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Status

Active: In Production.

Data Sheet

FULL DATA SHEET (PDF, 240kB) Download   E-Mail

Description

The DS1337 serial real-time clock is a low-power clock/calendar with two programmable time-of-day alarms and a programmable square-wave output. Address and data are transferred serially through an I²C bus. The clock/calendar provides seconds, minutes, hours, day, date, month, and year information. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either the 24-hour or 12-hour format with AM/PM indicator. The device is fully accessible through the serial interface while VCC is between 1.8V and 5.5V. I²C operation is not guaranteed below 1.8V. Timekeeping operation is maintained with VCC as low as 1.3V.

Key Features		Applications/Uses
Real-Time Clock (RTC) Counts Seconds, Minutes, Hours, Day, Date, Month, and Year with Leap-Year Compensation Valid Up to 2100 Available in a Surface-Mount Package with an Integrated Crystal (DS1337C) I²C Serial Interface Two Time-of-Day Alarms Oscillator Stop Flag Programmable Square-Wave Output Defaults to 32kHz on Power-Up Available in 8-Pin DIP, SO, or µSOP -40°C to +85°C Operating Temperature Range		Consumer Electronics (Set-Top Box, VCR/Digital Recording) Handhelds (GPS, POS Terminal, MP3 Player) Medical (Glucometer, Medicine Dispenser) Office Equipment (Fax/Printer, Copier) Other (Utility Meter, Vending Machine, Thermostat, Modem) Telecommunications (Router, Switcher, Server)

Diagram

Typical Operating Circuit

Application Notes

Application Note 58: Crystal Considerations with Dallas Real-Time Clocks (RTCs) - DS1337, DS1337 Application Note 504: Design Considerations for Dallas Semiconductor Real-Time Clocks - DS1337 Application Note 505: Lithium Coin-Cell Batteries: Predicting an Application Lifetime - DS1337 Application Note 701: Using the DS32kHz with Dallas Real-Time Clocks - DS1337 Application Note 3300: Interfacing I²C Serial Real-Time Clocks to a Microcontroller - DS1337 Application Note 3572: FAQ About the Integrated-Crystal Package Option - DS1337 Application Note 3816: Selecting a Backup Source for Real-Time Clocks - DS1337, DS1337 Application Note 3921: Using a DS1307 with a PIC Microcontroller - DS1337

Design Guides

Real-Time Clocks (PDF)

Reliability Reports

Reliability Report: DS1337.pdf DS1337C.pdf

Software/Models

none

Ordering Information

Notes: Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.

Devices: 1-14 of 14

DS1337	Free Sample	Buy	Status	Package: TYPE PINS FOOTPRINT   DRAWING CODE/VAR *	Temp	RoHS/Lead-Free? Materials Analysis
DS1337			Active	PDIP(N);8 pin;79.7 mm² Outline Drawing: 21-0043 (PDF) Land Pattern: Not Available Use pkgcode/variation: P8-8*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
DS1337+			Active	PDIP(N);8 pin;79.7 mm² Outline Drawing: 21-0043 (PDF) Land Pattern: Not Available Use pkgcode/variation: P8+8*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
DS1337S			Active	SOIC(N);8 pin;30.9 mm² Outline Drawing: 21-0041 (PDF) Land Pattern: 90-0096 (PDF) Use pkgcode/variation: S8-2*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
DS1337S/T&R			Active	SOIC(N);8 pin;30.9 mm² Outline Drawing: 21-0041 (PDF) Land Pattern: 90-0096 (PDF) Use pkgcode/variation: S8-2*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
DS1337S+			Active	SOIC(N);8 pin;30.9 mm² Outline Drawing: 21-0041 (PDF) Land Pattern: 90-0096 (PDF) Use pkgcode/variation: S8+2*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
DS1337S+T&R			Active	SOIC(N);8 pin;30.9 mm² Outline Drawing: 21-0041 (PDF) Land Pattern: 90-0096 (PDF) Use pkgcode/variation: S8+2*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
DS1337U			Active	µMAX;8 pin;16.2 mm² Outline Drawing: 21-0036 (PDF) Land Pattern: 90-0092 (PDF) Use pkgcode/variation: U8-1*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
DS1337U/T&R			Active	µMAX;8 pin;16.2 mm² Outline Drawing: 21-0036 (PDF) Land Pattern: 90-0092 (PDF) Use pkgcode/variation: U8-1*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
DS1337U+			Active	µMAX;8 pin;16.2 mm² Outline Drawing: 21-0036 (PDF) Land Pattern: 90-0092 (PDF) Use pkgcode/variation: U8+1*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
DS1337U+T&R			Active	µMAX;8 pin;16.2 mm² Outline Drawing: 21-0036 (PDF) Land Pattern: 90-0092 (PDF) Use pkgcode/variation: U8+1*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
DS1337C	Free Sample	Buy	Status	Package: TYPE PINS FOOTPRINT   DRAWING CODE/VAR *	Temp	RoHS/Lead-Free? Materials Analysis
DS1337C			Active	SOIC(W);16 pin;110.6 mm² Outline Drawing: 21-0042 (PDF) Land Pattern: 90-0107 (PDF) Use pkgcode/variation: W16-H2*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
DS1337C/T&R			Active	SOIC(W);16 pin;110.6 mm² Outline Drawing: 21-0042 (PDF) Land Pattern: 90-0107 (PDF) Use pkgcode/variation: W16-H2*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
DS1337C#			Active	SOIC(W);16 pin;110.6 mm² Outline Drawing: 21-0042 (PDF) Land Pattern: 90-0107 (PDF) Use pkgcode/variation: W16#H2*	-40°C to +85°C	RoHS/Lead-Free: RoHS Qualified Materials Analysis
DS1337C#T&R			Active	SOIC(W);16 pin;110.6 mm² Outline Drawing: 21-0042 (PDF) Land Pattern: 90-0107 (PDF) Use pkgcode/variation: W16#H2*	-40°C to +85°C	RoHS/Lead-Free: RoHS Qualified Materials Analysis

More Information

New Product Press Release 2004-09-17  RTC Calculator

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Description   Key Features   Applications/Uses   Key Specifications   Diagram

Data Sheet   Application Notes   Design Guides   Engineering Journals   Reliability Reports   Software/Models   Evaluation Kits

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