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Flagship Process Technologies
Process Technology
Maxim offers an unrivaled combination of proven process and package technologies. We run over 160 different integrated circuit processes—the industry's broadest range of analog and mixed-signal IC process technologies. Our products are extraordinarily reliable, achieving a failure rate of 0.49 FITs (failures per 109 device hours).
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Maxim Process Technologies
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SiGe Bipolar/BiCMOS
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Complementary Bipolar/BiCMOS
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High-Voltage BiCMOS/DMOS
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CMOS and RFCMOS
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NPN
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fT = 25GHz to 200GHz
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fT = 7GHz to 25GHz
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fT = up to GHz
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Yes
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PNP
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Vertical, lateral
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Vertical
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Vertical to 50V,
lateral to 30V
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LPNP
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CMOS
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3V, 5V
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3.3V to 5.5V
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1.8V to 220V
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1.8V/3.3V, 5V
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DMOS
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12V to 40V
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1.8V to 220V
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NMOS
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18V/36V
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PMOS
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28V
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Resistors
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Poly, NiCr, SiCr
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Implanted, Poly, NiCr, SiCr
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Poly, SiCr
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Thin film, Poly
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Capacitors
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MOS, high-Q MIM
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MOS, high-Q MIM
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MOS, MIM
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MIM
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Inductors
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High-Q
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Diodes
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2:1 varactor
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Zener
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Metal Layers
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3 to 4
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2 to 3
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3 to 4
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Multiple, Thick top
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SOI Process Available
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Yes
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Yes
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Yes
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Additional Features
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Fuse programmable
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OTP memory
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Packaging
Maxim provides more than 250 package types to meet your needs for analog performance, size, cost, and reliability. Our large selection includes wafer level packaging, hybrids/modules, flip-chip, low-cost QFN, and flip-chip on lead frame.
Learn More
Contact Us to learn more about our flagship process technologies and packaging options.
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