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MAX690, MAX691, MAX692, MAX693, MAX694, MAX695
Microprocessor Supervisory Circuits

Industry-Standard, Full-Function µP Supervisor


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Status
Active: In Production.

Ordering Information
Notes:

  1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
  2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
  3. Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt. More: SeeFull Data Sheet or Part Naming Conventions.
  4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.


Devices: 1-17 of 17

MAX691 Free
Sample
Buy Status
Package: TYPE PINS FOOTPRINT
  DRAWING CODE/VAR *
Temp RoHS/Lead-Free?
Materials Analysis
MAX691EJE  
Active CDIP(N);16 pin;173 mm²
Outline Drawing: 21-0045 (PDF)
Land Pattern: Not Applicable
Use pkgcode/variation: J16-3*
-40°C to +85°C RoHS/Lead-Free: No
Materials Analysis
MAX691MJE  
Active CDIP(N);16 pin;173 mm²
Outline Drawing: 21-0045 (PDF)
Land Pattern: Not Applicable
Use pkgcode/variation: J16-3*
-55°C to +125°C RoHS/Lead-Free: No
Materials Analysis
MAX691MJE/883B    
Active CDIP(N);16 pin;173 mm²
Outline Drawing: 21-0045 (PDF)
Land Pattern: Not Applicable
Use pkgcode/variation: J16-3*
-55°C to +125°C RoHS/Lead-Free: No
Materials Analysis
MAX691C/D    
Active DICE SALES;NA pin;0 mm²

Land Pattern: Not Applicable
Use pkgcode/variation: DICE*
See data sheet
MAX691MLP/883B    
Active LCC;20 pin;83 mm²
Outline Drawing: 21-0658 (PDF)
Land Pattern: 90-0177 (PDF)
Use pkgcode/variation: L20-3*
-55°C to +125°C RoHS/Lead-Free: No
Materials Analysis
MAX691CPE  
Active PDIP(N);16 pin;158 mm²
Outline Drawing: 21-0043 (PDF)
Land Pattern: Not Applicable
Use pkgcode/variation: P16-1*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
MAX691CPE+  
Active PDIP(N);16 pin;158 mm²
Outline Drawing: 21-0043 (PDF)
Land Pattern: Not Applicable
Use pkgcode/variation: P16+1*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX691EPE  
Active PDIP(N);16 pin;158 mm²
Outline Drawing: 21-0043 (PDF)
Land Pattern: Not Applicable
Use pkgcode/variation: P16-1*
-40°C to +85°C RoHS/Lead-Free: No
Materials Analysis
MAX691EPE+  
Active PDIP(N);16 pin;158 mm²
Outline Drawing: 21-0043 (PDF)
Land Pattern: Not Applicable
Use pkgcode/variation: P16+1*
-40°C to +85°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX691CWE  
Active SOIC(W);16 pin;112 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16-1*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
MAX691CWE-T    
Active SOIC(W);16 pin;112 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16-1*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
MAX691CWE+  
Active SOIC(W);16 pin;112 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16+1*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX691CWE+T    
Active SOIC(W);16 pin;112 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16+1*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX691EWE  
Active SOIC(W);16 pin;112 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16-1*
-40°C to +85°C RoHS/Lead-Free: No
Materials Analysis
MAX691EWE-T    
Active SOIC(W);16 pin;112 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16-1*
-40°C to +85°C RoHS/Lead-Free: No
Materials Analysis
MAX691EWE+  
Active SOIC(W);16 pin;112 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16+1*
-40°C to +85°C RoHS/Lead-Free: Lead Free
Materials Analysis
MAX691EWE+T    
Active SOIC(W);16 pin;112 mm²
Outline Drawing: 21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16+1*
-40°C to +85°C RoHS/Lead-Free: Lead Free
Materials Analysis

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    Document Ref.: 19-0218; Rev 4; 2006-03-08
    This page last modified: 2009-11-09


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