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Maxim > Products > [T/E Carrier and Packetized Communications] 
DS3150
3.3V, DS3/E3/STS-1 Line Interface Unit

Industry's First Single-Port T3/E3 LIU with Fully Integrated Jitter Attenuator


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Status
Active: In Production.

Data Sheet
FULL DATA SHEET (PDF, 716kB)
Download this datasheet in PDF formatDownload   Send this datasheet to any email addressE-Mail

Errata
  • Errata DS3150 3150B2.pdf 
  • Errata DS3150 3150B3.pdf 
  • Errata DS3150 3150B4.pdf 
  • Errata DS3150 3150C1.pdf 

    • Description
    The DS3150 performs all the functions necessary for interfacing at the physical layer to DS3, E3, and STS-1 lines. The receiver performs clock and data recovery, B3ZS/HDB3 decoding, and loss-of-signal monitoring. The transmitter encodes outgoing data and drives standards-compliant waveforms onto 75Ω coaxial cable. The jitter attenuator can be mapped into the receive path or the transmit path.

    An evaluation kit is available:  DS3150DK  

    Key Features   Applications/Uses
    • Integrated Transmitter, Receiver, and Jitter Attenuator for DS3, E3, and STS-1
    • Performs Receive Clock/Data Recovery and Transmit Waveshaping
    • Jitter Attenuator Can Be Placed in the Receive Path or the Transmit Path
    • AGC/Equalizer Block Handles from 0dB to 15dB of Cable Loss
    • Interfaces to 75Ω Coaxial Cable at Lengths Up to 380m (DS3), 440m (E3), or 360m (STS-1)
    • Interfaces Directly to a DSX Monitor Signal (20dB Flat Loss) Using Built-In Preamp
    • Built-In B3ZS and HDB3 Encoder/Decoder
    • Bipolar and NRZ Interfaces
    • Local and Remote Loopbacks
    • On-Board 215 - 1 and 223 - 1 Pseudorandom Bit Sequence (PRBS) Generator and Detector
    • Line Build-Out (LBO) Control
    • Transmit Line-Driver Monitor Checks for a Faulty Transmitter or a Shorted Output
    • Complete DS3 AIS Generator (ANSI T1.107)
    • Unframed All-Ones Generator (E3 AIS)
    • Clock Inversion for Glueless Interfacing
    • Tri-State Line Driver for Low-Power Mode and Protection Switching Applications
    • Loss-of-Signal (LOS) Detector (ANSI T1.231 and ITU G.775)
    • Automatic Data Squelching During LOS
    • Requires Minimal External Components
    • Drop-In Replacement for TDK 78P2241/B and 78P7200L (Refer to Application Note 362)
    • Pin Compatible with TDK 78P7200
    • 3.3V Operation (5V Tolerant I/O), 110mA (max)
    • Industrial Temperature Range: -40°C to +85°C
    • Small Packaging: 28-Pin PLCC and 48-Pin TQFP

    		 
  		• Access Concentrators
  		• ATM and Frame Relay Equipment
  		• CSUs/DSUs
  		• Digital Cross-Connects
  		• DSLAMs
  		• PBXs
  		• Routers
  		• SONET/SDH and PDH Multiplexers

    Key Specifications:  T/E Carrier & Packetized Products
    Part Number Transmission Standard Functions Channels VSUPPLY
    (V)    		 EV Kit Package/Pins Smallest Available Pckg.
    (mm2)    		 Price
    max w/pins See Notes
    DS3150 
    STS-1
    T3/E3
    		 LIU 1 3.3 Yes
    PLCC/28
    TQFP/48
    		 85 $15.50 @1k
    See All T/E Carrier & Packetized Products (102)

    Diagram
    DS3150: Functional Diagram
    Functional Diagram

    Application Notes
  		• Application Note 351: T1/E1 and T3/E3 Transformer Selection Guide - DS3150
  		• Application Note 362: Replacing the TDK 78P7200/2241 with the DS3150 Line Interface Unit - DS3150
  		• Application Note 398: T3/E3/STS-1 LIU Secondary Surge Protection Design - DS3150
  		• Application Note 404: Modifying the E3 Template Compliance of the DS3150, DS315x and DS325x - DS3150
  		• Application Note 2696: Redundancy Protection for T3/E3/STS-1 Networks - DS3150
  		• Application Note 2931: HFTA-09.0: T3/E3/STS-1 Fiber Optic Extension - DS3150
  		• Application Note 3131: Connecting the Agere Ultramapper Device Family to Dallas T3/E3 LIUs - DS3150
  		• Application Note 3263: Connecting the Agere Supermapper™ Device Family to Dallas T3 LIUs - DS3150
  		• Application Note 3344: DS31256 -- T3/E3 MUX/DS3112 Hardware Connections - DS3150
  		• Application Note 3345: Examples of DS31256 Applications - DS3150
  		• Application Note 3351: T3/E3/STS-1 Low Cost Repeater - DS3150
  		• Application Note 3410: Guidelines for Laying Out T3 and E3 Network Interfaces - DS3150
  		• Application Note 3547: Measuring Return Loss on T3/E3/STS-1 LIUs - DS3150
  		• Application Note 3556: Configuring Dallas Semiconductor LIUs Without a Microcontroller - DS3150
  		• Application Note 3670: Measuring Return Loss Using the Advantest R3132 Spectrum Analyzer - DS3150

    Evaluation Kits
  		• DS3150DK

    Design Guides
  		• Communications (PDF)

    Reliability Reports
  		• Reliability Report: DS3150.pdf

    Software/Models
  		• DS3150Q IBIS Model
  		• DS3150T IBIS Model
  		• DS3150 Cadence Allegro Symbol
  		• DS3150 Cadence Concept Symbol
  		• DS3150 Logical Symbol-XML Format

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-19 of 19

    DS3150 Free
    Sample    		 Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    		Temp RoHS/Lead-Free?
    Materials Analysis
    DS3150QC1+  
    		Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28+3*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3150Q+T&R    
    		Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28+3*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3150QNC1+  
    		Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28+3*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3150QNC1  
    		Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28-3*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3150QNC1/T&R    
    		Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28-3*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3150QNC1+T&R    
    		Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28+3*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3150Q  
    		Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28-3*
    		0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS3150Q+  
    		Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28+3*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3150QN  
    		Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28-3*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3150QN+  
    		Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28+3*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3150TC1  
    		Active TQFP;48 pin;85 mm²
    Outline Drawing: 21-0054 (PDF)
    Land Pattern: 90-0093 (PDF)
    Use pkgcode/variation: C48-3*
    		0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS3150TC1+  
    		Active TQFP;48 pin;85 mm²
    Outline Drawing: 21-0054 (PDF)
    Land Pattern: 90-0093 (PDF)
    Use pkgcode/variation: C48+3*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3150TNC1+  
    		Active TQFP;48 pin;85 mm²
    Outline Drawing: 21-0054 (PDF)
    Land Pattern: 90-0093 (PDF)
    Use pkgcode/variation: C48+3*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3150TN1    
    		Active TQFP;48 pin;85 mm²
    Outline Drawing: 21-0054 (PDF)
    Land Pattern: 90-0093 (PDF)
    Use pkgcode/variation: C48-3*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3150TNC1    
    		Active TQFP;48 pin;85 mm²
    Outline Drawing: 21-0054 (PDF)
    Land Pattern: 90-0093 (PDF)
    Use pkgcode/variation: C48-3*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3150T  
    		Active TQFP;48 pin;85 mm²
    Outline Drawing: 21-0054 (PDF)
    Land Pattern: 90-0093 (PDF)
    Use pkgcode/variation: C48-3*
    		0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS3150T+  
    		Active TQFP;48 pin;85 mm²
    Outline Drawing: 21-0054 (PDF)
    Land Pattern: 90-0093 (PDF)
    Use pkgcode/variation: C48+3*
    		0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3150TN  
    		Active TQFP;48 pin;85 mm²
    Outline Drawing: 21-0054 (PDF)
    Land Pattern: 90-0093 (PDF)
    Use pkgcode/variation: C48-3*
    		-40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS3150TN+  
    		Active TQFP;48 pin;85 mm²
    Outline Drawing: 21-0054 (PDF)
    Land Pattern: 90-0093 (PDF)
    Use pkgcode/variation: C48+3*
    		-40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis

    More Information
  		• New Product Press Release 2002-04-05 
  		• Demo Kit: DS3150DK

    Related Products
    DS3112 TEMPE T3 E3 Multiplexer, 3.3V T3/E3 Framer and M13/E13/G.747 MUX
    DS3141, DS3142, DS3143, DS3144 Single/Dual/Triple/Quad DS3/E3 Framers
    DS3151, DS3152, DS3153, DS3154 Single/Dual/Triple/Quad DS3/E3/STS-1 LIUs

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    •  QuickView   Technical Documents   Ordering Info   More Information  
     Description 
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     Key Specifications 
     Diagram 

    		 Data Sheet 
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     Design Guides 
     Engineering Journals 
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    2005-07-15
    This page last modified: 2009-10-15


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