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MAX3222E, MAX3232E, MAX3237E, MAX3241E, MAX3246E
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers


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Ordering Information
Notes:

  1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
  2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
  3. Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
  4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


Devices: 1-30 of 30

MAX3241E Free
Sample
Buy
Package: TYPE PINS FOOTPRINT
  DRAWING CODE/VAR *
Temp RoHS/Lead-Free?
Materials Analysis
MAX3241ECGJ-T  


Land Pattern: Not Available

0°C to +70°C See data sheet
MAX3241ECGJ  
QFN;32 pin;50 mm²
Outline Drawing: 21-0092 (PDF)
Land Pattern: 90-0220 (PDF)
Use pkgcode/variation: G3277-2*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
MAX3241ECWI+  
SOIC(W);28 pin;193 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0109 (PDF)
Use pkgcode/variation: W28+6*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241ECWI+T  
SOIC(W);28 pin;193 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0109 (PDF)
Use pkgcode/variation: W28+6*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241ECWI-T  
SOIC(W);28 pin;193 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0109 (PDF)
Use pkgcode/variation: W28-6*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
MAX3241ECWI  
SOIC(W);28 pin;193 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0109 (PDF)
Use pkgcode/variation: W28-6*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
MAX3241EEWI+  
SOIC(W);28 pin;193 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0109 (PDF)
Use pkgcode/variation: W28+6*
-40°C to +85°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241EEWI  
SOIC(W);28 pin;193 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0109 (PDF)
Use pkgcode/variation: W28-6*
-40°C to +85°C RoHS/Lead-Free: No
Materials Analysis
MAX3241EEWI-T  
SOIC(W);28 pin;193 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0109 (PDF)
Use pkgcode/variation: W28-6*
-40°C to +85°C RoHS/Lead-Free: No
Materials Analysis
MAX3241EEWI+T  
SOIC(W);28 pin;193 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0109 (PDF)
Use pkgcode/variation: W28+6*
-40°C to +85°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241ECAI+T  
SSOP;28 pin;82 mm²
Outline Drawing: 21-0056 (PDF)
Land Pattern: 90-0095 (PDF)
Use pkgcode/variation: A28+1*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241ECAI+  
SSOP;28 pin;82 mm²
Outline Drawing: 21-0056 (PDF)
Land Pattern: 90-0095 (PDF)
Use pkgcode/variation: A28+1*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241ECAI  
SSOP;28 pin;82 mm²
Outline Drawing: 21-0056 (PDF)
Land Pattern: 90-0095 (PDF)
Use pkgcode/variation: A28-1*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
MAX3241ECAI-T  
SSOP;28 pin;82 mm²
Outline Drawing: 21-0056 (PDF)
Land Pattern: 90-0095 (PDF)
Use pkgcode/variation: A28-1*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
MAX3241EEAI  
SSOP;28 pin;82 mm²
Outline Drawing: 21-0056 (PDF)
Land Pattern: 90-0095 (PDF)
Use pkgcode/variation: A28-1*
-40°C to +85°C RoHS/Lead-Free: No
Materials Analysis
MAX3241EEAI-T  
SSOP;28 pin;82 mm²
Outline Drawing: 21-0056 (PDF)
Land Pattern: 90-0095 (PDF)
Use pkgcode/variation: A28-1*
-40°C to +85°C RoHS/Lead-Free: No
Materials Analysis
MAX3241EEAI+T  
SSOP;28 pin;82 mm²
Outline Drawing: 21-0056 (PDF)
Land Pattern: 90-0095 (PDF)
Use pkgcode/variation: A28+1*
-40°C to +85°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241EEAI+  
SSOP;28 pin;82 mm²
Outline Drawing: 21-0056 (PDF)
Land Pattern: 90-0095 (PDF)
Use pkgcode/variation: A28+1*
-40°C to +85°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241ECTJ  
TQFN;32 pin;50 mm²
Outline Drawing: 21-0144 (PDF)
Land Pattern: 90-0125 (PDF)
Use pkgcode/variation: T3277-2*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
MAX3241ECTJ+T  
TQFN;32 pin;50 mm²
Outline Drawing: 21-0144 (PDF)
Land Pattern: 90-0125 (PDF)
Use pkgcode/variation: T3277+2*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241ECTJ+  
TQFN;32 pin;50 mm²
Outline Drawing: 21-0144 (PDF)
Land Pattern: 90-0125 (PDF)
Use pkgcode/variation: T3277+2*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241ECTJ-T  


Land Pattern: Not Available

0°C to +70°C See data sheet
MAX3241ECUI  
TSSOP;28 pin;65 mm²
Outline Drawing: 21-0066 (PDF)
Land Pattern: 90-0171 (PDF)
Use pkgcode/variation: U28-2*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
MAX3241ECUI+  
TSSOP;28 pin;65 mm²
Outline Drawing: 21-0066 (PDF)
Land Pattern: 90-0171 (PDF)
Use pkgcode/variation: U28+2*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241ECUI+T  
TSSOP;28 pin;65 mm²
Outline Drawing: 21-0066 (PDF)
Land Pattern: 90-0171 (PDF)
Use pkgcode/variation: U28+2*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241ECUI-T  
TSSOP;28 pin;65 mm²
Outline Drawing: 21-0066 (PDF)
Land Pattern: 90-0171 (PDF)
Use pkgcode/variation: U28-2*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
MAX3241EEUI-T  
TSSOP;28 pin;65 mm²
Outline Drawing: 21-0066 (PDF)
Land Pattern: 90-0171 (PDF)
Use pkgcode/variation: U28-2*
-40°C to +85°C RoHS/Lead-Free: No
Materials Analysis
MAX3241EEUI+T  
TSSOP;28 pin;65 mm²
Outline Drawing: 21-0066 (PDF)
Land Pattern: 90-0171 (PDF)
Use pkgcode/variation: U28+2*
-40°C to +85°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241EEUI+  
TSSOP;28 pin;65 mm²
Outline Drawing: 21-0066 (PDF)
Land Pattern: 90-0171 (PDF)
Use pkgcode/variation: U28+2*
-40°C to +85°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX3241EEUI  
TSSOP;28 pin;65 mm²
Outline Drawing: 21-0066 (PDF)
Land Pattern: 90-0171 (PDF)
Use pkgcode/variation: U28-2*
-40°C to +85°C RoHS/Lead-Free: No
Materials Analysis

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    Document Ref.: 19-1298; Rev 11; 2007-12-21
    This page last modified: 2008-01-02


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