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Lead-Free/RoHS Summary
Maxim has a variety of package types that are qualified as lead-free, to satisfy your environmental ("green") objectives.
About Lead-Free and RoHS
Lead-free (Pb-free) packages offered by Maxim are RoHS compliant. (RoHS compliant means that the part is free of lead, cadmium, chromium, mercury, PBBs and PBDEs. Since none of our processes or parts use or contain cadmium, chromium, mercury, PBBs and PBDEs, lead is the only substance that applies to our parts and therefore, if we designate that a part is lead-free, it is also RoHS compliant.)
Finding RoHS/Lead-Free Status and Materials Content Data
This search does not provide material content data and RoHS compliance status for wafer or die products. They are considered RoHS compliant due to the absence of RoHS substances or RoHS exemptions.
Lookup Lead-Free/RoHS Products and Content Data
Lead-Free and RoHS Marking
Maxim has extensive RoHS and materials programs and new parts are being qualified daily. If your part is not yet available in a lead-free version, please contact your local Maxim sales representative or customer service representative to learn when it is scheduled. If you do not know who your customer service rep or sales person is, contact
Examples
MAX3095EEE-T contains lead
MAX3095EEE+T is lead-free and RoHS compliant
MAX3095EEE#T would be RoHS-compliant, but contains lead and is exempt from lead-free requirements.
Additional suffix codes: See Maxim Naming Conventions and the full (PDF) data sheet for the part.
Packages Qualified as Lead-Free
Lead-Free/RoHS Package and Technical Information (including lead-free package marking, packages qualified as lead-free, technical information).
Maxim Standard Packages Qualified for Lead-Free Solder Reflow Profile
(Peak Reflow Temp 255 (+5/-0) °C) |
| Package |
Pin Count |
|
6,25,90,100 |
| 14TDFN3x3 |
14 |
| Au Bump / COF |
|
| BGA |
256,300 |
| CABGA |
256 |
| CSBGA |
16,25,49,81,100,144,169,256,376 |
| FBGA |
16,256 |
| FCLGA |
48,64 |
| hs-bga |
484 |
| HSBGA |
256,448,484 |
| L-FPBGA-OM-LF |
49,72,100 |
| LCCC |
10 |
| LFBGA |
88,100,376 |
| LPCC |
32 |
| LQFP |
32,48,52,64,100,128,144,176,208 |
| LSBGA |
484 |
| MicroDFN |
6,8,10 |
| MQFP |
44,80,100 |
| ODFN |
|
| PBGA-HS |
676 |
| PDIP |
8,14,16,18,20,24,28,40 |
| PLCC |
20,28,44,52,68 |
| PR35 |
3 |
| QFN |
2,12,16,20,24,28,32,36,40,44,48,52,68 |
| QSOP |
16,20,24,28 |
| SBGA |
484 |
| SC-70 |
3,4,5,6,8 |
| SFN |
2 |
| SOIC |
8,14,16,18,20,24,28 |
| SOT 223 |
3 |
| SOT-143 |
4 |
| SOT-23 |
3,5,6,8 |
| SOT23 |
5 |
| SSOP |
14,16,20,24,28,36 |
| ST223 |
3 |
| TCBGA |
100,144,256 |
| TDFN |
6,8,10,14,28 |
| TDLGA |
6 |
| TEBGA |
400,484,564 |
| tepbga |
448 |
| TFBGA |
248 |
| Thin LGA |
6,64,84 |
| THIN QFN |
8,12,16,20,24,28,32,36,38,40,42,44,48,56,68 |
| THIN QFN (Dual) |
6,8,10,14 |
| THIN QFN Top Exposed Pad |
68 |
| TO92 |
2,3 |
| TQFN |
12,28,32,36,38,48,56 |
| TQFP |
32,44,48,64,80,100,144 |
| TSOC |
6 |
| TSOP |
28,32 |
| TSSOP |
8,14,16,20,24,28,38,48,56 |
| TSSOP-Epad |
28 |
| UCSP |
4,6,8,9,12,16,20,25,30,36 |
| UCSP Maxfilm |
4,6,12,16,20 |
| Ultra Thin MicroDFN |
6 |
| Ultra Thin QFN |
16 |
| uMAX |
8,10 |
| uSOP |
8,10 |
| Uttra Thin QFN |
10 |
| W-LPCC-LF |
6 |
| WLP |
4,6,8,9,12,15,16,20,24,25,28,30,32,36,40,42,45,46,48,49,56,58,60,63,67,70,81,100,110,132,144,225 |
| WLP HC |
24 |
Lead and Lead-Free Solder Usage
Environmental Materials Management
Peak Reflow
To check a single part number, enter the part number and click Search. You can enter the full, orderable part number, including prefix and suffix letters, such as MAX232CPE or partial numbers like MAX232.
Plating Thickness
Lead frames for all parts have a plating thickness of 400 to 800 microinches (µ-inch), or 10 to 20 microns.
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