Reliability Monitor Program (Q4 2005)

Preconditioning
Operating Life
Storage Life
Temperature Cycle
Temp Humidity Bias
Write Cy/Data Ret'n
Package Integrity
0.35µm Chartered
0.35µmDallas
0.6µm
0.8µm
1.2µm
BGA
BGA Module
Cartridge
Flip Chip
iButton
LQFP
Module
MQFP
PBGA
PDIP
PLCC
SipStik
SOIC
SOT
TO
TSOC
TSOP
TSSOP
µSOP
See Process Reliability Report Index, by Product (PDF, 885kB)
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