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Lead-Free/RoHS Summary
Maxim/Dallas has a variety of package types that are qualified as lead-free, to satisfy your environmental ("green") objectives.
About Lead-Free and RoHS
Lead-free (Pb-free) packages offered by Maxim/Dallas are RoHS compliant. (RoHS compliant means that the part is free of lead, cadmium, chromium, mercury, PBB's and PBDEs. Since none of our processes or parts use or contain cadmium, chromium, mercury, PBB's and PBDEs, lead is the only substance that applies to our parts and therefore, if we designate that a part is lead-free, it is also RoHS compliant.)
Finding RoHS / Lead-Free Status and Materials Content Data
The best way to check your parts is with our easy, self-service lookup. You can look up one part at a time, or check many at once.
Lookup Lead-Free/RoHS Products and Content Data
Lead-Free and RoHS Marking
A "+" symbol in the full part number of Maxim/Dallas parts indicates a part that is qualified as lead-free and RoHS-compliant.
A "#" symbol in the full part number of Maxim/Dallas parts indicates a part that is RoHS-compliant and exempt from lead-free requirements.
The "+" symbols are also marked on the package. This is documented in Maxim spec 07-0002 Rev. 7.1.2.4 (PDF, 34K).
Examples:
MAX3095EEE-T contains lead
MAX3095EEE+T is lead-free and RoHS compliant
MAX3095EEE#T would be RoHS-compliant but contains lead and is exempt from lead-free requirements.
Additional suffix codes: See Maxim/Dallas Naming Conventions and the full (PDF) data sheet for the part.
Packages Qualified as Lead-Free
Our standard packages qualified as lead-free have a solder reflow profile with a peak reflow temperature of 255 (+5/-0) degrees Celsius. The following table provides a listing of package types that are currently qualified as lead-free.
Maxim Standard Packages Qualified for Lead-Free Solder Reflow Profile
(Peak Reflow Temp. 255 +5/-0 degree C) |
| Package |
Pin Count |
| BGA |
256 |
| CSBGA |
16,25,100,144,169,256 |
| FCLGA |
48,64 |
| HSBGA |
484 |
| LQFP |
32,48,52,64,100,128,144 |
| MicroDFN |
6,8,10 |
| MQFP |
44,80,100 |
| PDIP |
8,14,16,18,20,24,28,40 |
| PLCC |
20,28,44,52,68 |
| PR35 |
3 |
| QFN |
12,16,32,36,40,44,48,68 |
| QSOP |
16,20,24,28 |
| SC-70 |
3,4,5,6 |
| SFN |
2 |
| SOIC |
8,14,16,18,20,24,28 |
| SOT-143 |
4 |
| SOT-23 |
3,5,6,8 |
| SOT23 |
3,5 |
| SSOP |
14,16,20,24,28,36 |
| ST223 |
3 |
| T2 CSP RDL |
6 |
| TDFN |
6,8,10,14 |
| TEBGA |
484 |
| Thin LGA |
6,64,84 |
| THIN QFN |
8,12,16,20,24,28,32,36,38,40,42,44,48,56,68 |
| THIN QFN (Dual) |
6,8,10,14 |
| TO92 |
2,3 |
| TQFN |
16,24 |
| TQFP |
32,44,48,64,80,100,144 |
| TSOC |
6 |
| TSOP |
28,32 |
| TSSOP |
8,14,16,20,24,28,38,48 |
| TSSOP-Epad |
28 |
| UCSP |
16,18,47 |
| Ultra Thin MicroDFN |
6 |
| Ultra Thin QFN |
16 |
| uMAX |
8,10 |
| uSOP |
8,10 |
| Uttra Thin QFN |
10 |
| WLP |
6,8,9,12,15,16,18,20,24,36,45,46,49,56,60,81,100,126,182 |
Lead and Lead-Free Solder Usage
The vast majority of Dallas Semiconductor/Maxim Integrated Products package types are qualified as lead-free, and have a surface finish that is comprised of 100% matte tin. Like other semiconductor companies, there are a few legacy packages which use tin/lead solders and/or tin/lead solder plating for the surface finish of lead frames. These packages are deemed as "leaded."
Peak Reflow
The peak reflow temperature for lead-free parts is 255 (+5/-0) degrees Celsius. Use a reflow profile that complies with JEDEC 020C.
Plating Thickness
Lead frames for all parts have a plating thickness of 400 - 800 microinches (µ-inch), or 10 to 20 microns.
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