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Maxim > Products > [Real-Time Clocks] 
DS12CR887, DS12R885, DS12R887
RTC with Constant-Voltage Trickle Charger


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Status
Part Number Status
DS12CR887 Active: In Production. But some versions of the family are No Longer Available. See Ordering Information.
DS12R885 Active: In Production.
DS12R887 Active: In Production.

Data Sheet
FULL DATA SHEET (PDF, 340kB)
Download this datasheet in PDF formatDownload   Send this datasheet to any email addressE-Mail

Description
The DS12R885 is a functional drop-in replacement for the DS12885 real-time clock (RTC). The device provides an RTC/calendar, one time-of-day alarm, three maskable interrupts with a common interrupt output, a programmable square wave, and 114 bytes of battery-backed static RAM. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including correction for leap years. It also operates in either 24-hour or 12-hour format with an AM/PM indicator. A precision temperature-compensated circuit monitors the status of VCC. If a primary power failure is detected, the device automatically switches to a backup supply. The VBACKUP pin supports a rechargeable battery or a super cap and includes an integrated, always enabled trickle charger. The DS12R885 is accessed through a multiplexed byte-wide interface, which supports both Intel and Motorola modes. The DS12CR887 and DS12R887 integrate the DS12R885 die with a crystal and battery.

This product contains lithium-metal batteries. See applicable regulations for transport requirements for batteries in equipment.

Key Features   Applications/Uses
  • Trickle-Charge Capability for a Rechargeable Battery or Super Cap
  • Selectable Intel or Motorola Bus Timing
  • RTC Counts Seconds, Minutes, Hours, Day, Date, Month, and Year with Leap-Year Compensation to 2100
  • Interrupt Output with Three Independently Maskable Interrupt Flags
  • Time-of-Day Alarm is Once-per-Second to Once-per-Day
  • Periodic Rates from 122µs to 500ms
  • End-of-Clock Update Cycle Flag
  • 14 Bytes of Clock and Control Registers
  • 114 Bytes of General-Purpose Battery-Backed NV RAM with Clear Input
  • Programmable Square-Wave Output
  • Automatic Power-Fail Detect and Switch Circuitry
  • +5.0V or +3.3V Operation
  • Industrial Temperature Range
  • DS12CR887 Encapsulated DIP (EDIP) Module with Integrated Battery and Crystal
  • DS12R887 BGA Module Surface-Mountable Package with Integrated Crystal and Rechargeable Battery
  • Underwriters Laboratories (UL®) Recognized

  
  		• Embedded Systems
  		• Network Hubs, Switches, Routers
  		• Security Systems
  		• Utility Meters

    Key Specifications:  Timekeeping & Real-Time Clocks
    Part Number Date/ Time Format Interface VSUPPLY
    (V)    		 Time Keeping Current
    (nA)    		 CL
    (pF)    		 Memory Type Memory Size
    (Bytes)    		 Time of Day Alarms Price
    hh = sec/100 typ See Notes
    DS12CR887  YY-MM-DD/ HH:MM:SS Multiplexed
    3.3
    5
    		 - - NV SRAM 114 1 $3.08 @1k
    DS12R885  800 12.5 $1.53 @1k
    DS12R887  - - $4.33 @1k
    See All Timekeeping & Real-Time Clocks (80)

    Diagram
    DS12CR887, DS12R885, DS12R887: Typical Operating Circuit
    Typical Operating Circuit

    Application Notes
  		• Application Note 58: Crystal Considerations with Dallas Real-Time Clocks (RTCs) - DS12R885, DS12R885
  		• Application Note 504: Design Considerations for Dallas Semiconductor Real-Time Clocks - DS12R885
  		• Application Note 505: Lithium Coin-Cell Batteries: Predicting an Application Lifetime - DS12R885
  		• Application Note 516: Using Multiplexed Bus Clocks with a Microcontroller - DS12CR887, DS12R885, DS12R887
  		• Application Note 701: Using the DS32kHz with Dallas Real-Time Clocks - DS12R885
  		• Application Note 1145: Interface a Multiplexed-Bus Real-Time Clock to a µP With Separate Address and Data Buses - DS12CR887, DS12R885, DS12R887
  		• Application Note 3778: Problems and Solutions for Adjusting to Changes in Daylight Saving Time - DS12CR887, DS12R885, DS12R887
  		• Application Note 3779: Calculating ML Cell Life for an RTC Backup Operation - DS12CR887, DS12R885, DS12R887
  		• Application Note 3816: Selecting a Backup Source for Real-Time Clocks - DS12R885, DS12R885

    Design Guides
  		• Real-Time Clocks (PDF)
  		• System Timing & Control (PDF)

    Reliability Reports
  		• Reliability Report: DS12R885.pdf
  		• Request Reliability Report for:
  		• Underwriters Laboratories (UL®) Recognized

    Software/Models
    none

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-10 of 10

    DS12CR887 Free
    Sample    		 Buy Status Recommended Replacement
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS12CR887-33     N/A No Longer Available DS12CR887-33+
    		 EDIP;24 pin;545 mm²
    Outline Drawing: 21-0241 (PDF)
    Land Pattern: Not Available
    Use pkgcode/variation: MDP24-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS12CR887-5     N/A No Longer Available DS12CR887-5+
    		 EDIP;24 pin;545 mm²
    Outline Drawing: 21-0241 (PDF)
    Land Pattern: Not Available
    Use pkgcode/variation: MDP24-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS12CR887-33+  
    		Active
    		EDIP;24 pin;545 mm²
    Outline Drawing: 21-0241 (PDF)
    Land Pattern: Not Available
    Use pkgcode/variation: MDP24+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS12CR887-5+  
    		Active
    		EDIP;24 pin;545 mm²
    Outline Drawing: 21-0241 (PDF)
    Land Pattern: Not Available
    Use pkgcode/variation: MDP24+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS12R885 Free
    Sample    		 Buy Status Recommended Replacement
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS12R885S-33+  
    		Active
    		SOIC(W);24 pin;166 mm²
    Outline Drawing: 21-0042 (PDF)
    Land Pattern: 90-0182 (PDF)
    Use pkgcode/variation: W24+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS12R885S-33+T&R    
    		Active
    		SOIC(W);24 pin;166 mm²
    Outline Drawing: 21-0042 (PDF)
    Land Pattern: 90-0182 (PDF)
    Use pkgcode/variation: W24+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS12R885S-5+  
    		Active
    		SOIC(W);24 pin;166 mm²
    Outline Drawing: 21-0042 (PDF)
    Land Pattern: 90-0182 (PDF)
    Use pkgcode/variation: W24+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS12R885S-5+T&R    
    		Active
    		SOIC(W);24 pin;166 mm²
    Outline Drawing: 21-0042 (PDF)
    Land Pattern: 90-0182 (PDF)
    Use pkgcode/variation: W24+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS12R887 Free
    Sample    		 Buy Status Recommended Replacement
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS12R887-33  
    		Active
    		BGA;48 pin;181 mm²
    Outline Drawing: 21-0364 (PDF)
    Land Pattern: 90-0309 (PDF)
    Use pkgcode/variation: V48-H1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS12R887-5  
    		Active
    		BGA;48 pin;181 mm²
    Outline Drawing: 21-0364 (PDF)
    Land Pattern: 90-0309 (PDF)
    Use pkgcode/variation: V48-H1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis

    More Information
  		• RTC Calculator
  		• Product Ad: DS12R887

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    2007-03-20
    This page last modified: 2009-07-24


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