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MAX3301E, MAX3302E
USB On-the-Go Transceivers and Charge Pumps

First ±15kV ESD-Protected USB On-the-Go Transceiver and Charge Pump


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Status
Active: In Production.

Data Sheet
FULL DATA SHEET (PDF, 628kB)
Download this datasheet in PDF formatDownload   Send this datasheet to any email addressE-Mail

Description
The MAX3301E/MAX3302E fully integrated USB On-the-Go (OTG) transceivers and charge pumps allow mobile devices such as PDAs, cellular phones, and digital cameras to interface directly with USB peripherals and each other without the need of a host PC. Use the MAX3301E/MAX3302E with an embedded USB host to directly connect to peripherals such as printers or external hard drives.

The MAX3301E/MAX3302E integrate a USB OTG transceiver, a VBUS charge pump, a linear regulator, and an I²C-compatible, 2-wire serial interface. An internal level shifter allows the MAX3301E/MAX3302E to interface with +1.65V to +3.6V logic supply voltages. The MAX3301E/MAX3302E's OTG-compliant charge pump operates with +3V to +4.5V input supply voltages, and supplies an OTG-compatible output on VBUS while sourcing more than 8mA of output current.

The MAX3301E/MAX3302E enable USB OTG communication from highly integrated digital devices that cannot supply or tolerate the +5V VBUS levels that USB OTG requires. The device supports USB OTG session-request protocol (SRP) and host-negotiation protocol (HNP).

The MAX3301E/MAX3302E provide built-in ±15kV electrostatic-discharge (ESD) protection for the VBUS, ID_IN, D+, and D- terminals. The MAX3301E/MAX3302E are available in 25-bump chip-scale (UCSP™), 25-bump WLP package, 28-pin TQFN, and 32-pin TQFN packages and operate over the extended -40°C to +85°C temperature range.

Key Features   Applications/Uses
  • USB 2.0-Compliant Full-/Low-Speed OTG Transceivers
  • Ideal for USB On-the-Go, Embedded Host, or Peripheral Devices
  • ±15kV ESD Protection on ID_IN, VBUS, D+, and D-Terminals
  • Charge Pump for VBUS Signaling and Operation Down to 3V
  • Internal VBUS and ID Comparators
  • Internal Switchable Pullup and Pulldown Resistors for Host/Peripheral Functionality
  • I²C Bus Interface with Command and Status Registers
  • Linear Regulator Powers Internal Circuitry and D+/D- Pullup Resistors
  • Supports SRP and HNP

 
  		• Digital Cameras
  		• Mobile Phones
  		• MP3 Players
  		• PDAs

    Key Specifications:  USB On-The-Go (OTG)
    Part Number VL
    (V)    		 ESD Protect.
    (±kV)    		 Internal OTG Charge Pump Internal Xcvr. VSUPPLY
    (V)    		 Package/Pins Smallest Available Pckg.
    (mm2)    		 Oper. Temp.
    (°C)    		 Price
    max w/pins See Notes
    MAX3302E  1.65 to 3.6 15 Yes No 3.0 to 4.5
    TQFN/28
    UCSP/25
    WLP/25
    		 7 -40 to +85 $1.50 @1k
    MAX3301E 
    TQFN/32
    UCSP/25
    		 $1.50 @1k
    See All USB On-The-Go (OTG) (4)

    Diagram
    MAX3301E, MAX3302E: Typical Operating Circuit
    Typical Operating Circuit

    Design Guides
  		• Interface (PDF)

    Reliability Reports
  		• Show FIT data for:
  		• Request Reliability Report for:

    Software/Models
  		• MAX3301E IBIS Model

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-9 of 9

    MAX3301E Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    MAX3301EETJ    
    		Active TQFN;32 pin;26 mm²
    Outline Drawing: 21-0140 (PDF)
    Land Pattern: 90-0012 (PDF)
    Use pkgcode/variation: T3255-4*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    MAX3301EETJ-T    
    		Active TQFN;32 pin;26 mm²
    Outline Drawing: 21-0140 (PDF)
    Land Pattern: 90-0012 (PDF)
    Use pkgcode/variation: T3255-4*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    MAX3301EETJ+  
    		Active TQFN;32 pin;26 mm²
    Outline Drawing: 21-0140 (PDF)
    Land Pattern: 90-0012 (PDF)
    Use pkgcode/variation: T3255+4*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    MAX3301EETJ+T    
    		Active TQFN;32 pin;26 mm²
    Outline Drawing: 21-0140 (PDF)
    Land Pattern: 90-0012 (PDF)
    Use pkgcode/variation: T3255+4*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    MAX3301EEBA-T    
    		Active UCSP;25 pin;7 mm²
    Outline Drawing: 21-0096 (PDF)
    Land Pattern: Not Available
    Use pkgcode/variation: B25-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    MAX3302E Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    MAX3302EETI+    
    		Active TQFN;28 pin;17 mm²
    Outline Drawing: 21-0139 (PDF)
    Land Pattern: 90-0035 (PDF)
    Use pkgcode/variation: T2844+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    MAX3302EETI+T    
    		Active

    Land Pattern: Not Available

    		-40°C to +85°C See data sheet
    MAX3302EEBA-T    
    		Active UCSP;25 pin;7 mm²
    Outline Drawing: 21-0096 (PDF)
    Land Pattern: Not Available
    Use pkgcode/variation: B25-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    MAX3302EEWA+T    
    		Active WLP;25 pin;7 mm²
    Outline Drawing: 21-0191 (PDF)
    Land Pattern: Not Available
    Use pkgcode/variation: W252A2+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis

    More Information
  		• New Product Press Release 2004-09-20 
  		• Product Ad: MAX3301

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    Document Ref.: 19-3275; Rev 3; 2008-03-07
    This page last modified: 2008-08-19


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