ENGLISH 简体中文 日本語 한국어  

    Login | Register 


   
 
Enter keywords or part number    



DS2165, DS2165Q
16/24/32kbps ADPCM Processor


  QuickView     Technical Documents     Ordering Info     More Information     User Comments (0)     All  
Status
Part Number Status Replacement Explanation
DS2165 This product is Not Recommended for New Designs. DS2165 The DS2165 is only offered as the DS2165Q in the PLCC package.
DS2165Q Active: In Production.

Data Sheet
FULL DATA SHEET (PDF, 352kB)
Download this datasheet in PDF formatDownload   Send this datasheet to any email addressE-Mail


Description
The DS2165 ADPCM processor chip is a dedicated digital-signal-processing (DSP) chip that has been optimized to perform adaptive differential pulse-code modulation (ADPCM) speech compression at three different rates. The chip can be programmed to compress (expand) 64kbps voice data down to (up from) either 32kbps, 24kbps, or 16kbps. The compression to 32kbps follows the algorithm specified by CCITT recommendation G.721 (July 1986) and ANSI document T1.301 (April 1987). The compression to 24kbps follows ANSI document T1.303. The compression to 16kbps follows a proprietary algorithm developed by Dallas Semiconductor. The DS2165 can switch compression algorithms on-the-fly. This allows the user to make maximum use of the available bandwidth on a dynamic basis.

Key Features
  • Compresses/expands 64kbps PCM voice to/from either 32kbps, 24kbps, or 16kbps
  • Dual, fully independent channel architecture; device can be programmed to perform either:
    • two expansions
    • two compressions
    • one expansion and one compression
  • Interconnects directly to combo-codec devices
  • Input to output delay is less than 375µs
  • Simple serial port used to configure the device
  • On-board time-slot assigner-circuit (TSAC) function allows data to be input/output at various time slots
  • Supports channel associated signaling
  • Each channel can be independently idled or placed into bypass
  • Available hardware mode requires no host processor; ideal for voice storage applications
  • Backward-compatible with the DS2167 ADPCM processor chip
  • Single +5V supply; low-power CMOS technology
  • Available in 28-pin PLCC
  • 3V operation version is available (DS2165QL)

Diagram
DS2165, DS2165Q: Block Diagram
Block Diagram

Reliability Reports
  • Request Reliability Report for:

    Software/Models
    none

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-7 of 7

    DS2165Q Notes Free
    Sample
    Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    DS2165Q  
    Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28-3*
    0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS2165QL   3V  
    Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28-3*
    0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS2165QN/T&R    
    Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28-3*
    0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS2165Q+  
    Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28+3*
    0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2165QN+T&R    
    Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28+3*
    0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS2165QN  
    Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28-3*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS2165QN+  
    Active PLCC;28 pin;158 mm²
    Outline Drawing: 21-0049 (PDF)
    Land Pattern: 90-0235 (PDF)
    Use pkgcode/variation: Q28+3*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis

    Didn't Find What You Need?
  • Next Day Product Selection Assistance from Applications Engineers
  • Parametric Search
  • Applications Help
  •  QuickView   Technical Documents   Ordering Info   More Information  
     Description 
     Key Features 
     Applications/Uses 
     Key Specifications 
     Diagram 

     Data Sheet 
     Application Notes 
     Design Guides 
     Engineering Journals 
     Reliability Reports 
     Software/Models 
     Evaluation Kits 

     Price and Availability 
     Samples 
     Buy Online 
     Package Information 
     Lead-Free Information 

     Related Products 
     Notes and Comments 
     Evaluation Kits 

    2002-07-11
    This page last modified: 2009-10-22


            •         •         •     Privacy Policy     •     Legal Notices

        Copyright © 2009 by Maxim Integrated Products