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DS3112
TEMPE T3 E3 Multiplexer, 3.3V T3/E3 Framer and M13/E13/G.747 MUX


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Data Sheet
FULL DATA SHEET (PDF, 2.4MB)
Download this datasheet in PDF formatDownload   Send this datasheet to any email addressE-Mail


Errata
  • Errata DS3112 3112B2.pdf 
  • Errata DS3112 3112C1.pdf 
  • Errata DS3112 3112A1.pdf 
  • Description
    The DS3112 T3/E3 Multiplex-Framer contains all the digital logic required to communicate over T3 and E3 transmission lines. Supporting both channelized and unchannelized operation, the DS3112 enables low-cost T3/E3 linecards that can be deployed in a variety of voice and data applications worldwide.

    Key Features   Applications/Uses
    • Five Operating Modes
      • M13 multiplexing (28 T1s to DS3)
      • E13 multiplexing (16 E1s to E3)
      • G.747 multiplexing (21 E1s to DS3)
      • Unchannelized DS3 framing
      • Unchannelized E3 framing
    • M13 or C-Bit Parity DS3 framing
    • G.751 E3 framing
    • Alarm generation and detection
    • HDLC controller with 256-byte FIFOs
    • FEAC controller
    • BERT (Bit Error Rate Tester)
    • Two T1/E1 add/drop ports
    • 27mm x 27mm 256-lead BGA package

     
  • Access Concentrators
  • ATM and Frame Relay Equipment
  • Digital Cross-Connects
  • PBXs
  • Routers/Switches
  • SONET/SDH and PDH Multiplexers
  • Test Equipment

    Key Specifications:   T/E Carrier & Packetized Products
    Part Number Transmission Standard Functions Number of Channels Supply Voltage (V) RoHS Available Package Smallest Available Package (max w/pins) (mm2) Price**
    DS3112  T3/E3
    Multiplexer-Framer
    1 3.3 Yes PBGA/256 729 $68.00 @ 1k
    See All T/E Carrier & Packetized Products (102)
    Notes:
    **This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific prices and delivery, please see the price and availability page or contact an authorized distributor.

    Diagram
    DS3112: Functional Diagram
    Functional Diagram

    Application Notes
  • Application Note 378: DS3112 Clock Rates and Frequency Tolerances of the Transmit Clock - DS3112
  • Application Note 3344: DS31256 -- T3/E3 MUX/DS3112 Hardware Connections - DS3112
  • Application Note 3345: Examples of DS31256 Applications - DS3112
  • Application Note 3705: DS3112 LRCLKx Low Speed Clock Recovery Operation - DS3112
  • Application Note 3760: Interleaved Bus Operation - DS3112

    Evaluation Kits
  • DS3112RD

    Design Guides
  • Communications (PDF)

    Reliability Reports
  • Reliability Report: DS3112.pdf

    Software/Models
  • DS3112 IBIS Model
  • DS3112 BSDL Model
  • DS3112 Cadence Allegro Symbol
  • DS3112 Cadence Concept Symbol
  • DS3112 Logical Symbol-XML Format

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-7 of 7

    DS3112 Free
    Sample
    Buy
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    DS3112D1+  
    PBGA;256 pin;729 mm²
    Outline Drawing: 21-0303 (PDF)
    Land Pattern: 90-0263 (PDF)
    Use pkgcode/variation: V256+1*
    0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3112+  
    PBGA;256 pin;729 mm²
    Outline Drawing: 21-0303 (PDF)
    Land Pattern: 90-0263 (PDF)
    Use pkgcode/variation: V256+1*
    0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3112N+  
    PBGA;256 pin;729 mm²
    Outline Drawing: 21-0303 (PDF)
    Land Pattern: 90-0263 (PDF)
    Use pkgcode/variation: V256+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS3112DK    


    Land Pattern: Not Available

    0°C to +70°C See data sheet
    DS3112D1  
    PBGA;256 pin;729 mm²
    Outline Drawing: 21-0303 (PDF)
    Land Pattern: 90-0263 (PDF)
    Use pkgcode/variation: V256-1*
    0°C to +70°C See data sheet
    DS3112  
    PBGA;256 pin;729 mm²
    Outline Drawing: 21-0303 (PDF)
    Land Pattern: 90-0263 (PDF)
    Use pkgcode/variation: V256-1*
    0°C to +70°C See data sheet
    DS3112N  
    PBGA;256 pin;729 mm²
    Outline Drawing: 21-0303 (PDF)
    Land Pattern: 90-0263 (PDF)
    Use pkgcode/variation: V256-1*
    -40°C to +85°C See data sheet

    More Information
  • New Product Press Release 2001-05-09 
  • Reference Design: DS3112RD
  • Device Driver
  • Trunk Management Code

    Related Products
    DS3150 3.3V, DS3/E3/STS-1 Line Interface Unit
    DS3141, DS3142, DS3143, DS3144 Single/Dual/Triple/Quad DS3/E3 Framers
    DS3151, DS3152, DS3153, DS3154 Single/Dual/Triple/Quad DS3/E3/STS-1 LIUs

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    2006-09-29
    This page last modified: 2009-05-12


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