: 90-0266 (PDF)
Use pkgcode/variation: V400T+2*
-40°C to +85°C RoHS/Lead-Free: Lead Free
Materials Analysis

More Information

New Product Press Release 2005-03-29

Related Products

More Like This: View Product Families for Similar Products

See All T/E Carrier & Packetized Products (102 Products)

Didn't Find What You Need?

Next Day Product Selection Assistance from Applications Engineers
Parametric Search
Applications Help

QuickView Technical Documents Ordering Info More Information

Description
Key Features
Applications/Uses
Key Specifications
Diagram

Data Sheet
Errata
Application Notes
Design Guides
Engineering Journals
Reliability Reports
Software/Models
Evaluation Kits

Price and Availability
Samples
Buy Online
Package Information
Lead-Free Information

Related Products
Notes and Comments
Evaluation Kits

2006-12-14
This page last modified: 2009-10-07