The quad T1 and E1 transceiver MCMs offer a high density packaging arrangement for the DS21352/DS21552 T1 single-chip transceivers and the DS21354/DS21554 E1 single-chip transceivers. Four silicon die of one of these devices is packaged in a multi-chip module (MCM) with the electrical connections as shown in Figure 1 in the data sheet. All of the functions available on the DS21352/DS21552 and DS21354/DS21554 are also available in the MCM packaged version however in order to minimize package size, some signals have been deleted. These differences are detailed in table 1 in the data sheet.
This data sheet describes the electrical connections and the mechanical dimensions only. Please see the DS21352/DS21552 and DS21354/DS21554 data sheets for full details on all of the features and the operating characteristics of the device.
Key Features
Four completely independent T1 or E1 transceivers in one small 27mm x 27mm package
Each transceiver contains a short and long haul line interface plus a full featured framer with alarm detection/generation, elastic-stores, hardware based signaling support, per DS0 channel control and HDLC controller
Each multi-chip module (MCM) contains four die of
DS21352 (DS21Q352)
DS21552 (DS21Q552)
DS21354 (DS21Q354)
DS21554 (DS21Q554)
See the specific DS21352/DS21552 and DS21354/DS21554 data sheets for details on their feature set and operation
All four T1 or E1 transceivers can be concatenated into a single 8.192MHz backplane data stream
IEEE 1149.1 JTAG-Boundary Scan architecture
DS21Q352/DS21Q552 and DS21Q354/DS21Q554 are pin compatible to allow the same footprint to support T1 and E1 applications
256-pin MCM BGA package (27mm X 27mm)
Low power 5V CMOS or low power 3.3V CMOS with 5V tolerant input and outputs
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