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MAX9111, MAX9113
Single/Dual LVDS Line Receivers with Ultra-Low Pulse Skew in SOT23

Industry's Lowest Pulse-Skew LVDS Receivers


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Status
Active: In Production.

Data Sheet
FULL DATA SHEET (PDF, 116kB)
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Description
The MAX9111/MAX9113 single/dual low-voltage differential signaling (LVDS) receivers are designed for high-speed applications requiring minimum power consumption, space, and noise. Both devices support switching rates exceeding 500Mbps while operating from a single +3.3V supply, and feature ultra-low 300ps (max) pulse skew required for high-resolution imaging applications such as laser printers and digital copiers.

The MAX9111 is a single LVDS receiver, and the MAX9113 is a dual LVDS receiver.

Both devices conform to the EIA/TIA-644 LVDS standard and convert LVDS to LVTTL/CMOS-compatible outputs. A fail-safe feature sets the outputs high when the inputs are undriven and open, terminated, or shorted. The MAX9111/MAX9113 are available in space-saving 8-pin SOT23 and SO packages. Refer to the MAX9110/MAX9112 data sheet for single/dual LVDS line drivers.

Key Features   Applications/Uses
  • Low 300ps (max) Pulse Skew for High-Resolution Imaging and High-Speed Interconnect
  • Space-Saving 8-Pin SOT23 and SO Packages
  • Pin-Compatible Upgrades to DS90LV018A and DS90LV028A (SO Packages Only)
  • Guaranteed 500Mbps Data Rate
  • Low 29mW Power Dissipation at 3.3V
  • Conform to EIA/TIA-644 Standard
  • Single +3.3V Supply
  • Flow-Through Pinout Simplifies PCB Layout
  • Fail-Safe Circuit Sets Output High for Undriven Inputs
  • High-Impedance LVDS Inputs when Powered Off

 
  • Backplane and Interconnect Applications
  • Cell Phone Base Stations
  • Clock/Data Distribution
  • Digital Copiers
  • Laser Printers
  • LCD Displays
  • Network Routers and Switches
  • Telecom Switching Equipment

    Key Specifications:  High-Speed Interconnect (Differential Signaling)
    Part Number Features Signal Type Signal Type Functions Rx Tx Data Rates
    (Mbps)
    tPD
    (ps)
    VSUPPLY
    (V)
    Price
    Rx Tx max See Notes
    MAX9111 
    Fail-Safe Inputs
    Flow-Through Pinout
    Rx Hi-Z at Power-Off
    LVDS
    CMOS
    LVTTL
    Level Translator 1 1 500 2500 3.3 $0.78 @1k
    MAX9113  2 2 $1.35 @1k
    See All High-Speed Interconnect (Differential Signaling) (132)

    Diagram
    MAX9111, MAX9113: Typical Operating Circuit
    Typical Operating Circuit

    Application Notes
  • Application Note 872: LVDS Splitter Simplifies High-Speed Signal Distribution - MAX9111
  • Application Note 873: High-Speed Signal Distribution Using Low-Voltage Differential Signaling (LVDS) - MAX9111

    Design Guides
  • Fiber (PDF)

    Reliability Reports
  • Show FIT data for:
  • Request Reliability Report for:

    Software/Models
  • MAX9111 IBIS Model
  • MAX9113 IBIS Model

    Ordering Information
    Notes:

    1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
    2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
    3. Part number suffixes: T or T&R = tape and reel;+ = RoHS/lead-free;# = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
    4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


    Devices: 1-10 of 10

    MAX9111 Free
    Sample
    Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    MAX9111ESA+  
    Active SOIC(N);8 pin;31 mm²
    Outline Drawing: 21-0041 (PDF)
    Land Pattern: 90-0096 (PDF)
    Use pkgcode/variation: S8+2*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    MAX9111ESA+T    
    Active SOIC(N);8 pin;31 mm²
    Outline Drawing: 21-0041 (PDF)
    Land Pattern: 90-0096 (PDF)
    Use pkgcode/variation: S8+2*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    MAX9111EKA+  
    Active SOT;8 pin;9 mm²
    Outline Drawing: 21-0078 (PDF)
    Land Pattern: 90-0176 (PDF)
    Use pkgcode/variation: K8+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    MAX9111EKA+T    
    Active SOT;8 pin;9 mm²
    Outline Drawing: 21-0078 (PDF)
    Land Pattern: 90-0176 (PDF)
    Use pkgcode/variation: K8+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    MAX9113 Free
    Sample
    Buy Status
    Package: TYPE PINS FOOTPRINT
      DRAWING CODE/VAR *
    Temp RoHS/Lead-Free?
    Materials Analysis
    MAX9113ESA    
    Active SOIC(N);8 pin;31 mm²
    Outline Drawing: 21-0041 (PDF)
    Land Pattern: 90-0096 (PDF)
    Use pkgcode/variation: S8-2*
    -40°C to +85°C RoHS/Lead-Free: No
    Materials Analysis
    MAX9113ESA-T    
    Active

    Land Pattern: Not Available

    -40°C to +85°C See data sheet
    MAX9113ESA+  
    Active SOIC(N);8 pin;31 mm²
    Outline Drawing: 21-0041 (PDF)
    Land Pattern: 90-0096 (PDF)
    Use pkgcode/variation: S8+2*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    MAX9113ESA+T    
    Active SOIC(N);8 pin;31 mm²
    Outline Drawing: 21-0041 (PDF)
    Land Pattern: 90-0096 (PDF)
    Use pkgcode/variation: S8+2*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    MAX9113EKA+  
    Active SOT;8 pin;9 mm²
    Outline Drawing: 21-0078 (PDF)
    Land Pattern: 90-0176 (PDF)
    Use pkgcode/variation: K8+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis
    MAX9113EKA+T    
    Active SOT;8 pin;9 mm²
    Outline Drawing: 21-0078 (PDF)
    Land Pattern: 90-0176 (PDF)
    Use pkgcode/variation: K8+1*
    -40°C to +85°C RoHS/Lead-Free: Lead Free
    Materials Analysis

    More Information
  • Topmark Coding: MAX9111 MAX9113
  • New Product Press Release 2000-08-16 

    Related Products
    MAX9110, MAX9112 Single/Dual LVDS Line Driver with Ultra-Low Differential Skew in SOT23

    More Like This: View Product Families for Similar Products

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    Document Ref.: 19-1803; Rev 3; 2009-04-07
    This page last modified: 2009-04-07


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