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DS1259
Battery Manager Chip

Not Recommended for New Designs
Part Number Replacement Explanation
DS1259 n/a This part remains available but is not recommended for new designs.
DS1259+ n/a
DS1259N n/a
DS1259S n/a
DS1259S+ n/a
DS1259S+T&R n/a
DS1259S/T&R n/a
DS1259S/T&R/C01 n/a
DS1259S/T&R/C03 n/a
DS1259SN n/a
DS1259SN+ n/a
DS1259SN/T&R n/a


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Data Sheet
FULL DATA SHEET (PDF, 74kB)
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Description
The DS1259 Battery Manager Chip is a low-cost battery management system for portable and nonvolatile electronic equipment. A battery connected to the battery input pin supplies power to CMOS electronic circuits when primary power is lost through an efficient switch via the VCCO pins. When power is supplied from the battery, the power-fail signal is active to warn electronic reset circuits of the power status. Energy loss during shipping and handling is avoided by pulsing reset, thereby causing the battery to be isolated from other elements in the circuits.

Key Features
  • Facilitates uninterruptible power
  • Uses battery only when primary VCC is not available
  • Low forward voltage drop
  • Power fail signal interrupts processor or write protects memory
  • Consumes less than 100nA of battery current
  • Low battery warning signal
  • Battery can be electrically disconnected upon command
  • Battery will automatically reconnect when VCC is applied
  • Mates directly with DS1212 Nonvolatile Controller x 16 Chip to back up 16 RAMs
  • Optional 16-pin SOIC surface-mount package

Evaluation Kits
none

Reliability Reports
  • Reliability Report: DS1259.pdf

    Software/Models
    none

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-11 of 11

    DS1259 Free
    Sample
    Buy
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    DS1259+  
    PDIP;16 pin;
    Dwg: 21-0043D (PDF)
    Use pkgcode/variation: P16+2*
    0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS1259  
    PDIP;16 pin;
    Dwg: 21-0043D (PDF)
    Use pkgcode/variation: P16-2*
    0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS1259N  
    PDIP;16 pin;
    Dwg: 21-0043D (PDF)
    Use pkgcode/variation: P16-2*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS1259S+T&R  
    SOIC;16 pin;
    Dwg: 21-0042B (PDF)
    Use pkgcode/variation: W16+3*
    0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS1259SN+  
    SOIC;16 pin;
    Dwg: 56-G4009-001
    Use pkgcode/variation: W16+11*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS1259SN+T&R  
    SOIC;16 pin;
    Dwg: 56-G4009-001
    Use pkgcode/variation: W16+11*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS1259S  
    SOIC;16 pin;
    Dwg: 56-G4009-001
    Use pkgcode/variation: W16-11*
    0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS1259S+  
    SOIC;16 pin;
    Dwg: 56-G4009-001
    Use pkgcode/variation: W16+11*
    0°C to +70°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    DS1259S/T&R  
    SOIC;16 pin;
    Dwg: 56-G4009-001
    Use pkgcode/variation: W16-11*
    0°C to +70°C RoHS/Lead-Free: No
    Materials Analysis
    DS1259SN  
    SOIC;16 pin;
    Dwg: 56-G4009-001
    Use pkgcode/variation: W16-11*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    DS1259SN/T&R  
    SOIC;16 pin;
    Dwg: 56-G4009-001
    Use pkgcode/variation: W16-11*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis

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    1999-11-19
    This page last modified: 2007-06-18



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