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Tin Whisker Data
All Pb-free (lead-free) plated IC packages (excluding BGA packages) must be plated with 100% matte Sn plating.
Within 24 hours of plating completion, there must be an annealing bake step performed for a minimum of 1 hour at 150°C.
This step is required to suppress the 'whisker' growth in Sn plating.
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