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ICP Analytical Summary for Molding Compounds
| Package Type |
Molding Compound/Plastic |
Cadmium Result |
| Thin QFN (4x4x0.8mm), 24 Pin |
CEL9200BC |
less than 5ppm |
| PDIP (.300), 24 Pin |
EME6300H |
less than 5ppm |
| SOIC (.150), 8 Pin |
EME6300H |
less than 5ppm |
| QSOP (.150), 20 Pin |
EME6600A |
less than 5ppm |
| QSOP (.150), 16 Pin |
EME6600CS |
less than 5ppm |
| QSOP (.150), 16 Pin |
EME6600CS |
less than 5ppm |
| SOIC (.150), 8 Pin |
EME6600CS |
less than 5ppm |
| SOIC (.150), 8 Pin |
EME6600CS |
less than 5ppm |
| µMAX (3x3mm), 10 Pin |
EME6600HR |
less than 5ppm |
| µMAX (3x3mm), 8 Pin |
EME6600HR |
less than 5ppm |
| SOIC (.150), 8 Pin |
EME6600RA |
less than 5ppm |
| SOT-23, 8 Pin |
EME6710S |
less than 5ppm |
| SSOP (.209), 28 Pin |
EME6730B |
less than 5ppm |
| µMAX (3x3mm), 10 Pin |
EME7320A |
less than 5ppm |
| µMAX (3x3mm), 8 Pin |
EME7320A |
less than 5ppm |
| TQFP (7x7x1.4mm), 48 Pin |
EME7320AR |
less than 5ppm |
| TQFP (7x7x1.4mm), 48 Pin |
EME7320CR |
less than 5ppm |
| QFN (6x6x0.9mm), 40 Pin |
EME7351T |
less than 5ppm |
| SSOP (.209), 24 Pin |
G700 |
less than 5ppm |
| SSOP (.209), 28 Pin |
G700 |
less than 5ppm |
| TQFP, 48 Pin |
G700L |
less than 5ppm |
| µMAX (3x3mm), 10 Pin |
KMC184-7 |
less than 5ppm |
| µMAX (3x3mm), 8 Pin |
KMC184-7 |
less than 5ppm |
| QSOP (.150), 16 Pin |
KMC184VA |
less than 5ppm |
| SSOP (.209), 24 Pin |
KMC184VA |
less than 5ppm |
| SSOP (.209), 28 Pin |
KMC184VA |
less than 5ppm |
| Thin QFN (4x4x0.8mm), 24 Pin |
KMC218 |
less than 5ppm |
| QSOP (.150), 16 Pin |
MP8000AN |
less than 5ppm |
| SC-70, 5 Pin |
MP8000AN |
less than 5ppm |
| SSOP (.209), 16 Pin |
MP8000AN |
less than 5ppm |
| SSOP (.209), 28 Pin |
MP8000AN |
less than 5ppm |
| SC-70, 5 Pin |
MP8000ANF |
less than 5ppm |
| SC-70, 5 Pin |
MP8000CH4 |
less than 5ppm |
| µMAX (3x3mm), 10 Pin |
MP8000CH4 |
less than 5ppm |
| µMAX (3x3mm), 8 Pin |
MP8000CH4 |
less than 5ppm |
| SC-70, 5 Pin |
MP8000CH4E |
less than 5ppm |
| SC-70, 5 Pin |
MP8000CSM |
less than 5ppm |
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