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Maxim > Products > [T/E Carrier and Packetized Communications] 
DS3181, DS3182, DS3183, DS3184
Single/Dual/Triple/Quad ATM/Packet PHYs with Built-In LIU

Industry's First Multiport, T3/E3 ATM/Packet PHYs with Built-In Line Interface Units


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Status
Active: In Production.

Data Sheet
FULL DATA SHEET (PDF, 3.6MB)
Download this datasheet in PDF formatDownload   Send this datasheet to any email addressE-Mail

Errata
  • Errata DS3181 318XA1.pdf 
  • Errata DS3182 318XA1.pdf 
  • Errata DS3183 318XA1.pdf 
  • Errata DS3184 318XA1.pdf 
  • Errata DS3184 318XA2.pdf 
  • Errata DS3183 318XA2.pdf 
  • Errata DS3182 318XA2.pdf 
  • Errata DS3181 318XA2.pdf 

    • Description
    The DS3181, DS3182, DS3183, and DS3184 (DS318x) integrate ATM cell/HDLC packet processor(s) with a DS3/E3 framer(s) and LIU(s) to map/demap ATM cells or packets into as many as four DS3/E3 physical copper lines with DS3-framed, E3-framed, or clear-channel data streams on per-port basis.

    An evaluation kit is available:  DS3184DK  

    Key Features   Applications/Uses
    • Single (DS3181), Dual (DS3182), Triple (DS3183), or Quad (DS3184) with Integrated LIUATM/Packet PHYs for DS3, E3, and Clear-Channel 52Mbps (CC52)
    • Pin Compatible for Ease of Port Density Migration in the Same PC Board Platform
    • Each Port Independently Configurable
    • Perform Receive Clock/Data Recovery and Transmit Waveshaping
    • Jitter Attenuator can be Placed Either in the Receive or Transmit Paths
    • Interfaces to 75Ω Coaxial Cable at Lengths Up 380 Meters or 1246 Feet (DS3) or 440 Meters or 1443 Feet (E3)
    • Uses 1:2 Transformers on Both Tx and Rx
    • Universal PHYs Map ATM Cells and/or HDLC Packets into DS3 or E3 Data Streams
    • UTOPIA L2/L3 or POS-PHY™ L2/L3 or SPI-3 Interface with 8-, 16-, or 32-Bit Bus Width
    • 66MHz UTOPIA L3 and POS-PHY L3 Clock
    • 52MHz UTOPIA L2 and POS-PHY L2 Clock
    • Ports Independently Configurable for Cell or Packet Traffic in POS-PHY Bus Modes
    • Direct, PLCP, DSS, and Clear-Channel Cell Mapping

    		 
  		• Access Concentrators
  		• ATM and Frame Relay Equipment
  		• Digital Cross Connect
  		• Integrated Access Device (IAD)
  		• Multiservice Access Platform (MSAP)
  		• Multiservice Protocol Platform (MSPP)
  		• PBXs
  		• PDH Multiplexer/Demultiplexer
  		• Routers and Switches
  		• SONET/SDH ADM
  		• SONET/SDH Muxes
  		• Test Equipment

    Key Specifications:  T/E Carrier & Packetized Products
    Part Number Transmission Standard Functions Channels VSUPPLY
    (V)    		 EV Kit Package/Pins Smallest Available Pckg.
    (mm2)    		 Price
    max w/pins See Notes
    DS3181 
    ATM
    T3/E3
    		 ATM/Packet Phy with LIU 1 3.3 -
    PBGA/400
    		 729 $45.00 @1k
    DS3182  2 -
    PBGA/400
    		 $85.50 @1k
    DS3183  3 -
    PBGA/400
    		 $124.20 @1k
    DS3184  4 Yes
    PBGA/400
    		 $140.00 @1k
    See All T/E Carrier & Packetized Products (102)

    Diagram
    DS3181, DS3182, DS3183, DS3184: Functional Diagram
    Functional Diagram

    Application Notes
  		• Application Note 351: T1/E1 and T3/E3 Transformer Selection Guide - DS3181, DS3182, DS3183, DS3184
  		• Application Note 3409: Configuration of CLAD for DS318x - DS3181, DS3182, DS3183, DS3184
  		• Application Note 3410: Guidelines for Laying Out T3 and E3 Network Interfaces - DS3181, DS3182, DS3183, DS3184
  		• Application Note 3547: Measuring Return Loss on T3/E3/STS-1 LIUs - DS3181, DS3182, DS3183, DS3184
  		• Application Note 3609: Clock-Rate-Adapter (CLAD) Features for DS325X, DS316X, DS317X, and DS318X - DS3181, DS3182, DS3183, DS3184
  		• Application Note 3670: Measuring Return Loss Using the Advantest R3132 Spectrum Analyzer - DS3181, DS3182, DS3183, DS3184
  		• Application Note 3763: Measuring and Improving Return Loss on the DS317x and DS318x T3/E3/STS-1 LIUs - DS3181, DS3182, DS3183, DS3184

    Evaluation Kits
  		• DS3184DK

    Design Guides
  		• Communications (PDF)

    Reliability Reports
  		• Reliability Report: DS3181.pdf DS3182.pdf DS3183.pdf DS3184.pdf

    Software/Models
  		• DS3181 A2 BSDL Model
  		• DS3181 IBIS Model
  		• DS3182 IBIS Model
  		• DS3182 A2 BSDL Model
  		• DS3183 A2 BSDL Model
  		• DS3183 IBIS Model
  		• DS3184 Cadence Concept Symbol
  		• DS3184 Cadence Allegro Symbol
  		• DS3184 IBIS Model
  		• DS3184 A2 BSDL Model
  		• DS3184 Logical Symbol-XML Format

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-11 of 11

    DS3181 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS3181    
    		Active PBGA;400 pin;729 mm²
    Outline Drawing: 21-0306 (PDF)
    Land Pattern: 90-0266 (PDF)
    Use pkgcode/variation: V400T-2*
    		0°C to +70°C See data sheet
    DS3181N    
    		Active PBGA;400 pin;729 mm²
    Outline Drawing: 21-0306 (PDF)
    Land Pattern: 90-0266 (PDF)
    Use pkgcode/variation: V400T-2*
    		-40°C to +85°C See data sheet
    DS3182 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS3182    
    		Active PBGA;400 pin;729 mm²
    Outline Drawing: 21-0306 (PDF)
    Land Pattern: 90-0266 (PDF)
    Use pkgcode/variation: V400T-2*
    		0°C to +70°C See data sheet
    DS3182N    
    		Active PBGA;400 pin;729 mm²
    Outline Drawing: 21-0306 (PDF)
    Land Pattern: 90-0266 (PDF)
    Use pkgcode/variation: V400T-2*
    		-40°C to +85°C See data sheet
    DS3182+  
    		Active PBGA;400 pin;729 mm²
    Outline Drawing: 21-0306 (PDF)
    Land Pattern: 90-0266 (PDF)
    Use pkgcode/variation: V400T+2*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3183 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS3183    
    		Active PBGA;400 pin;729 mm²
    Outline Drawing: 21-0306 (PDF)
    Land Pattern: 90-0266 (PDF)
    Use pkgcode/variation: V400T-2*
    		0°C to +70°C See data sheet
    DS3183N    
    		Active PBGA;400 pin;729 mm²
    Outline Drawing: 21-0306 (PDF)
    Land Pattern: 90-0266 (PDF)
    Use pkgcode/variation: V400T-2*
    		-40°C to +85°C See data sheet
    DS3184 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS3184  
    		Active PBGA;400 pin;729 mm²
    Outline Drawing: 21-0306 (PDF)
    Land Pattern: 90-0266 (PDF)
    Use pkgcode/variation: V400T-2*
    		0°C to +70°C See data sheet
    DS3184N    
    		Active PBGA;400 pin;729 mm²
    Outline Drawing: 21-0306 (PDF)
    Land Pattern: 90-0266 (PDF)
    Use pkgcode/variation: V400T-2*
    		-40°C to +85°C See data sheet
    DS3184+    
    		Active PBGA;400 pin;729 mm²
    Outline Drawing: 21-0306 (PDF)
    Land Pattern: 90-0266 (PDF)
    Use pkgcode/variation: V400T+2*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3184N+  
    		Active PBGA;400 pin;729 mm²
    Outline Drawing: 21-0306 (PDF)
    Land Pattern: 90-0266 (PDF)
    Use pkgcode/variation: V400T+2*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis

    More Information
  		• New Product Press Release 2004-03-26 

    Related Products
    DS3161, DS3162, DS3163, DS3164 Single/Dual/Triple/Quad ATM/Packet PHYs for DS3/E3/STS-1

    More Like This: View Product Families for Similar Products

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    •  QuickView   Technical Documents   Ordering Info   More Information  
     Description 
     Key Features 
     Applications/Uses 
     Key Specifications 
     Diagram 

    		 Data Sheet 
     Errata 
     Application Notes 
     Design Guides 
     Engineering Journals 
     Reliability Reports 
     Software/Models 
     Evaluation Kits 

    		 Price and Availability 
     Samples 
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    2006-12-14
    This page last modified: 2009-10-07


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