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DS2401
Silicon Serial Number


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Data Sheet
FULL DATA SHEET (PDF, 272kB)
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Description
The DS2401 enhanced Silicon Serial Number is a low-cost, electronic registration number that provides an absolutely unique identity which can be determined with a minimal electronic interface (typically, a single port pin of a microcontroller). The DS2401 consists of a factory-lasered, 64-bit ROM that includes a unique 48-bit serial number, an 8-bit CRC, and an 8-bit Family Code (01h). Data is transferred serially via the 1-Wire® protocol that requires only a single data lead and a ground return. Power for reading and writing the device is derived from the data line itself with no need for an external power source. The DS2401 is an upgrade to the DS2400. The DS2401 is fully reverse-compatible with the DS2400 but provides the additional multi-drop capability that enables many devices to reside on a single data line. The familiar TO-92, SOT-223 or TSOC package provides a compact enclosure that allows standard assembly equipment to handle the device easily.

Key Features   Applications/Uses
  • Upgrade and drop-in replacement for DS2400
    • Extended 2.8 to 6.0 voltage range
    • Multiple DS2401s can reside on a common 1-Wire Net
  • Unique, factory-lasered and tested 64-bit registration number (8-bit family code + 48-bit serial number + 8-bit CRC tester); guaranteed no two parts alike
  • Built-in multidrop controller ensures compatibility with other 1-Wire Net products
  • 8-bit family code specifies DS2401 communications requirements to reader
  • Presence Pulse acknowledges when the reader first applies voltage
  • Low-cost TO-92, SOT-223, and TSOC surface mount packages
  • Reduces control, address, data, and power to a single pin
  • Zero standby power required
  • Directly connects to a single port pin of a microprocessor and communicates at up to 16.3kbits/s
  • TO-92 Tape & Reel version with leads bent to 100mil spacing (default) or with straight leads (DS2401T-SL)
  • Applications
    • PCB Identification
    • Network Node ID
    • Equipment Registration
  • Operates over industrial temperature range of -40°C to +85°C

 
  • Equipment Registration
  • Network-Node Identification
  • PCB Identification
  • Reference Design License Management

    Key Specifications:   Memory: EPROM, SRAM, EEPROM, ROM, NV SRAM
    Part Number Memory Type Memory Size Bus Type Real-Time Clock PowerCap Package With GPIO Single Piece Module Supply Voltage (min) (V) Supply Voltage (max) (V) Package Smallest Available Package (max w/pins) (mm2) RoHS Available Operating Temp. Range (°C) Price*
    DS2401  ROM 64bit x 1 1-Wire No No No No 2.8 6 FCHIP/2
    ST223/3
    TO92/3
    TSOC/6
    1 Yes -40 to +85 $0.61 @ 1k
    See All Memory: EPROM, SRAM, EEPROM, ROM, NV SRAM (69)
    Notes:
    *This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific prices and delivery, please see the price and availability page or contact an authorized distributor.

    Application Notes
  • App Note 27: Understanding and Using Cyclic Redundancy Checks with Maxim iButton Products - DS2401
  • App Note 126: 1-Wire Communication Through Software - DS2401
  • App Note 148: Guidelines for Reliable 1-Wire Networks - DS2401
  • App Note 155: 1-Wire® Software Resource Guide Device Description - DS2401
  • App Note 159: Ultra-Reliable 1-Wire Communications - DS2401
  • App Note 178: Printed Circuit Board Identification Using 1-Wire Products - DS2401
  • App Note 186: Creating Global Identifiers Using 1-Wire Devices - DS2401
  • App Note 187: 1-Wire Search Algorithm - DS2401
  • App Note 192: Using the DS2480B Serial 1-Wire Line Driver - DS2401
  • App Note 214: Using a UART to Implement a 1-Wire Bus Master - DS2401
  • App Note 244: Advanced 1-Wire Network Driver - DS2401
  • App Note 1097: White Paper 2: Using the 1-Wire Public-Domain Kit - DS2401
  • App Note 1100: White Paper 5: Using 1-Wire APIs for Data Sheet Commands - DS2401
  • App Note 3377: Maxim Wafer-Level Package Assembly Guide - DS2401
  • App Note 3438: Serial Digital Data Networks - DS2401
  • App Note 3967: Selecting a Serial Bus - ds2401
  • App Note 3989: Add Control, Memory, Security, and Mixed-Signal Functions with a Single Contact - DS2401
  • App Note 4002: Understanding Flip-Chip and Chip-Scale Package Technologies and Their Applications - DS2401

    Evaluation Kits
  • DS9090K

    Design Guides
  • 1-Wire® PRODUCTS (PDF)

    Reliability Reports
  • Reliability Report: DS2401.pdf

    Software/Models
    none

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-16 of 16

    DS2401 Free
    Sample
    Buy
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    DS2401X1  
    FCHIP;2 pin;1 mm²
    Dwg: 56-G7009-001A (PDF)
    Use pkgcode/variation: BF211-1*
    -40°C to +85°C See data sheet
    DS2401Z-02F-4D43+T  
    ST223;3 pin;46 mm²
    Dwg: 56-G0005-001A (PDF)
    Use pkgcode/variation: K3+1*
    -40°C to +85°C See data sheet
    Materials Analysis
    DS2401Z+T&R  
    ST223;3 pin;46 mm²
    Dwg: 56-G0005-001A (PDF)
    Use pkgcode/variation: K3+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2401Z+  
    ST223;3 pin;46 mm²
    Dwg: 56-G0005-001A (PDF)
    Use pkgcode/variation: K3+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2401Z/T&R  
    ST223;3 pin;46 mm²
    Dwg: 56-G0005-001A (PDF)
    Use pkgcode/variation: K3-1*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS2401Z  
    ST223;3 pin;46 mm²
    Dwg: 56-G0005-001A (PDF)
    Use pkgcode/variation: K3-1*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS2401-SL+T&R  
    TO92;3 pin;20 mm²
    Dwg: 56-G0006-001A (PDF)
    Use pkgcode/variation: Q3+1*
    -40°C to +85°C See data sheet
    Materials Analysis
    DS2401+T&R  
    TO92;3 pin;20 mm²
    Dwg: 56-G0006-003A (PDF)
    Use pkgcode/variation: Q3+4*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2401+  
    TO92;3 pin;20 mm²
    Dwg: 56-G0006-001A (PDF)
    Use pkgcode/variation: Q3+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2401/T&R/SL  
    TO92;3 pin;20 mm²
    Dwg: 56-G0006-001A (PDF)
    Use pkgcode/variation: Q3-1*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS2401/T&R  
    TO92;3 pin;20 mm²
    Dwg: 56-G0006-003A (PDF)
    Use pkgcode/variation: Q3-4*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS2401  
    TO92;3 pin;20 mm²
    Dwg: 56-G0006-001A (PDF)
    Use pkgcode/variation: Q3-1*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS2401P/T&R  
    TSOC;6 pin;19 mm²
    Dwg: 56-G2016-001C1 (PDF)
    Use pkgcode/variation: D6-1*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS2401P+  
    TSOC;6 pin;19 mm²
    Dwg: 56-G2016-001C1 (PDF)
    Use pkgcode/variation: D6+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2401P+T&R  
    TSOC;6 pin;19 mm²
    Dwg: 56-G2016-001C1 (PDF)
    Use pkgcode/variation: D6+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2401P  
    TSOC;6 pin;19 mm²
    Dwg: 56-G2016-001C1 (PDF)
    Use pkgcode/variation: D6-1*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis

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    2006-12-22
    This page last modified: 2008-02-25




             



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