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Part Number	Status
DS2409	This product is Not Recommended for New Designs. See Ordering Information for recommended replacements.

Data Sheet

FULL DATA SHEET (PDF, 428kB) Download   E-Mail

Description

The MicroLAN coupler is an essential component to build and control 1-Wire® networks with multi-level branching. In contrast to approaches that switch the ground line, the coupler maintains a common ground level for the whole network and keeps the inactive segments powered. This simplifies supplying central or local power for additional circuitry and prevents loss of status of parasitically powered devices. It also avoids disrupting communication caused by the parasitic power supply of 1-Wire devices after activating a branch. Both the main and the auxiliary 1-Wire output are supported by a smart-on command. This command generates a reset/presence sequence on the selected output before the electronic switch closes the contact to the 1-Wire bus. This way the bus master can apply a ROM function command (optionally followed by a memory function) to the devices on the just activated segment with all other devices in the network remaining deselected. This significantly speeds up the analysis of topology and population in a continuously changing network. The coupler also supports the bus master in detecting arrivals on the inactive segments of the network by responding to the conditional search command.

Key Features

Low impedance coupler to create large common-ground, multi-level 1-Wire networks Keeps inactive branches pulled high to 5V Simplifies network topology analysis by logically decoupling devices on active network segments Conditional search for fast-event signaling Auxiliary 1-Wire line to connect a memory chip or to be used as digital input Programmable, general-purpose open-drain control output Communicates at 16.3kbps Unique, factory-lasered and tested 64-bit registration number assures absolute traceability because no two parts are alike Built-in multidrop controller ensures compatibility with other 1-Wire products Operating temperature range from -40°C to +85°C Compact, low-cost 6-pin TSOC surface mount package

Application Notes

Application Note 74: Reading and Writing 1-Wire® Devices Through Serial Interfaces - DS2409 Application Note 155: 1-Wire® Software Resource Guide Device Description - DS2409 Application Note 2965: 1-Wire® Master Device Configuration - DS2409

Design Guides

1-Wire® Products (PDF)

Reliability Reports

Reliability Report: DS2409.pdf

Software/Models

none

Ordering Information

Notes: Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.

Devices: 1-4 of 4

DS2409	Free Sample	Buy	Status	Recommended Replacement	Package: TYPE PINS FOOTPRINT   DRAWING CODE/VAR *	Temp	RoHS/Lead-Free? Materials Analysis
DS2409P/T&R		N/A	No Longer Available	DS2409P+	TSOC;6 pin;17.8 mm² Outline Drawing: 21-0382 (PDF) Land Pattern: 90-0321 (PDF) Use pkgcode/variation: D6-1*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
DS2409P		N/A	No Longer Available	DS2409P+	TSOC;6 pin;17.8 mm² Outline Drawing: 21-0382 (PDF) Land Pattern: 90-0321 (PDF) Use pkgcode/variation: D6-1*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
DS2409P+			NRND		TSOC;6 pin;17.8 mm² Outline Drawing: 21-0382 (PDF) Land Pattern: 90-0321 (PDF) Use pkgcode/variation: D6+1*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
DS2409P+T&R			NRND		TSOC;6 pin;17.8 mm² Outline Drawing: 21-0382 (PDF) Land Pattern: 90-0321 (PDF) Use pkgcode/variation: D6+1*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis

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