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Maxim > Products > [T/E Carrier and Packetized Communications] 
DS3151, DS3152, DS3153, DS3154
Single/Dual/Triple/Quad DS3/E3/STS-1 LIUs

Industry's Smallest Multichannel DS3/E3 and STS-1 LIUs


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Status
Active: In Production.

Data Sheet
FULL DATA SHEET (PDF, 696kB)
Download this datasheet in PDF formatDownload   Send this datasheet to any email addressE-Mail

Errata
  • Errata DS3151 315XA1.pdf 
  • Errata DS3152 315XA1.pdf 
  • Errata DS3153 315XA1.pdf 
  • Errata DS3154 315XA1.pdf 
  • Errata DS3151 315XB1.pdf 
  • Errata DS3152 315XA2.pdf 
  • Errata DS3153 315XA2.pdf 
  • Errata DS3154 315XA2.pdf 
  • Errata DS3151 315XA2.pdf 
  • Errata DS3152 315XB1.pdf 
  • Errata DS3153 315XB1.pdf 
  • Errata DS3154 315XB1.pdf 

    • Description
    The DS3151 (single), DS3152 (dual), DS3153 (triple), and DS3154 (quad) line interface units (LIUs) perform the functions necessary for interfacing at the physical layer to DS3, E3, or STS-1 lines. Each LIU has independent receive and transmit paths and a built-in jitter attenuator.

    An evaluation kit is available:  DS3154DK   DS3153DK  

    Key Features   Applications/Uses
    • Single, Dual, Triple, or Quad Integrated Transmitter, Receiver, and Jitter Attenuators for DS3, E3, and STS-1
    • Each Port Independently Configurable
    • Perform Receive Clock/Data Recovery and Transmit Waveshaping
    • Hardware or CPU Bus Configuration Options
    • Jitter Attenuators can be Placed in Either the Receive or Transmit Paths
    • Interface to 75Ω Coaxial Cable at Lengths Up to 380m (DS3), 440m (E3), or 360m (STS-1)
    • Use 1:2 Transformers on Tx and Rx
    • Require Minimal External Components
    • Local and Remote Loopbacks
    • Low-Power 3.3V Operation (5V Tolerant I/O)
    • Industrial Temperature Range: -40°C to +85°C
    • Small Package: 144-Pin, 13mm x 13mm Thermally Enhanced CSBGA
    • IEEE 1149.1 JTAG Support

    		 
  		• Access Concentrators
  		• ATM and Frame Relay Equipment
  		• Digital Cross-Connects
  		• DSLAMs
  		• PBXs
  		• Routers/Switches
  		• SONET/SDH and PDH Multiplexers
  		• Test Equipment

    Key Specifications:  T/E Carrier & Packetized Products
    Part Number Transmission Standard Functions Channels VSUPPLY
    (V)    		 EV Kit Package/Pins Smallest Available Pckg.
    (mm2)    		 Price
    max w/pins See Notes
    DS3154 
    STS-1
    T3/E3
    		 LIU 4 3.3 Yes
    TECSBGA/144
    		 169 $57.60 @1k
    DS3151  1 -
    TECSBGA/144
    		 $22.39 @1k
    DS3152  2 -
    TECSBGA/144
    		 $43.96 @1k
    DS3153  3 Yes
    TECSBGA/144
    		 $48.00 @1k
    See All T/E Carrier & Packetized Products (102)

    Diagram
    DS3151, DS3152, DS3153, DS3154: Functional Diagram
    Functional Diagram

    Application Notes
  		• Application Note 351: T1/E1 and T3/E3 Transformer Selection Guide - DS3154, DS3151, DS3153, DS3152
  		• Application Note 397: Pulse Template Measurement - DS3151, DS3153, DS3152, DS3154
  		• Application Note 398: T3/E3/STS-1 LIU Secondary Surge Protection Design - DS3151, DS3153, DS3152, DS3154
  		• Application Note 404: Modifying the E3 Template Compliance of the DS3150, DS315x and DS325x - DS3153, DS3151, DS3152, DS3154
  		• Application Note 1797: Measuring Telecom Systems Against a Pulse Mask Template - DS3154
  		• Application Note 2696: Redundancy Protection for T3/E3/STS-1 Networks - DS3153, DS3151, DS3152, DS3154
  		• Application Note 2877: Modifying the pulse shape of DS315x using Test Registers - DS3151, DS3153, DS3152, DS3154
  		• Application Note 2931: HFTA-09.0: T3/E3/STS-1 Fiber Optic Extension - DS3154, DS3151, DS3153, DS3152
  		• Application Note 3111: Interfacing the DS3144 Framer with the DS3154 LIU - DS3154, DS3151, DS3153, DS3152
  		• Application Note 3131: Connecting the Agere Ultramapper Device Family to Dallas T3/E3 LIUs - DS3154, DS3153, DS3151, DS3152
  		• Application Note 3263: Connecting the Agere Supermapper™ Device Family to Dallas T3 LIUs - DS3151, DS3153, DS3152, DS3154
  		• Application Note 3410: Guidelines for Laying Out T3 and E3 Network Interfaces - DS3152, DS3151, DS3153, DS3154
  		• Application Note 3547: Measuring Return Loss on T3/E3/STS-1 LIUs - DS3152, DS3154, DS3151, DS3153
  		• Application Note 3556: Configuring Dallas Semiconductor LIUs Without a Microcontroller - DS3154, DS3151, DS3153, DS3152
  		• Application Note 3670: Measuring Return Loss Using the Advantest R3132 Spectrum Analyzer - DS3151, DS3153, DS3154, DS3152

    Evaluation Kits
  		• DS3154DK
  		• DS3153DK

    Design Guides
  		• Communications (PDF)

    Reliability Reports
  		• Reliability Report: DS3151.pdf DS3152.pdf DS3153.pdf DS3154.pdf

    Software/Models
  		• Request Driver Code
  		• DS3151 IBIS Model
  		• DS3151 B BSDL Model
  		• DS3151 A BSDL Model
  		• DS3151 B1 BSDL Model
  		• DS3152 A BSDL Model
  		• DS3152 B BSDL Model
  		• DS3152 B1 BSDL Model
  		• DS3152 IBIS Model
  		• DS3153 B1 BSDL Model
  		• DS3153 A BSDL Model
  		• DS3153 B BSDL Model
  		• DS3153 IBIS Model
  		• DS3154 IBIS Model
  		• DS3154 A BSDL Model
  		• DS3154 Cadence Allegro Symbol
  		• DS3154 Cadence Concept Symbol
  		• DS3154 B BSDL Model
  		• DS3154 Logical Symbol-XML Format
  		• DS3154 B1 BSDL Model

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-19 of 19

    DS3151 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS3151  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS3151N  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3151+    
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3151N+  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3152 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS3152B1    
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS3152  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS3152N  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3152+  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3152N+  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3153 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS3153N#    
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3153    
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS3153N    
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3153+  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3153N+  
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3154 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS3154N#    
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3154    
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS3154N    
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T-1*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3154+    
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3154N+    
    		Active TECSBGA;144 pin;169 mm²
    Outline Drawing: 21-0314 (PDF)
    Land Pattern: 90-0270 (PDF)
    Use pkgcode/variation: X144T+1*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis

    More Information
  		• New Product Press Release 2003-04-14 

    Related Products
    DS3112 TEMPE T3 E3 Multiplexer, 3.3V T3/E3 Framer and M13/E13/G.747 MUX
    DS3150 3.3V, DS3/E3/STS-1 Line Interface Unit
    DS3141, DS3142, DS3143, DS3144 Single/Dual/Triple/Quad DS3/E3 Framers

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    •  QuickView   Technical Documents   Ordering Info   More Information  
     Description 
     Key Features 
     Applications/Uses 
     Key Specifications 
     Diagram 

    		 Data Sheet 
     Errata 
     Application Notes 
     Design Guides 
     Engineering Journals 
     Reliability Reports 
     Software/Models 
     Evaluation Kits 

    		 Price and Availability 
     Samples 
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    2007-03-09
    This page last modified: 2009-10-06


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