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DS2409
MicroLAN Coupler

Not Recommended for New Designs
Part Number Replacement Explanation
DS2409 n/a This part remains available but is not recommended for new designs.
DS2409P+ n/a
DS2409P n/a
DS2409P+T&R n/a
DS2409P/T&R n/a


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Data Sheet
FULL DATA SHEET (PDF, 428kB)
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Description
The MicroLAN coupler is an essential component to build and control 1-Wire® networks with multi-level branching. In contrast to approaches that switch the ground line, the coupler maintains a common ground level for the whole network and keeps the inactive segments powered. This simplifies supplying central or local power for additional circuitry and prevents loss of status of parasitically powered devices. It also avoids disrupting communication caused by the parasitic power supply of 1-Wire devices after activating a branch. Both the main and the auxiliary 1-Wire output are supported by a smart-on command. This command generates a reset/presence sequence on the selected output before the electronic switch closes the contact to the 1-Wire bus. This way the bus master can apply a ROM function command (optionally followed by a memory function) to the devices on the just activated segment with all other devices in the network remaining deselected. This significantly speeds up the analysis of topology and population in a continuously changing network. The coupler also supports the bus master in detecting arrivals on the inactive segments of the network by responding to the conditional search command.

Key Features
  • Low impedance coupler to create large common-ground, multi-level 1-Wire networks
  • Keeps inactive branches pulled high to 5V
  • Simplifies network topology analysis by logically decoupling devices on active network segments
  • Conditional search for fast-event signaling
  • Auxiliary 1-Wire line to connect a memory chip or to be used as digital input
  • Programmable, general-purpose open-drain control output
  • Communicates at 16.3kbps
  • Unique, factory-lasered and tested 64-bit registration number assures absolute traceability because no two parts are alike
  • Built-in multidrop controller ensures compatibility with other 1-Wire products
  • Operating temperature range from -40°C to +85°C
  • Compact, low-cost 6-pin TSOC surface mount package

Application Notes
  • Application Note 155: 1-Wire® Software Resource Guide Device Description - DS2409
  • Application Note 158: 1-Wire Tagging with XML - DS2409
  • Application Note 2965: 1-Wire Master Device Configuration - DS2409

    Evaluation Kits
    none

    Design Guides
  • 1-Wire® PRODUCTS (PDF)

    Reliability Reports
  • Reliability Report: DS2409.pdf

    Software/Models
    none

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-4 of 4

    DS2409 Free
    Sample
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    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    DS2409P  
    TSOC;6 pin;
    Dwg: 56-G2016-001
    Use pkgcode/variation: D6-1*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS2409P/T&R  
    TSOC;6 pin;
    Dwg: 56-G2016-001
    Use pkgcode/variation: D6-1*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS2409P+  
    TSOC;6 pin;
    Dwg: 56-G2016-001
    Use pkgcode/variation: D6+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2409P+T&R  
    TSOC;6 pin;
    Dwg: 56-G2016-001
    Use pkgcode/variation: D6+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis

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    2007-06-20
    This page last modified: 2007-06-21



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