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DS2175, DS2175N
T1/CEPT Elastic Store


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Status
Active: In Production.

Data Sheet
FULL DATA SHEET (PDF, 256kB)
Download this datasheet in PDF formatDownload   Send this datasheet to any email addressE-Mail


Description
The DS2175 is a low-power CMOS elastic-store memory optimized for use in primary rate telecommunications transmission equipment. The device serves as a synchronizing element between async data streams and is compatible with North American (T1-1.544MHz) and European (CEPT-2.048MHz) rate networks. The chip has several flexible operating modes which eliminate support logic and hardware currently required to interconnect parallel or serial TDM backplanes. Application areas include digital trunks, drop and insert equipment, digital cross-connects (DCC), private network equipment, and PABX-to-computer interfaces such as DMI and CPI.

Key Features
  • Rate buffer for T1 and CEPT transmission systems
  • Synchronizes loop-timed and system-timed data streams on frame boundaries
  • Ideal for T1 (1.544 MHz) to CEPT (2.048MHz), CEPT to T1 interfaces
  • Supports parallel and serial backplanes
  • Buffer depth is 2 frames
  • Comprehensive on-chip "slip" control logic
    • Slips occur only on frame boundaries
    • Outputs report slip occurrences and direction
    • Align feature allows buffer to be recentered at any time
    • Buffer depth easily monitored
  • Compatible with DS2180A T1 and DS2181A CEPT Transceivers
  • Industrial temperature range of -40°C to +85°C available, designated DS2175N

Key Specifications:  T/E Carrier & Packetized Products
Part Number Transmission Standard Functions Channels VSUPPLY
(V)
Package/Pins Smallest Available Pckg.
(mm2)
Price
max w/pins See Notes
DS2175  T1/E1/J1 Elastic Store 1 5
PDIP(N)/16
SOIC(W)/16
111 $6.96 @1k
See All T/E Carrier & Packetized Products (102)

Diagram
DS2175, DS2175N: Block Diagram
Block Diagram

Application Notes
  • Application Note 329: DS2151 Special Modes - DS2175

    Reliability Reports
  • Reliability Report: DS2175.pdf
  • Request Reliability Report for:

    Software/Models
    none

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-11 of 11

    DS2175 Free
    Sample
    Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    DS2175    
    Active PDIP(N);16 pin;158 mm²
    Outline Drawing: 21-0043 (PDF)
    Land Pattern: Not Applicable
    Use pkgcode/variation: P16-2*
    0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS2175+  
    Active PDIP(N);16 pin;158 mm²
    Outline Drawing: 21-0043 (PDF)
    Land Pattern: Not Applicable
    Use pkgcode/variation: P16+2*
    0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2175S  
    Active SOIC(W);16 pin;111 mm²
    Outline Drawing: 21-0042 (PDF)
    Land Pattern: 90-0107 (PDF)
    Use pkgcode/variation: W16-3*
    0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS2175S/T&R    
    Active SOIC(W);16 pin;111 mm²
    Outline Drawing: 21-0042 (PDF)
    Land Pattern: 90-0107 (PDF)
    Use pkgcode/variation: W16-3*
    0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS2175S+  
    Active SOIC(W);16 pin;111 mm²
    Outline Drawing: 21-0042 (PDF)
    Land Pattern: 90-0107 (PDF)
    Use pkgcode/variation: W16+3*
    0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2175S+T&R    
    Active SOIC(W);16 pin;111 mm²
    Outline Drawing: 21-0042 (PDF)
    Land Pattern: 90-0107 (PDF)
    Use pkgcode/variation: W16+3*
    0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2175SN    
    Active SOIC(W);16 pin;111 mm²
    Outline Drawing: 21-0042 (PDF)
    Land Pattern: 90-0107 (PDF)
    Use pkgcode/variation: W16-3*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS2175SN/T&R    
    Active SOIC(W);16 pin;111 mm²
    Outline Drawing: 21-0042 (PDF)
    Land Pattern: 90-0107 (PDF)
    Use pkgcode/variation: W16-3*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS2175SN+  
    Active SOIC(W);16 pin;111 mm²
    Outline Drawing: 21-0042 (PDF)
    Land Pattern: 90-0107 (PDF)
    Use pkgcode/variation: W16+3*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2175SN+T&R    
    Active SOIC(W);16 pin;111 mm²
    Outline Drawing: 21-0042 (PDF)
    Land Pattern: 90-0107 (PDF)
    Use pkgcode/variation: W16+3*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2175N Free
    Sample
    Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    DS2175N    
    Active PDIP(N);16 pin;158 mm²
    Outline Drawing: 21-0043 (PDF)
    Land Pattern: Not Applicable
    Use pkgcode/variation: P16-2*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis

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    1999-09-20
    This page last modified: 2009-10-22


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