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Maxim >
Quality Assurance and Reliability >
Reliability Information
> Monitor Reports |
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Reliability Monitor Program (Q1 2004) |
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- Reliability Monitor Program (RMP) Description (PDF)
An overview of the RMP and a detailed description of the data summaries and stress tests used in the RMP.
- RMP Device Sampling Plan (PDF)
A table of products, packages, and assembly sites included in the Monitors. Frequency and sample sizes are also included.
- RMP Process Sampling Plan (PDF)
A table of vehicles used to monitor Dallas Semiconductor Technologies.
- RMP Stress Tests (PDF)
Test Plan for Modules, IC's, SipStik's, and Touch Memory.
- IC Reliability Data (PDF)
Single lot snapshots of integrated circuit device types from the Sampling Plan. Data includes details for read points, sample sizes, and failures, as well as, a calculated failure rate for Operating Life. Failure Analysis and Corrective Actions are included where appropriate.
- Module Reliability Data (PDF)
Single lot snapshots of Module, Touch Memory, and SipStik devices from the Sampling Plan. Data includes details for read points, sample sizes, and failures. Failure Analysis and Corrective Actions are included where appropriate.
- Process Reliability Summary (PDF)
A summary listing of IC Process Reliability data generated by the RMP for the past quarter and organized by technology. Failure rates are calculated for the entire technology family.
- IME (Infant Mortality Evaluation) (PDF)
This is a summary of the parts per million defect density by technology if the product had not received burn-in. All Dallas Semiconductor Products meet 300ppm with burn in if required.
- Assembly Package Reliability Summary (PDF)
A summary listing of Assembly/Package Process Reliability data generated by the RMP for the past quarter and organized by Assembly Site/Package type.
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