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Active: In Production.

Data Sheet

FULL DATA SHEET (PDF, 704kB) Download   E-Mail

Description

The 4 x 4 and 4 x 3 multichip modules (MCM) offer a high-density packaging arrangement for the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these devices is packaged in an MCM with the electrical connections as shown in Figure 1-1. All of the functions available on the DS21Q42 are also available in the MCM packaged version. However, in order to minimize package size, some signals have been deleted or combined. These differences are detailed in Table 1-1. In the 4 x 3 (FT) version, the fourth quad framer is not populated and hence all of the signals to and from this fourth framer are absent and should be treated as No Connects (NC). Table 2-1 lists all of the signals on the MCM and it also lists the absent signals for the 4 x 3. The availability of both a 12-channel and a 16-channel version allow the maximum framer density with the lowest cost. For example, in a T3 application, two devices (one DS21FF42 and one DS21FT42) provide 28 framers without the additional cost and power consumption of any unused framers that appear in an octal approach.

Key Features		Applications/Uses
16 or 12 completely independent T1 framers in one small 27mm x 27mm, 1.27mm pitch BGA package Each multichip module (MCM) contains four (FF) or three (FT) DS21Q42 die Each quad framer can be concatenated into a single 8.192MHz backplane data stream IEEE 1149.1 JTAG-Boundary Scan Architecture DS21FF42 and DS21FT42 are pin compatible with DS21FF44 and DS21FT44, respectively, to allow the same footprint to support T1 and E1 applications 300-pin MCM 1.27mm pitch BGA package (27mm x 27mm) Low-power 3.3V CMOS with 5V tolerant input and outputs		DSLAM High-Density Line Cards Multiplexers/Demultiplexers Routers/Switches

Diagram

Functional Diagram

Application Notes

Application Note 309: Interfacing to the Fractional T1 and E1 - DS21FF42, DS21FT42 Application Note 310: D4 Framing and Signaling - DS21FF42, DS21FT42 Application Note 336: Transparent Operation on T1, E1 Framers and Transceivers - DS21FF42, DS21FT42 Application Note 342: T1/E1 Framer Initialization and Programming - DS21FF42, DS21FT42 Application Note 345: DS21352/552, DS2151, DS2152, DS2141A, DS21Q42 Programming SLC-96 - DS21FF42, DS21FT42 Application Note 382: J1 Japanese Standards - DS21FF42, DS21FT42 Application Note 394: HDLC Configuration of Framers and Transceivers - DS21FF42, DS21FT42 Application Note 461: Programming and Controlling the FDL on DS2141A, DS2151 - DS21FF42, DS21FT42 Application Note 2713: Switching Frame Mode In Live T1 Systems - DS21FF42, DS21FT42 Application Note 3345: Examples of DS31256 Applications - DS21FF42, DS21FT42 Application Note 3760: Interleaved Bus Operation - DS21FF42, DS21FT42

Design Guides

Communications (PDF)

Reliability Reports

Request Reliability Report for: DS21FF42 DS21FT42

Software/Models

DS21Q42 BSDL Model

Ordering Information

Notes: Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.

Devices: 1-6 of 6

DS21FF42	Free Sample	Buy	Status	Package: TYPE PINS FOOTPRINT   DRAWING CODE/VAR *	Temp	RoHS/Lead-Free? Materials Analysis
DS21FF42+			Active	PBGA;300 pin;729 mm² Outline Drawing: 21-0304 (PDF) Land Pattern: 90-0264 (PDF) Use pkgcode/variation: V300+2*	0°C to +70°C	RoHS/Lead-Free: Lead Free Materials Analysis
DS21FF42N+			Active	PBGA;300 pin;729 mm² Outline Drawing: 21-0304 (PDF) Land Pattern: 90-0264 (PDF) Use pkgcode/variation: V300+2*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
DS21FF42			Active	PBGA;300 pin;729 mm² Outline Drawing: 21-0304 (PDF) Land Pattern: 90-0264 (PDF) Use pkgcode/variation: V300-2*	0°C to +70°C	RoHS/Lead-Free: No Materials Analysis
DS21FF42N			Active	PBGA;300 pin;729 mm² Outline Drawing: 21-0304 (PDF) Land Pattern: 90-0264 (PDF) Use pkgcode/variation: V300-2*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
DS21FT42	Free Sample	Buy	Status	Package: TYPE PINS FOOTPRINT   DRAWING CODE/VAR *	Temp	RoHS/Lead-Free? Materials Analysis
DS21FT42			Active	PBGA;300 pin;729 mm² Outline Drawing: 21-0304 (PDF) Land Pattern: 90-0264 (PDF) Use pkgcode/variation: V300-2*	0°C to +70°C	RoHS/Lead-Free: No Materials Analysis
DS21FT42N			Active	PBGA;300 pin;729 mm² Outline Drawing: 21-0304 (PDF) Land Pattern: 90-0264 (PDF) Use pkgcode/variation: V300-2*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis

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