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MAX5054, MAX5055, MAX5056, MAX5057
4A, 20ns, Dual MOSFET Drivers

4A, 20ns, Dual MOSFET Driver Available in 3mm x 3mm, Thermally Enhanced TDFN Package


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Ordering Information
Notes:

  1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
  2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
  3. Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
  4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


Devices: 1-8 of 8

MAX5055 Free
Sample
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Package: TYPE PINS FOOTPRINT
  DRAWING CODE/VAR *
Temp RoHS/Lead-Free?
Materials Analysis
MAX5055AASA  
SOIC;8E pin;31 mm²
Dwg: 21-0111D (PDF)
Use pkgcode/variation: S8E-14*
-40°C to +125°C RoHS/Lead-Free: No
Materials Analysis
MAX5055AASA-T  
SOIC;8E pin;31 mm²
Dwg: 21-0111D (PDF)
Use pkgcode/variation: S8E-14*
-40°C to +125°C RoHS/Lead-Free: No
Materials Analysis
MAX5055BASA  
SOIC;8 pin;31 mm²
Dwg: 21-0041B (PDF)
Use pkgcode/variation: S8-4*
-40°C to +125°C RoHS/Lead-Free: No
Materials Analysis
MAX5055BASA-T  
SOIC;8 pin;31 mm²
Dwg: 21-0041B (PDF)
Use pkgcode/variation: S8-4*
-40°C to +125°C RoHS/Lead-Free: No
Materials Analysis
MAX5055AASA+  
SOIC;8 pin;31 mm²
Dwg: 21-0111D (PDF)
Use pkgcode/variation: S8E+14*
-40°C to +125°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX5055AASA+T  
SOIC;8 pin;31 mm²
Dwg: 21-0111D (PDF)
Use pkgcode/variation: S8E+14*
-40°C to +125°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX5055BASA+  
SOIC;8 pin;31 mm²
Dwg: 21-0041B (PDF)
Use pkgcode/variation: S8+4*
-40°C to +125°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX5055BASA+T  
SOIC;8 pin;31 mm²
Dwg: 21-0041B (PDF)
Use pkgcode/variation: S8+4*
-40°C to +125°C RoHS/Lead-Free: Lead Free
Materials Analysis

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    Document Ref.: 19-3348; Rev 1; 2005-11-08
    This page last modified: 2005-11-14



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