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Data Sheet

FULL DATA SHEET (PDF, 460kB) Download   E-Mail

Description

The MAX3273 is a compact, low-power laser driver for applications up to 2.7Gbps. The device uses a single +3.3V supply and typically consumes 30mA. The bias and modulation current levels are programmed by external resistors. An automatic power-control (APC) loop is incorporated to maintain a constant average optical power over temperature and lifetime. The laser driver is fabricated using Maxim's in-house, second-generation SiGe process. The MAX3273 accepts differential CML-compatible clock and data input signals. Inputs are self-biased to allow AC-coupling. An input data-retiming latch can be enabled to reject input jitter if a clock signal is available. The driver can provide bias current up to 100mA and modulation current up to 60mAP-P with typical (20% to 80%) edge speeds of 59ps. A failure-monitor output is provided to indicate when the APC loop is unable to maintain average optical power. The MAX3273 is available in 4mm x 4mm, 24-pin QFN and thin QFN packages, as well as in die form.

Key Features		Applications/Uses
30mA Power-Supply Current Single +3.3V Power Supply Up to 2.7Gbps (NRZ) Operation Automatic Average Power Control with Failure Monitor Programmable Modulation Current from 5mA to 60mA Programmable Bias Current from 1mA to 100mA Typical Fall Time of 59ps Selectable Data Retiming Latch Complies with ANSI, ITU, and Bellcore SDH/SONET Specifications		2.5Gbps Optical Transmitters Add/Drop Multiplexers Digital Cross-Connects SONET OC-48 and SDH STM-16 Transmission Systems

Diagram

Typical Operating Circuit

Application Notes

Application Note 274: HFAN-02.0: Interfacing Maxim Laser Drivers With Laser Diodes - MAX3273, MAX3273 Application Note 697: Silicon Germanium (SiGe) Technology Enhances Radio Front-End Performance - MAX3273 Application Note 985: HFAN-09.0.2: Optical Signal-to-Noise Ratio and the Q-Factor in Fiber-Optic Communications Systems - MAX3273 Application Note 995: MAX3892: 2.7Gbps Transponder Applications Using the MAX3892, MAX3882, and MAX3670 Chipset - MAX3273 Application Note 1102: HFAN-09.0.3: APON Class A, B, & C Physical Layer Requirements - MAX3273 Application Note 1794: Interfacing Digitally Controlled Pots and Resistors to Laser Drivers - MAX3273

Evaluation Kits

MAX3273EVKIT

Design Guides

FIBER (PDF)

Reliability Reports

Show FIT data for: MAX3273 Reliability Report: MAX3273EGG.pdf

Software/Models

MAX3273EGG IBIS Model MAX3273EGG SPICE Input/Output Model

Ordering Information
Notes: Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day. Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.
Devices: 1-5 of 5
MAX3273	Free Sample	Buy	Package: TYPE PINS FOOTPRINT   DRAWING CODE/VAR *	Temp	RoHS/Lead-Free? Materials Analysis
MAX3273E/D			DICE SALES;0 pin; Use pkgcode/variation: DICE*		See data sheet
MAX3273EGG			QFN;24 pin;16 mm² Dwg: 21-0106F (PDF) Use pkgcode/variation: G2444-1*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
MAX3273EGG-T			QFN;24 pin;16 mm² Dwg: 21-0106F (PDF) Use pkgcode/variation: G2444-1*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
MAX3273ETG+			THIN QFN;24 pin;17 mm² Dwg: 21-0139H (PDF) Use pkgcode/variation: T2444+2*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
MAX3273ETG+T			THIN QFN;24 pin;17 mm² Dwg: 21-0139H (PDF) Use pkgcode/variation: T2444+2*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis

Notes and Comments

This part is covered by U.S. patent number 5,883,910.

More Information

New Product Press Release 2001-10-02

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Description   Key Features   Applications/Uses   Key Specifications   Diagram

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