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	Maxim > EMMI > Material Test Data Files

	Material Test Data Files Packing Materials Packing Materials Inventory List Material Test Data for Flip Chip Devices Flip_Chip_Backside_Lamination_Lintec_LC2850_13-MAY-2005 (PDF, 447kB) Material Test Data for Sputtering Targets Sputtering_Targets_Copper_03-JULY-2007 (PDF, 122kB) Sputtering_Targets_for_UBM (PDF, 50kB) Sputtering_Targets_TITANIUM_4SUBS_09-28-2007 (PDF, 205kB) WLP_Sputtering_Targets_and_Sn_Pb_Plating_Anodes_10-15-06 (PDF, 128kB) Material Test Data for BCB Materials BCB_CYCLOTENE_4024-40_DATASHEET (PDF, 20kB) BCB_EPOXY-4024_6SUBS_08-23-07 (PDF, 196kB) BCB_Resin_PBB_PBDE (PDF, 90kB) BCB_Resin_Pb_Cr+6_Hg_Cd (PDF, 42kB) Material Test Data for Branding Inks BRANDING_INK_INK_TYPE_B (PDF, 129kB) INK MARKEM 4488 Black "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated terphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), select Azo, Mirex, Tetrabromobisphenol A Bis (TBBP-A)" July 18, 2007 CE/2007/72436 SGS (PDF, 364kB) INK MARKEM 4488 White "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" February 22, 2008 N/A N/A (PDF, 15kB) INK MARKEM 4488 White TEST DATA FOR PPM/WT CONTENT OF: Bromine (Br), Chlorine (Cl), Fluorine (F), Iodine (I), Antimony (Sb) February 29, 2008 CE/2008/24093 SGS (PDF, 387kB) INK_BONMARQUE_C-SERIES-Ag_UV-WHITE_UV-BLACK_UV4-BLACK_UV-Ag_CdPb&USE-NONUSE-SUBS_03-12-2007 (PDF, 978kB) INK_MARKEM-7224-BLACK-65-A_TR6SUBS_11-20-2007 (PDF, 14kB) INK_MARKEM_13TYPES_SDOC-NON-USE_PFOS_04-10-2008 (PDF, 96kB) INK_MARKEM_4461-BLACK_TR6SUBS_12-24-2004 (PDF, 111kB) INK_MARKEM_4466-WHITE_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_4488-BLACK&WHITE_SDOC-NON-USE_PFOS+_02-13-2008 (PDF, 48kB) INK_MARKEM_4496-WHITE_TR6SUBS_11-20-2007 (PDF, 14kB) INK_MARKEM_7224-GREYF_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_7261-BLACK_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_7281-BLACK_TR6SUBS_03-27-2008 (PDF, 44kB) INK_MARKEM_7281-GREY479J_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_7281-GREY479J_6SUB_11-18-2007 (PDF, 15kB) INK_MARKEM_9060-WHITE&7281-BLACK_SDOC-CONTENT_6SUBS_03-21-2008 (PDF, 40kB) INK_MARKEM_9060-WHITE-EXH_TR6SUBS_03-21-2008 (PDF, 14kB) INK_MARKEM_9060-WHITE_TR6SUBS_03-27-2008 (PDF, 44kB) INK_OSE-APPLIED-INNOTECH_M238_6SUBS_06-18-2007 (PDF, 60kB) Material Test Data for Leadframes LEADFRAMES ACQUTEK (FOR AMKOR) Cu C-18045 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" February 4, 2008 F690501/LF-CTSAYA08-03223 SGS (PDF, 58kB) LEADFRAMES ACQUTEK (FOR AMKOR) Cu C194 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" February 4, 2008 F690501/LF0CTSAYA08-03221 SGS (PDF, 60kB) LEADFRAMES ACQUTEK (FOR AMKOR) Cu C7025 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" February 14, 2008 F690501/LF-CTSAYA08-03222 SGS (PDF, 58kB) LEADFRAMES ASM (FOR AMKOR) Cu A151 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 24, 2008 KA/2008/10991A-01R1 SGS (PDF, 536kB) LEADFRAMES ASM (FOR AMKOR) Cu A194 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 25, 2008 KA/2008/10990A-01R1 SGS (PDF, 532kB) LEADFRAMES ASM (FOR AMKOR) Cu A194 with Pd/Ni/Ag pre-plate "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" March 3, 2008 EC407669102 SGS (PDF, 294kB) LEADFRAMES ASM (FOR AMKOR) Cu C7025 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 25, 2008 KA/2008/10993A_01R1 SGS (PDF, 536kB) LEADFRAMES ASM (FOR AMKOR) EFTEC64 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 25, 2008 KA/2008/10994A-01R1 SGS (PDF, 519kB) LEADFRAMES LG MICRON (FOR AMKOR) Cu C194 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated terphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), select Azo, Mirex, Tetrabromobisphenol A Bis (TBBP-A ), Polyvinyl chloride (PVC)" November 16, 2007 KA/2007/B0623 SGS (PDF, 728kB) LEADFRAMES LG MICRON (FOR AMKOR) Cu C7025 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Polychlorinated biphenyls (PCB), Polychlorinated terphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl tin oxide (TBTO), select Azo, Mirex, Tetrabromobisphenol A Bis (TBBP-A ), Polyvinyl chloride (PVC), Asbestos" November 16, 2007 KA/2007/B0622 SGS (PDF, 719kB) LEADFRAMES PHCP (FOR AMKOR) Cu w/Ag spot plate "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 14, 2008 C-08/0022 SGS (PDF, 216kB) LEADFRAMES POONGSAN (FOR AMKOR) Cu C151 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 25, 2008 F690501/LF-CTSAYA08-02158 SGS (PDF, 248kB) LEADFRAMES POONGSAN (FOR AMKOR) Cu C194 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" April 21, 2008 F690501/LF-CTSAYAU08-07527 SGS (PDF, 296kB) LEADFRAMES POONGSAN (FOR AMKOR) Cu C7025 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" April 21, 2008 F690501/LF-CTSAYAU08-07528 SGS (PDF, 291kB) LEADFRAMES POSSEHL (FOR ISPL) Cu A194 with Ag Spot Plating "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" February 19, 2008 EC407635600 SGS (PDF, 249kB) LEADFRAMES QPL (FOR AMKOR) Cu C7025 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" April 3, 2008 EC407785203 SGS (PDF, 260kB) LEADFRAMES QPL (FOR AMKOR) Cu CDA151 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" April 3, 2008 EC407785202 SGS (PDF, 252kB) LEADFRAMES SAMSUNG TECHWIN (FOR AMKOR) Cu C151 w/Spot Ag plate "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 21, 2008 F690501/LF-CTSAYA08-1455R1 SGS (PDF, 221kB) LEADFRAMES SAMSUNG TECHWIN (FOR AMKOR) Cu C7025 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" February 25, 2008 F690501/LF-CTSAYA08-04341R1 SGS (PDF, 273kB) LEADFRAMES SAMSUNG TECHWIN (FOR UTL) EFTEC64T Preplated "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl)" May 20, 2008 F690501/LF-CTSAYAU08-07782 SGS (PDF, 302kB) LEADFRAMES SUMIKO (FOR AMKOR) Cu A194 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated terphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), select Azo, Mirex, Tetrabromobisphenol A Bis (TBBP-A ), Arsenic (As), Selenium (Se), Bismuth (Bi), Beryllium (Be), Polyvinyl chloride (PVC), select Phthalates, select Perfluorocarbons (PFC), select Chlorinated Fluorocarbons (CFC), select Halons, select HCFC, select HBFC" February 2, 2008 CA/2007/C2818R3 SGS (PDF, 2012kB) LEADFRAMES SUMIKO (FOR AMKOR) Cu C7025 w/Ag spot plate "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated terphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), select Phthalates, select Azo, Mirex, Arsenic (As), Beryllium (Be), Bismuth (Bi), Selenium (Se), Tetrabromobisphenol A Bis (TBBP-A ), Polyvinyl chloride (PVC), select Perfluorocarbons (PFC), select Chlorinated Fluorocarbons (CFC), select Halons, select HCFC, select HBFC" February 12, 2008 KA/2007/C2817R3 SGS (PDF, 1992kB) LEADFRAMES SUMIKO (FOR AMKOR) EFTEC64T w/Ag spot plate "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated terphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), select Phthalates, select Azo, Mirex, Arsenic (As), Beryllium (Be), Bismuth (Bi), Selenium (Se), Tetrabromobisphenol A Bis (TBBP-A ), Polyvinyl chloride (PVC), select Perfluorocarbons (PFC), select Chlorinated Fluorocarbons (CFC), select Halons, select HCFC, select HBFC" February 12, 2008 KA/2007/C2822R3 SGS (PDF, 1993kB) LEADFRAMES MITSU HI-TECH (FOR AMKOR) Cu C194 Spot Ag SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Tetrabromobisphenol A (TBBP-A ) January 3, 2008 C-07/1602A SGS (PDF, 874kB) LEADFRAMES MITSU HI-TECH (FOR AMKOR) Cu C194 Spot Ag SSOP leadframes "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" July 16, 2007 C-07/0671A SGS (PDF, 1271kB) LEADFRAMES QPL (FOR ASAT) ALL TYPES COPPER C7025 WITH AE SURFACE TREATMENT "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" April 3, 2008 EC407789606 SGS (PDF, 276kB) LEADFRAMES QPL (FOR ASAT) COPPER C7025 WITH AE SURFACE TREATMENT "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Antimony (Sb), Bromine (Br), Chlorine (Cl)" April 3, 2008 EC407789606 SGS (PDF, 276kB) LEADFRAMES ASM (FOR AMKOR) All types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Bromine (Br), Chlorine (Cl), Flourine (F), Tributyl tin oxide (TBTO), Antimony (Sb), Tetrabromobisphenol A (TBBP-A ) December 10, 2007 N/A N/A (PDF, 211kB) LEADFRAMES ASM (FOR AMKOR) All types SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluoroalkyl Sulfonates (PFAS), Perfluoroctyl sulfonates February 29, 2008 N/A N/A (PDF, 432kB) LEADFRAMES ASM (FOR ISPL & AMKOR) COPPER A194 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 28, 2008 KA/2008/10990A-01R2 SGS (PDF, 524kB) LEADFRAMES DYNACRAFT (FOR CARSEM) COPPER C194 WITH SPOT SILVER PLATE "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 31, 2008 LPCI/24550/07 SGS (PDF, 224kB) LEADFRAMES_AMKOR-ACQUTEK_5TYPES_SDOC-NON-USE_8SUBS_03-03-2008 (PDF, 110kB) LEADFRAMES_AMKOR-LGMICRON_SDOC-NON-USE_PFOS_11-13-2007 (PDF, 325kB) LEADFRAMES_AMKOR-POONGSAN_C914R-MULTITYPES_SDOC-NON-USE_PFOS+_02-04-2008 (PDF, 22kB) Leadframes_AMKOR-POSSEHL_SPOT-Ag-A194_SDOC-NON-USE_PFOS+_01-16-2008 (PDF, 37kB) LEADFRAMES_AMKOR-QPL_SDOC-NON-USE_PFOS+_01-15-2008 (PDF, 161kB) LEADFRAMES_AMKOR-SAMSUNG-TECHWIN_C194-SPOTAg_TR9SUBS_02-25-2008 (PDF, 106kB) LEADFRAMES_AMKOR-SHINKO_16PDIP_SDOC-NON-USE_PFOS_PFAS_02-12-2008 (PDF, 27kB) LEADFRAMES_AMKOR-SUMIKO_SDOC-NON-USE_PFOS+_01-31-2008 (PDF, 29kB) Leadframes_Amkor_EFTEC64T (PDF, 156kB) Leadframes_ASAT-QPL_ALL-TYPES_SDOC-NON-USE_PFOS_08-11-2007 (PDF, 75kB) Leadframes_ASM_SDOC_8SUBS-NON-USE_01-10-2008 (PDF, 479kB) Leadframes_ASM_Technology_A194_1-29-07 (PDF, 144kB) Leadframes_CARSEM-DYNACRAFT_16TYPES_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 1200kB) LEADFRAMES_CARSEM-DYNACRAFT_ALLOY42-SPOTAg-TYPES_6SUBS_01-30-2008 (PDF, 145kB) LEADFRAMES_CARSEM-DYNACRAFT_TR44SUBS_08-31-2007 (PDF, 540kB) Leadframes_Dynacraft_Industries_C104_Ag_Spot_31-JAN-2007 (PDF, 272kB) Leadframes_Dynacraft_Industries_C151_C7025_C194_Alloy 42 (PDF, 179kB) Leadframes_Dynacraft_SDOC-NON-USE_TBBPA_16-LEADFRAME-TYPES_12-10-2007 (PDF, 45kB) LEADFRAMES_HANA-ASM_CuA194_TR6SUBS_01-28-2008 (PDF, 975kB) LEADFRAMES_HANA-JADE_CuC194-AgSPOT_TR6SUBS_01-18-2008 (PDF, 249kB) Leadframes_HANA-JADE_SDOC-NON-USE-8SUBS_01-16-2008 (PDF, 19kB) LEADFRAMES_HANA-MITSUHITEC_CuA194-AgPLATE_TR6SUBS_03-12-2007 (PDF, 89kB) LEADFRAMES_HANA-QPL_Cu194-AgPLATE_TR6SUBS_04-02-2007 (PDF, 221kB) LEADFRAMES_ISPL-ASM_ALL-TYPES_SDOC-NON-USE_6SUBS_01-31-2007 (PDF, 244kB) LEADFRAMES_ISPL-ASM_CuA194-AgPLATE_6SUBS_01-30-2007 (PDF, 630kB) LEADFRAMES_ISPL-ASM_CuA194-AgPLATE_TR6SUBS_01-29-2007 (PDF, 47kB) LEADFRAMES_ISPL-ASM_CuA194_SDOC-NON-USE_6SUBS_01-31-2008 (PDF, 143kB) Leadframes_Mitsubishi_CCL-H_HL-830NB_832NB_830NX_832NX_ GHPL-830NB_832NB_830NX_832NX_10-JAN-2006 (PDF, 144kB) Leadframes_MITSUI_PDIP-8&14L-300MIL_SDOC-NON-USE-10SUBS_12-27-2007 (PDF, 86kB) Leadframes_NSEB_A194 (PDF, 299kB) Leadframes_NSEB_Cu-C194-Spot-Ag_Sumitomo_6subs_08-06-2007 (PDF, 254kB) Leadframes_OSE-DYNACRAFT_SPOT-Ag-CuC7025-TSSOP-TYPES_6SUBS_05-18-2007 (PDF, 193kB) LEADFRAMES_OSE-POONGSAN_ALL-TYPES_SDOC-NON-USE_PFOS_PFAS_03-19-2008 (PDF, 92kB) Leadframes_OSE-POONGSAN_CuC194-TSOC-TYPES_6SUBS_05-04-2007 (PDF, 248kB) LEADFRAMES_OSE-SAMSUNG-TECHWIN_SPOTAg-CuC194_TR6SUBS-BrCl-PFOS_02-25-2008 (PDF, 103kB) Leadframes_OSEP-SAMSUNG_CuC194-SOIC-TYPES_6SUBS_05-11-2007 (PDF, 117kB) Leadframes_Poongsan_Microtec_Corp_CuAlloy_C194_07-FEB-2007 (PDF, 116kB) Leadframes_QPL_Limited_194_NiPdAu_Plating_02-APR-2007 (PDF, 216kB) Leadframes_QPL_SDOC_7SUBS-NON-USE_01-11-2008 (PDF, 143kB) LEADFRAMES_SCS-ASM_C7025_SpotAg_6SUBS_01-29-2007 (PDF, 345kB) Leadframes_Silver Plated_C7025 (PDF, 137kB) Leadframes_Taiyo_PSR-4000_18-MAY-2006 (PDF, 94kB) Leadframes_Tatsuta_BT_Substrates_AE-1125HD_18-AUG-2006 (PDF, 254kB) Leadframes_UTL-DYNACRAFT_CuC7025-SPOT-Ag_6SUBS_05-18-2007 (PDF, 198kB) LEADFRAME_ASAT-QPL_ALL-TYPES_SDOC-NON-USE_PFOS_08-11-2007 (PDF, 75kB) LEADFRAME_ASAT-QPL_C194-AgPLATE+AE_TR6SUBS_04-02-2007 (PDF, 216kB) LEADFRAME_CARSEM-DYNACRAFT_CuC7025-SPOTAg_TR44SUBS_01-12-2007 (PDF, 462kB) Leadframe_NSEB_Cu-C194-Spot-Ag_Sumitomo_6subs_08-06-2007 (PDF, 274kB) LEADREAMES_OSE-DYNACRAFT_ALL-TYPES_SDOC-NON-USE_PFOS_PFOA_02-12-2008 (PDF, 78kB) Material Test Data for Die Attach ABLESTIK Ablebond 2300 TEST DATA FOR PPM/WT CONTENT OF Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I) December 12, 2007 CE/2007/C1477 SGS (PDF, 323kB) ABLESTIK ABLEBOND 8390A SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), PERFLUOROOCTANIC ACID ( PFOA) May 8, 2008 NA NA (PDF, 24kB) ABLESTIK ABLEBOND 8390A TEST DATA FOR PPM/WT CONTENT OF Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I) July 3, 2007 CE/2007/65666 SGS (PDF, 277kB) ABLESTIK ABLEBOND 8390A TEST DATA FOR PPM/WT CONTENT OF: Cadmium (Cd), Hexavalent Chromium (CrVI), Lead (Pb), Mercury (Hg), Polybrominated biphenyl (PBB), Polybrominated diphenyl ether (PBDE) December 12, 2007 CE/2007/C1552 SGS (PDF, 331kB) Ablestik_SDOC-NON-USE-OF_PFOS_09-04-2007 (PDF, 83kB) Ablestik_SDOC-NON-USE_PFC-PFOS-4OTHERS_FOR-8290_8200T_84-1LMISR4_12-17-2007 (PDF, 40kB) Ablestik_SDOC-NON-USE_TBBPA_ABLEBOND_14-TYPES-DIE-ATTACH_12-03-2007 (PDF, 35kB) Ablestik_SDOC_ABLEBOND_84-1LMISR4_8390A_2200D_8006NS_SbBrCl_09-26-2007 (PDF, 99kB) DIE ATTACH ABLESTIK ABLEBOND 2200 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" November 30, 2007 CE/2007/B6562 SGS DIE ATTACH ABLESTIK ABLEBOND 84-1LMI "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" December 3, 2007 CE/2007/B6960 SGS (PDF, 333kB) DIE ATTACH ABLESTIK ABLEBOND JM7000 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" December 3, 2007 CE/2007/B7087 SGS DIE ATTACH SUMITOMO CRM-1076E "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" September 13, 2007 ATS/GENV/1920/07/sk ALS (PDF, 246kB) Die_Attaches_All_Ablestik_Products (PDF, 72kB) DIE_ATTACH_ABLEBOND-8290_BrClFI_12-12-2007 (PDF, 170kB) Die_Attach_ABLEBOND_10TYPES_SDOC-NON-USE_PFOS_11-06-2007 (PDF, 32kB) DIE_ATTACH_ABLEBOND_10TYPES_SDOC-NON-USE_PFOS_PFOA_BrClFI_07-06-2007 (PDF, 30kB) Die_Attach_ABLEBOND_15TYPES_SDOC-NON-USE_PFOS+_06-20-2007 (PDF, 45kB) Die_Attach_Ablebond_15TYPES_SDOC-NON-USE_PFOS+_TBBPA_RedP_01-28-2008 (PDF, 40kB) Die_Attach_Ablebond_16-PRODUCTS_SDOC-SUBS-NONUSE_05-07-2007 (PDF, 42kB) DIE_ATTACH_ABLEBOND_17TYPES_SDOC-NON-USE_PFOS+_02-19-2008 (PDF, 34kB) DIE_ATTACH_ABLEBOND_2000-8510AA-2300_SDOC-NON-USE_PFOS+_11-06-2007 (PDF, 37kB) DIE_ATTACH_ABLEBOND_2000_TR6SUBS_12-10-2007 (PDF, 324kB) Die_Attach_Ablebond_2025D_6subs_02-07-2007 (PDF, 228kB) Die_Attach_Ablebond_2033SC_6SUBS_11-30-2007 (PDF, 326kB) Die_Attach_ABLEBOND_2033SC_BrClFI_11-30-2007 (PDF, 306kB) Die_Attach_Ablebond_2200D_6SUBS_11-30-2007 (PDF, 185kB) Die_Attach_ABLEBOND_2200D_BrClFISb_11-30-2007 (PDF, 107kB) DIE_ATTACH_ABLEBOND_2300_TR6SUBS_12-12-2007 (PDF, 347kB) DIE_ATTACH_ABLEBOND_2600BT_TR6SUBS_12-10-2007 (PDF, 184kB) DIE_ATTACH_ABLEBOND_2600BT_TRBrClPSb_11-19-2007 (PDF, 280kB) Die_Attach_Ablebond_3230_6SUBS_12-12-2007 (PDF, 353kB) Die_Attach_ABLEBOND_7TYPES_SDOC-NON-USE_PFOS_01-11-2008 (PDF, 40kB) Die_Attach_Ablebond_8006NS_6SUBS_12-05-2007 (PDF, 341kB) Die_Attach_ABLEBOND_8006NS_BrClFI_12-05-2007 (PDF, 303kB) DIE_ATTACH_ABLEBOND_8006NS_TRBrClFI_01-10-2008 (PDF, 104kB) Die_Attach_Ablebond_8006_1-10-07 (PDF, 260kB) Die_Attach_Ablebond_8200C_6SUBS_11-30-2007 (PDF, 189kB) Die_Attach_Ablebond_8200C_84-1LMISR4_SDOC-NO-FR-USED_10-25-2007 (PDF, 36kB) Die_Attach_Ablebond_8200T_6SUBS_11-30-2007 (PDF, 185kB) Die_Attach_Ablebond_8200T_BrClFI_07-31-2007 (PDF, 106kB) Die_Attach_Ablebond_8290_6SUBS_12-12-2007 (PDF, 185kB) Die_Attach_Ablebond_8361J_6SUBS_12-10-2007 (PDF, 309kB) DIE_ATTACH_ABLEBOND_84-1LMISNB_TRBrClFI_12-03-2007 (PDF, 307kB) Die_Attach_Ablebond_84-1LMISR4_6SUBS_12-10-2007 (PDF, 185kB) DIE_ATTACH_ABLEBOND_84-1LMISR4_BrClFI_12-10-2007 (PDF, 193kB) Die_Attach_Ablebond_84-1LMISR4_ClFBrI_07-03-2007 (PDF, 284kB) Die_Attach_Ablebond_84-1LMISR4_MULTISUBS_12-03-2007 (PDF, 295kB) DIE_ATTACH_ABLEBOND_84-3J_6SUBS_12-03-2007 (PDF, 186kB) DIE_ATTACH_ABLEBOND_84-3J_BrClFI_07-03-2007 (PDF, 302kB) DIE_ATTACH_ABLEBOND_8600_6SUBS_11-30-2007 (PDF, 348kB) DIE_ATTACH_ABLEBOND_9TYPES_SDOC-NON-USE_PFOS_PFAS_02-11-2008 (PDF, 34kB) Die_Attach_ABLEBOND_9TYPES_SDOC-NON-USE_PFOS_PFOA_02-11-2008 (PDF, 31kB) DIE_ATTACH_ASAT-SUMITOMO_CRM-9TYPES_SDOC-NON-USE_PFOS_11-01-2007 (PDF, 14kB) Die_Attach_CARSEM-HENKEL_QMI-591&536_02-01-2008 (PDF, 41kB) DIE_ATTACH_CARSEM-HENKEL_QMI519_SDOC-NON-USE_BrClSb_10-31-2007 (PDF, 125kB) Die_Attach_HANA-ABLEBOND_13TYPES_SDOC-30SUBS-REPORT_02-07-2008 (PDF, 39kB) DIE_ATTACH_HANA-ABLEBOND_SDOC-NON-USE_PFOS_PFAS_09-04-2007 (PDF, 84kB) DIE_ATTACH_HENKEL_QMI2419MA_SDOC-NON-USE_PFOS+_02-19-2008 (PDF, 43kB) DIE_ATTACH_HENKEL_QMI519_TR6SUBS_07-19-2007 (PDF, 128kB) Die_Attach_Henkel_QMI529LB_6Subs_07-12-2007 (PDF, 121kB) DIE_ATTACH_HENKEL_QMI536_TR6SUBS_01-18-2008 (PDF, 837kB) DIE_ATTACH_HITACHI_EN4900-F-1_TR6SUBS_02-23-2005 (PDF, 39kB) DIE_ATTACH_OSE-HITACHI_EN4900G-TYPES_6SUBS_06-19-2007 (PDF, 161kB) DIE_ATTACH_OSE-HITACHI_EN4900G-TYPES_SDOC-NON-USE_HALOGENS_02-21-2008 (PDF, 364kB) Die_Attach_OSEP-HITACHI_EN-4900G_6SUBS_05-28-2007 (PDF, 165kB) DIE_ATTACH_SUMITOMO_CRM-1525D_TR6SUBS_12-27-2007 (PDF, 337kB) Die_Attach_Sumitomo_CRM1076E (PDF, 49kB) Material Test Data for Bond/Bump Wire BOND WIRE MKE (FOR AMKOR) Au Bond Wire Type 3N "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Antimony (Sb)" January 14, 2008 CE/2008/11715 SGS (PDF, 314kB) BOND WIRE MKE (FOR ASAT) Au Bond Wire Type 2N "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 15, 2008 CE/2008/11714D SGS (PDF, 246kB) BOND_WIRE_AMKOR&CIRTEK-HERAEUS_Au-BOND-WIRE_6SUBS_01-22-2008 (PDF, 55kB) BOND_WIRE_AMKOR&SCS-TANAKA_Au_6SUBS_01-04-2008 (PDF, 148kB) BOND_WIRE_AMKOR-HERAEUS_ALLTYPES_SDOC-NON-USE_6SUBS_R03-10-2008 (PDF, 153kB) BOND_WIRE_AMKOR-HERAEUS_ALLTYPES_SDOC-NON-USE_PFOS+_R20-18-2008 (PDF, 158kB) BOND_WIRE_AMKOR-HERAEUS_AuWIRE_TR6SUBS_05-28-2007 (PDF, 588kB) Bond_Wire_AMKOR-MKE_Au-WIRE_PFOS_05-02-2007 (PDF, 105kB) Bond_Wire_AMKOR-MKE_Au-WIRE_SDOC-CONTENT-USE_8SUBS_01-14-2008 (PDF, 65kB) BOND_WIRE_AMKOR-MKE_AuWIRE-2N_TR91SUBS_01-15-2008 (PDF, 645kB) BOND_WIRE_AMKOR-MKE_AuWIRE-HTS_SDOC-NON-USE_PFOS+_10-25-2007 (PDF, 80kB) BOND_WIRE_AMKOR-TANAKA_Au-1MILGPG_SDOC-NON-USE_PFOS+_10-05-2007 (PDF, 21kB) Bond_Wire_AMKOR-TANAKA_Au-2TYPES_SDOC-NON-USE_PFOS+_01-15-2008 (PDF, 24kB) BOND_WIRE_AMKOR-TANAKA_AuWIRE_TR-BrClFISb_01-16-2008 (PDF, 139kB) BOND_WIRE_AMKOR-TANAKA_AuWIRE_TR-PFOS-PFOA_02-21-2008 (PDF, 125kB) BOND_WIRE_AMKOR-TANAKA_AuWIRE_TR-R6SUBS_01-04-2008 (PDF, 154kB) BOND_WIRE_ASAT-MKE_AuWIRE-TYPE4N_TR6SUBS_08-13-2007 (PDF, 227kB) BOND_WIRE_ASAT-MKE_AuWIRE_SDOC-NON-USE_CdHgCrVI_PBB_PBDE_PFOS_PFAS_01-18-2008 (PDF, 14kB) Bond_Wire_CARSEM-TANAKA_AU-WIRE_SDOC-NON-USE_PFOS+_02-04-2008 (PDF, 41kB) BOND_WIRE_ISPL-HEREAUS_AuWIRE_22SUBS_07-13-2007 (PDF, 775kB) BOND_WIRE_ISPL-TANAKA_AuWIRE_TR6SUBS_01-05-2007 (PDF, 129kB) BOND_WIRE_MKE_AuWIRE_PFOS_05-02-2007 (PDF, 105kB) Bond_Wire_OSEP-HERAEUS_AU-TYPES-HD2BE-HD5CE-HD6CA_6SUBS_01-22-2008 (PDF, 55kB) BOND_WIRE_SC-K&S_AuWIRE-RADIX-3N_TR6SUBS_10-12-2007 (PDF, 398kB) BOND_WIRE_SCS-K&S_Au-AW14_6SUBS_12-25-2007 (PDF, 415kB) BOND_WIRE_SPIL-SUMITOMO_Au-NLF-NLF1-NLFA_TR4MET_04-04-2005 (PDF, 40kB) BOND_WIRE_SPIL-SUMITOMO_Au-NLF-NLF1-NLFA_TR4MET_04-04-2005 (PDF, 40kB) Bond_Wire_UTL-TANAKA_SDOC-NON-USE_PFOS_PFOA_06-15-2007 (PDF, 114kB) Gold_Wire_Carsem-TANAKA_ALL_TYPES_6SUBS_08-13-2007 (PDF, 187kB) Gold_Wire_HANA-TANAKA_SDOC-NON-USE_PFOS_ALL-WIRE-TYPES_R01-25-2008 (PDF, 61kB) Gold_Wire_Heraeus_Oriental_Hitec_Co._Au_Wire_02-FEB-2007 (PDF, 99kB) Gold_Wire_HEREAUS_ALL-WIRE-TYPES_SDOC-NON-USE-6SUBS_12-24-2007 (PDF, 90kB) Gold_Wire_MK_Electron_Co._4N_16-JAN-2007 (PDF, 202kB) Gold_Wire_Tanaka_4N_6SUBS_01-05-2007 (PDF, 129kB) Gold_Wire_Tanaka_ALL_TYPES_01-04-2008 (PDF, 151kB) Gold_Wire_TANAKA_ClFBrI_Sb2O3_07-17-2006 (PDF, 305kB) Gold_Wire_Tanaka_NSEB_05-JAN-2007 (PDF, 128kB) Gold_Wire_Tanaka_SDOC-NON-USE-TBBPA_ALL-GOLD-BOND-WIRE-TYPES_12-16-2007 (PDF, 157kB) Gold_Wire_Tanaka_SDOC-NON-USE_TBBP-A_12-06-2007 (PDF, 162kB) Gold_Wire_Tanaka_SGS_Labs_6-13-06 (PDF, 125kB) HERAEUS (FOR AMKOR) GOLD (Au) BOND WIRE TYPES HA3, HA5, HA6, HA9, H10 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 22, 2008 LF-CTSQYA08_01753 SGS (PDF, 55kB) HEREAUS (FOR AMKOR) Au wire, multiple types "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated triphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), Azo, Mirex, Tetrabromobisphenol A (TBBP-A )" July 13, 2007 F690501/LF-CTSAYA0-1545 2 SGS (PDF, 645kB) MKE (FOR AMKOR) Au wire Type 4N "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated Napthalenes (PCN), Polyvinyl Chloride (PVC), Tributyl Tin (TBT), Triphenyl Tin (TPT), Azo, Mirex, Tetrabromobisphenol A (TBBP-A ), Select Phathalates, Select HydroFluoroCarbons (HFC), Select PerFluoroCarbons (PFC), Beryllium (Be), Cesium (Ce), Thallium (Th), Uranium (U), Strontium (Sr)" January 15, 2008 CE/2008/11713A SGS (PDF, 268kB) Material Test Data for Molding Compound ENCAP_HENKEL_FP4451_FP4549_MCL-200C_SDOC-NON-USE_PFOS_11-02-2007 (PDF, 48kB) ENCAP_NAGASE-CHEMTEX_T693-R1001_T693-R1004_SODC-CONTENT_PFOS_10-31-2007 (PDF, 40kB) ENCAP_NAGASE-CHEMTEX_T693-R1001_T693-R1004_TR11SUBS_06-29-2007 (PDF, 106kB) ICP Analytical Summary for Molding Compounds MOLD COMPOUND NITTO DENKO MP-8000C Series "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" February 22, 2008 LPCI/03265/08 SGS (PDF, 111kB) MOLD COMPOUND NITTO DENKO MP-8000C Series "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" February 22, 2008 LPCI/03265/08 SGS (PDF, 111kB) MOLD COMPOUND SHINESTU KMC-3580-P "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" April 9, 2008 LPCI/06769/08 SGS (PDF, 207kB) MOLD COMPOUND SUMITOMO EME-6600CR "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 8, 2008 SH8002110/CHEM SGS (PDF, 104kB) MOLD COMPOUND SUMITOMO EME-6600CS "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" January 16, 2008 1011181B/08 (1) SGS (PDF, 228kB) MOLD COMPOUND SUMITOMO EME-7730L "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" June 4, 2007 KA/2007/B6562 SGS (PDF, 465kB) MOLD COMPOUND SUMITOMO EME-G600 Type "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" December 6, 2007 10108346A/07 (1) SGS (PDF, 222kB) MOLD COMPOUND SUMITOMO EME-G770C "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" April 8, 2008 KA/2008/40049 SGS (PDF, 495kB) MOLD_COMPOUND_AMKOR-NITTO_15TYPES_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 60kB) Mold_Compound_AMKOR-NITTO_MP8000CH4A2_SDOC-NON-USE_PFOS+_01-16-2008 (PDF, 63kB) MOLD_COMPOUND_AMKOR-SUMITOMO_26TYPES_SDOC-NON-USE_4SUBS_06-18-2007 (PDF, 35kB) MOLD_COMPOUND_AMKOR-SUMITOMO_8TYPES_SDOC-NON-USE_PFOS+_01-22-2008 (PDF, 507kB) Mold_Compound_ASAT-SUMITOMO_CRN1525D_CRM1076W_EME-G700_SDOC-NON-USE_PFOS_01-22-2008 (PDF, 310kB) MOLD_COMPOUND_ASAT-SUMITOMO_EME-9TYPES_SDOC-NON-USE_PFOS_11-01-2007 (PDF, 14kB) Mold_Compound_ASAT-SUMITOMO_EME-G770C_EME-G700_SDOC-CONTENT-REPORT_09-13-2004 (PDF, 62kB) Mold_Compound_CARSEM-HITACHI_CEL-92-4TYPES_SDOC-NON-USE_PFOS_01-28-2008 (PDF, 334kB) MOLD_COMPOUND_CARSEM-HITACHI_CEL9220HF&VTYPE_SDOC-NON-USE_BrClSb_10-30-2007 (PDF, 18kB) MOLD_COMPOUND_CARSEM-NITTO_18TYPES_SDOC-NON-USE_PFOS_02-20-2008 (PDF, 216kB) Mold_Compound_CARSEM-SUMITOMO_32TYPES_SDOC-NON-USE_PFOS_01-31-2008 (PDF, 418kB) Mold_Compound_CEL_9200BC_01-JUN-2006 (PDF, 529kB) Mold_Compound_EME-G600_6SUBS_10-02-2007 (PDF, 258kB) Mold_Compound_HANA-NITTO_MP-8000CH4_SDOC-CONTENT-REPORT_04-23-2007 (PDF, 112kB) Mold_Compound_HANA-NITTO_SDOC_MP-8000CH4_25SUBS_04-23-2007 (PDF, 112kB) Mold_Compound_HANA-SUMITOMO_9TYPES_SDOC-SUBS-DISCOLOSURE_12-26-2007 (PDF, 552kB) Mold_Compound_HITACHI_4TYPES_SDOC-NON-USE_TBBPA_12-13-2007 (PDF, 23kB) Mold_Compound_HITACHI_CEL-9220HF-4TYPES_SDOC-NON-USE_10SUBS_12-27-2007 (PDF, 390kB) Mold_Compound_Hitachi_CEL9220HF13_29-JUN-2007 (PDF, 219kB) Mold_Compound_ISPL-SUMITOMO_EME-G770HCD_SDOC-NON-USE_PFOS_PCT_TBBPA_12-21-2007 (PDF, 53kB) Mold_Compound_KMC-184-7_12-MAR-2007 (PDF, 233kB) Mold_Compound_NITTO_6TYPES_SDOC-NON-USE_PFOS+_PFC_TBBPA_RED-P_01-10-2008 (PDF, 214kB) Mold_Compound_Nitto_GE-100series_6Subs_04-13-2007 (PDF, 276kB) Mold_Compound_NITTO_MOLD-COMPOUND-SDOC_18-TYPES_FOR_TBBPA_BrClSb_12-07-2007 (PDF, 62kB) Mold_Compound_NITTO_MP-8000CH4_SDOC-NON-USE_6SUBS_01-03-2008 (PDF, 206kB) Mold_Compound_Nitto_MP7400_Series_07-AUG-2006 (PDF, 134kB) MOLD_COMPOUND_NITTO_MP8000-Aseries_6SUBS_07-20-2007 (PDF, 149kB) MOLD_COMPOUND_NITTO_MP8000-Aseries_6SUBS_07-26-2007 (PDF, 149kB) Mold_Compound_NITTO_MP8000AN_SDOC-NON-USE-6SUBS_12-21-2007 (PDF, 59kB) Mold_Compound_Nitto_MP8000A_Series_01-AUG-2006 (PDF, 125kB) Mold_Compound_Nitto_Products (PDF, 49kB) Mold_Compound_OSE-SUMITOMO_5TYPES_SDOC-NON-USE_PFOS_PFOA_02-13-2008 (PDF, 372kB) Mold_Compound_SHINESTU_KMC-385P-8_KMC-385P-14F_SDOC-REPORT-CONTENT_07-05-2007 (PDF, 464kB) Mold_Compound_SHINETSU_KMC-3580P-14F_KMC-3580P-8_SDOC-NON-USE-6SUBS_12-27-2007 (PDF, 24kB) Mold_Compound_SHINETSU_SDOC_KMC-3580P-14F_KMC-3580P-8_25SUBS_05-22-2007 (PDF, 568kB) Mold_Compound_SHINETSU_SDOC_KMC-3580P-14F_KMC-3580P-8_BrCl_06-15-2007 (PDF, 24kB) Mold_Compound_SHINETSU_SDOC_KMC-3580P-14F_KMC-3580P-8_TBBPA_DECA-BDE_12-03-2007 (PDF, 304kB) Mold_Compound_SUMITOMO-9TYPES_SDOC-NON-USE_PFOS_R01-25-2008 (PDF, 381kB) Mold_Compound_Sumitomo_EME-6300H_6SUBS_03-27-2007 (PDF, 107kB) MOLD_COMPOUND_SUMITOMO_EME-6300H_TR6SUBS_02-20-2008 (PDF, 220kB) Mold_Compound_Sumitomo_EME-6600A_6SUBS_03-29-2006 (PDF, 128kB) MOLD_COMPOUND_SUMITOMO_EME-6600A_TR6SUBS_03-03-2008 (PDF, 454kB) MOLD_COMPOUND_SUMITOMO_EME-6600CR_6SUBS_03-21-2007 (PDF, 108kB) Mold_Compound_Sumitomo_EME-6600HR_6SUBS_08-13-2007 (PDF, 291kB) Mold_Compound_Sumitomo_EME-6600H_6Subs_02-26-2007 (PDF, 330kB) Mold_Compound_Sumitomo_EME-6600RA_6SUBS_07-05-2007 (PDF, 571kB) Mold_Compound_Sumitomo_EME-6710SJ_6SUBS_01-09-2007 (PDF, 558kB) Mold_Compound_Sumitomo_EME-6710S_6SUBS_07-31-2007 (PDF, 1064kB) Mold_Compound_Sumitomo_EME-6730B_6SUBS_05-07-2007 (PDF, 295kB) Mold_Compound_Sumitomo_EME-7351LS_6SUBS_06-28-2007 (PDF, 388kB) Mold_Compound_Sumitomo_EME-7730LF_6SUBS_08-27-2007 (PDF, 293kB) Mold_Compound_Sumitomo_EME-7730L_6subs_02-26-2007 (PDF, 348kB) Mold_Compound_Sumitomo_EME-7730L_EME-6300SR_EME-6650RL_EME-7720T_EME-S351TQ_and_EME-S730_11-04-2003 (PDF, 2400kB) MOLD_COMPOUND_SUMITOMO_EME-G600-TYPEC_TR6SUBS_02-05-2008 (PDF, 337kB) Mold_Compound_Sumitomo_EME-G600C_6SUBS_02-26-2007 (PDF, 336kB) Mold_Compound_Sumitomo_EME-G600_6SUBS_08-20-2007 (PDF, 290kB) Mold_Compound_SUMITOMO_EME-G600_BrCl_06-21-2007 (PDF, 117kB) Mold_Compound_Sumitomo_EME-G600_SbClBr_06-07-2007 (PDF, 260kB) Mold_Compound_Sumitomo_EME-G605L_6SUBS_03-23-2007 (PDF, 107kB) Mold_Compound_Sumitomo_EME-G605_SbClBr_10-20-2007 (PDF, 200kB) Mold_Compound_Sumitomo_EME-G700A_6SUBS_03-07-2007 (PDF, 336kB) Mold_Compound_Sumitomo_EME-G700CA_6SUBS_01-30-2007 (PDF, 336kB) Mold_Compound_Sumitomo_EME-G700E_6SUBS_03-12-2007 (PDF, 94kB) Mold_Compound_Sumitomo_EME-G700HA_6SUBS_08-17-2006 (PDF, 283kB) Mold_Compound_Sumitomo_EME-G700J_6SUBS_05-03-2007 (PDF, 257kB) Mold_Compound_Sumitomo_EME-G700K_6SUBS_11-07-2006 (PDF, 138kB) Mold_Compound_Sumitomo_EME-G700K_SbClBr_11-05-2007 (PDF, 246kB) Mold_Compound_Sumitomo_EME-G700L_6SUBS_08-21-2007 (PDF, 454kB) Mold_Compound_Sumitomo_EME-G700L_SbClBr_11-05-2007 (PDF, 114kB) MOLD_COMPOUND_SUMITOMO_EME-G700L_TRBrClSb_11-05-2007 (PDF, 114kB) Mold_Compound_Sumitomo_EME-G700M_6SUBS_08-13-2007 (PDF, 295kB) Mold_Compound_Sumitomo_EME-G700M_SbClBr_11-05-2007 (PDF, 114kB) Mold_Compound_Sumitomo_EME-G700_6SUBS_08-08-2007 (PDF, 387kB) Mold_Compound_Sumitomo_EME-G700_ClBr_08-22-2007 (PDF, 1667kB) Mold_Compound_Sumitomo_EME-G760_6SUBS_01-22-2007 (PDF, 336kB) Mold_Compound_Sumitomo_EME-G770C_6SUBS_04-02-2007 (PDF, 335kB) MOLD_COMPOUND_SUMITOMO_EME-G770C_TR6SUBS_04-02-2007 (PDF, 339kB) Mold_Compound_Sumitomo_EME-G770HCD_6SUBS_03-23-2007 (PDF, 107kB) MOLD_COMPOUND_SUMITOMO_EME-G770HCD_6SUBS_06-18-2007 (PDF, 278kB) Mold_Compound_SUMITOMO_EME-G770HCD_BrClFSb_05-28-2007 (PDF, 289kB) Mold_Compound_Sumitomo_EME-G770HCd_SbClBr_06-07-2007 (PDF, 264kB) Mold_Compound_SUMITOMO_EME-G770HCD_SbFClBr_05-28-2007 (PDF, 289kB) Mold_Compound_SUMITOMO_EME-G770HCD_SDOC-NON-USE-4SUBS_12-21-2007 (PDF, 52kB) Mold_Compound_Sumitomo_EME-G770HC_6SUBS_08-27-2007 (PDF, 292kB) Mold_Compound_Sumitomo_EME-G770H_6SUBS_05-25-2006 (PDF, 325kB) Mold_Compound_Sumitomo_EME-G770H_Type-CD_6subs_03-23-2007 (PDF, 109kB) MOLD_COMPOUND_SUMITOMO_EME-G770_TR6SUBS_10-09-2007 (PDF, 150kB) Mold_Compound_SUMITOMO_SDOC-FOR_EME-7351-TYPE-LS_BrCl_TBBPA_28SUBS_11-08-2007 (PDF, 26kB) Mold_Compound_UTL-SUMITOMO_11TYPES_SDOC-NON-USE_PFOS_PFOA_PFAS_02-12-2008 (PDF, 536kB) NITTO DENKO GE-100 Series TEST DATA FOR PPM/WT CONTENT OF Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Phosphorous (P) November 16, 2007 CE/2007/B2303 SGS (PDF, 205kB) NITTO DENKO GE-100 Series TEST DATA FOR PPM/WT CONTENT OF Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Phosphorous (P) November 16, 2007 CE/2007/B2303 SGS NITTO DENKO GE-100 Series "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" November 19, 2007 LPCI/22172/07 SGS (PDF, 143kB) SHINETSU KMC184-7 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" February 25, 2008 LPCI/03475/08 SGS (PDF, 221kB) SUMITOMO EME-6300 TYPE H3L "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" April 8, 2008 KA/2008/40050 SGS (PDF, 476kB) SUMITOMO EME-G700 TYPE K "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" November 20, 2007 20205402C/07 (1) SGS (PDF, 155kB) SUMITOMO EME-G700 TYPE K TEST DATA FOR PPM/WT CONTENT OF: Antimony (Sb), Bromine (Br), Chlorine (Cl) November 5, 2007 ATS/GEL/697/07/sk ALS (PDF, 246kB) Material Test Data for Surface Finish PLATING AEM (FOR ISPL) 100% Tin Ball TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI) October 4, 2007 10102720/7 SGS (PDF, 192kB) PLATING ROHM & HAAS (FOR AMKOR) SOLDERON ST-380 ACID HC, SOLDERON ST-380 ANTI-OXIDANT, SOLDERON ST-380 PRIMARY, SOLDERON ST-380 SECONDARY, SOLDERON TIN CONCENTRATE TEST DATA FOR PPM/WT CONTENT OF: Cadmium (Cd), Hexavalent Chromium (CrVI), Lead (Pb), Mercury (Hg), Polybrominated biphenyl (PBB), Polybrominated diphenyl ether (PBDE) December 12, 2007 EC407642601 SGS (PDF, 245kB) PLATING ROHM & HAAS (FOR AMKOR) SOLDERON ST-380 ANTI-OXIDANT, SOLDERON ST-380 PRIMARY, SOLDERON ST-380 SECONDARY SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCE: Perfluorooctane sulfonates (PFOS) April 18, 2008 (PDF, 172kB) PLATING ROHM & HAAS (FOR AMKOR) SOLDERON ST-380 ANTI-OXIDANT, SOLDERON ST-380 PRIMARY, SOLDERON ST-380 SECONDARY SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Antimony (Sb), Arsenic (As), Asbestos, Azo, Berylllium (Be), Bismuth (Bi), Bromoniated Flame Retardants other than PBB/PBDE/TBBPA, Cadmium (Cd), Chlorodiphenylmethanem Dichloroethyle, Trichloromethane, Pentachloroethane, Tetrachloromethane, Aliphatic Chlorinated Hydrocarbons (other than PCN/PCB/PCT/SCCP), Short Chain Chlorinated Paraffins (SCCP), Bromodiphenylmethane, Expanded Polystyrene (EPS), Fromaldehyde, Ugilec 121, Ugilec 141, DBBT, Halons, Chlorinated Flurocarbons, HCFC, HBFC, Carbon Tetrachloride, Hydro Fluoro Carbons, Per Fluoro Carbons, Hexavelent Chromium, Lead (Pb), Mercury (Hg), Natural rubber, Nickel (Ni), Palladium, Penta Chloro Phenol (PCP), Perfluorooctane sulfonates (PFOS), Phthalates (DEHP, DBP, DINP, DINP, DNOP, DNHP), Polybrominated Biphenyls (PBB), Polybrominated Diphenlethers (PBDE, PBDO, PBBE, DBDPE, DBDPO), Polychlorinate dBiphenyls (PCB), Polychlorinate terphenyls PCT), Polychlorinated Napthalenes (PCN) Polycyclic Aromatic Hydrocarbons (PAH), Polyvinyl Chloride (PVC), Radioactive substances, Red Phosphorus, Selenium (Se), Tetrabromo bis phenol A (TBBP-A), Tributyltin (TBT), Tributyltin Oxide (TBTO), Triphenlytin (TPT) April 4, 2008 (PDF, 194kB) Plating_ASAT-ROHM&HASS_PLATE-19ITEMS_SDOC-NON-USE_PFOS_PFOA_04-11-2007 (PDF, 233kB) PLATING_CARSEM-REDRING_Sn-SnPb-PLATING_SDOC-NON-USE_BrCl_10-08-2007 (PDF, 79kB) PLATING_CARSEM-REDRING_Sn-SnPb-PLATING_SDOC-NON-USE_PFOS_PFOA_01-30-2008 (PDF, 80kB) PLATING_CARSEM-REDRING_SnPb-ANODE_TR6SUBS_02-25-2008 (PDF, 86kB) PLATING_CIRTEK-SCHLOETTER_PURESn-PLATE_6SUBS_03-19-2007 (PDF, 679kB) PLATING_HANA-ASM_Ag-PLATE-PPF_TR6SUBS_01-23-2008 (PDF, 933kB) PLATING_ISPL-AEM_PURESn_TR6SUBS_10-04-2007 (PDF, 195kB) Plating_ISPL-TECHNIC_6-TIN-PLATE_SDOC-NON-USE_6SUBS_01-30-2008 (PDF, 116kB) PLATING_ISPL-TECHNIC_PURE-TIN_6SUBS_03-21-2007 (PDF, 204kB) PLATING_ISPL-TECHNIC_PURESnBALL_TR6SUBS_01-24-2008 (PDF, 916kB) Plating_OSE-SCHLOETTER_TIN-PLATE-6ITEMS_SDOC_NON-USE_21SUBS_01-27-2008 (PDF, 90kB) Plating_OSEP-SCHLOTER_TIN_4SUBS_01-30-2007 (PDF, 437kB) PLATING_SCHLOETTER_PLATING_ALL-TYPES_SDOC-NON-USE_PFOS_PFOA_06-2007 (PDF, 21kB) PLATING_SCS-SCHLOETTER_Sn99-99ANODE_6SUBS_03-21-2007 (PDF, 668kB) PLATING_UTL-KOKI_SnANODE_TR6SUBS_12-11-2007 (PDF, 3184kB) PLATING_UTL-KOKI_SnANODE_TR6SUBS_12-11-2007 (PDF, 3184kB) Plating_UTL-TECHWIN_SDOC-NON-USE_9SUBS_-2-12-2008 (PDF, 108kB) REDRING (FOR CARSEM) PURE TIN ANODE "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" December 31, 2007 LPCI/24763/07 SGS (PDF, 93kB) ROHM & HAAS (FOR ASAT) SOLDERON ST-380 ANTIOXIDANT FOR TIN PLATING "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" May 22, 2008 EC408009604 SGS (PDF, 243kB) ROHM & HAAS (FOR ASAT) SOLDERON ST-380 PRIMARY FOR TIN PLATING "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" May 22, 2008 EC408009602 SGS (PDF, 244kB) ROHM & HAAS (FOR ASAT) SOLDERON ST-380 SECONDARY FOR TIN PLATING "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" May 22, 2008 EC408009603 SGS (PDF, 243kB) Surface_Finish_ASAT_Leadfree_Solderon_ST200 (PDF, 28kB) Surface_Finish_CARSEM-REDRING_ALL-TYPES_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 80kB) Surface_Finish_Carsem_Leadfree_Solder_Ball (PDF, 96kB) Surface_Finish_HANA-ULTRACORE_TINPLATE_SDOC-SUBS-DISCLOSURE_01-23-2008 (PDF, 1687kB) Surface_Finish_HANA-ULTRACORE_TIN_SDOC-NON-USE_PFOS_PFAS_06-27-2007 (PDF, 61kB) Surface_Finish_Koki_Products_Tin_Pure_Metal_05-APR-2007 (PDF, 748kB) Surface_Finish_Redring_Solder_Pure_Tin_Solder_Anode_27-MAR-2007 (PDF, 197kB) Surface_Finish_Rohm_Haas_Electronic_Materials_ST380_Solderon_Process_Solutions_14-FEB-2007 (PDF, 193kB) Material Test Data for IC Silicon Chip Components MAXIM Fabricated wafer (using PFOS containing developer) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Perfluorooctane sulfonates (PFOS), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I)" June 19, 2008 CE/2008/62379A SGS (PDF, 342kB) Material Test Data for Solder Balls MKE (FOR AMKOR) 96.5Sn/3.0Ag.0.5Cu "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" November 29, 2007 CE/2007/B5930 SGS (PDF, 247kB) SOLDER_BALL_AMKOR-MKE_Sn63-Pb37BALL_SDOC-NON-USE_6SUBS_01-11-2008 (PDF, 79kB) SOLDER_BALL_AMKOR-MKE_Sn63-Pb37BALL_TR8SUBS_01-14-2008 (PDF, 302kB) SOLDER_BALL_AMKOR-MKE_Sn955-Ag4-Cu5_SDOC-NON-USE_PFOS+_10-25-2007 (PDF, 80kB) SOLDER_BALL_AMKOR-MKE_Sn955-Ag4-Cu5_TR9SUBS_01-14-2008 (PDF, 309kB) SOLDER_BALL_AMKOR-MKE_Sn985-Ag1-Cu5_TR9SUBS_01-14-2008 (PDF, 304kB) SOLDER_BALL_ASAT-MKE_96.5Sn-3.0Ag-0.5Cu_SDOC-CONTENT-8SUBS_01-18-2008 (PDF, 104kB) SOLDER_BALL_ASAT-PMTC_96.5Sn-3.0Ag-0.5Cu_SDOC-CONTENT_PFOS_01-21-2008 (PDF, 104kB) SOLDER_BALL_ASAT-SENJU_SDOC-NON-USE_PFOS_01-30-2008 (PDF, 26kB) SOLDER_BALL_CASIO-WLCSP_BUMP_4SUBS_07-23-2007 (PDF, 73kB) SOLDER_BALL_SPIL-SENJU_Sn63Pb37-SPARKLE-BALL_TR12SUBS_03-22-2005 (PDF, 385kB) SOLDER_BALL_SPIL-SENJU_SnAgCu-ECO-M705_TR12SUBS_03-22-2005 (PDF, 397kB) SOLDER_BALL_UTL-KOKI_39TYPES-PbFREE_TR6SUBS_12-11-2007 (PDF, 3184kB) UCSP_Solder_Balls_6sub_07-20-2007 (PDF, 116kB) UCSP_SOLDER_BALLS_MAXIM-NIPPON_SUBSTANCES-CONTENT-REPORT_01-09-2008 (PDF, 830kB) End Products Molding Compound Data Supplier Declarations for Hazardous Substances Amkor Hazardous Substance Warranty Letter (PDF, 242kB) ISO 17025 Certificates for Material Testing Labs ALS_chem&bio_17025_cert (PDF, 33kB) ALS_envr_test_17025_cert (PDF, 17kB) Nippon_Micrometal_Corp (PDF, 329kB) SGS_Hong_Kong_Ltd (PDF, 119kB) SGS_Malaysia (PDF, 207kB) SGS_Taiwan_Ltd (PDF, 49kB) Material Test Data for Die Lamination Film LAMINATION_TAPE_CASIO-WLCSP_6SUBS_07-23-2007 (PDF, 233kB) Maxim_Adwill_LC2850(40)_Postcure_6subs_07-06-2007 (PDF, 67kB) Maxim_Adwill_LC2850(40)_Precure_6subs_07-06-2007 (PDF, 66kB) Maxim_Adwill_LC2850(50)_Postcure_6subs_07-06-2007 (PDF, 66kB) Maxim_Adwill_LC2850(50)_Precure_6subs_07-06-2007 (PDF, 67kB) Material Test Data for PCB Substrates HANA and Mitsubishi Gas Chemical Company Letter on RoHS Compliance for BT Materials (PDF, 12kB) HITACHI (FOR AMKOR) Laminate/Pre-preg types MCL-E-679FGB, MCL-E-679FG, MCL-E679FGB(R), MCL-E-679FG(R), MCL-E-679FG(S), MCL-679FBG(S), GEA-679FG, GEA-679FG(R), GEA-679FG(S), MCL-E679GT, GEA-679GT "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs), Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Antimony (Sb), Formaldehyde, Short Chain Chlorinated Paraffins (SCCP 10-13), Asbestos, Polychlorinated biphenyls (PCB), Polychlorinated triphenyls (PCT), Polychlorinated Napthalenes (PCN), Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl tin oxide (TBTO), select Azo, Mirex, Tetrabromobisphenol A Bis (TBBP-A ), Arsenic (As), Selenium (Se), Bismuth (Bi), Beryllium (Be), Polyvinyl chloride (PVC), Ethylene glycol ether, select Phthalates" May 30, 2007 CE/2007/55624 SGS (PDF, 193kB) Leadframes_Hana_BT_Substrates_ML_HL_GMPL_and_GHPL_Series (PDF, 615kB) MITISUBISHI (FOR AMKOR) BT substrate core types CCL-HL830/HL832/HL832EX, HL832HS, HL832NB, HL832MG, HL832NX type A SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS), Perfluorooctane acid (PFOA), May 28, 2007 N/A N/A (PDF, 24kB) MITISUBISHI (FOR AMKOR) CCL-HL832 Core SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Tetrabromobisphenol A (TBBP-A ), Antimony and it's compounds, Tributyl tin (TBT), Tributyl tin oxide (TBTO), Polyvinyl chloride (PVC), other Brominated Flame Retardants July 19, 2007 N/A N/A (PDF, 73kB) MITISUBISHI (FOR AMKOR) Substrate core types CCL-H, HL830, 832 (without Cu foil), GHPL-830, 832 "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" October 23, 2007 JP/2007/100432 SGS (PDF, 288kB) SUBSTRATE MITISUBISHI (FOR AMKOR) Core Types CCL-H, HL830NX, 832NX (w/o Cu foil), GHPL-830NX, 832NH "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" October 23, 2007 JP/2007/100435 SGS (PDF, 331kB) SUBSTRATES_AMKOR-MITSUBISHI-UNIMICRON_BT-21TYPES_SDOC-NON-USE_PFOS_06-22-2007 (PDF, 36kB) SUBSTRATES_ASAT-ASE_5TYPES_SDOC-NON-USE_PFOS_10-31-2007 (PDF, 79kB) SUBSTRATES_HANA_HL832HS-TF-NXA_AUS303_AUS308_SDOC-27SUBS_12-25-2007 (PDF, 1829kB) SUBSTRATE_CORE_MITSUBISHI_HL-832-SERIES_GHPL-830-SERIES_SDOC-NON-USE_DECA-BDE_TBBP-A_09-10-2007 (PDF, 18kB) SUBSTRATE_CORE_MITSUBISHI_TYPES_CCL-H_HL830HS_832HS_GHPL-830HS_832HS_6SUB_10-23-2007 (PDF, 344kB) SUBSTRATE_CORE_MITSUBISHI_TYPES_CCL-H_HL830TF_832TF_GHPL-803TF_832TF_6SUBS_10-23-2007 (PDF, 323kB) SUBSTRATE_CORE_SPIL-MITSUBISHI_4TYPES_TR6SUBS_10-14-2004 (PDF, 341kB) SUBSTRATE_HANA-KINSUS_HL-832TF&HS_AUS303_HL-832NX-A_AUS308_8SUBS_REPORT_01-10-2008 (PDF, 46kB) SUBSTRATE_HANA-KINSUS_LGA-3TYPES_SDOC-CONTENT_PFOS_PFOA_BrClFI_REDP_TBBPA_01-10-2008 (PDF, 45kB) SUBSTRATE_HANA-KINSUS_LGASUBSTRATES-3TYPES_SDOC-CONTENT_PFOS_PFOA_BrClFI_RedP_TBBPA_02-05-2008 (PDF, 45kB) SUBSTRATE_SOLDERMASK-INK_TAIYO_ASUS303-CA40-WHITE_PBB-PBDE_03-15-2007 (PDF, 196kB) SUBSTRATE_SOLDERMASK_TAIYO_PSR-4000-ASUS303_CdPbHgCr6_04-24-2007 (PDF, 178kB) TAIYO (FOR AMKOR) PSR-4000 AUS308/CA-40 AUS308, PSR-4000 AUS320/CA-40 AUS320 SOLDER MASK SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Bromine (Br), Chlorine (Cl), Flourine (F), Iodine (I), Tetrabromobisphenol A (TBBP-A ), Antimony and it's compounds, Tributyl tin (TBT), Tributyl tin oxide (TBTO), Polyvinyl chloride (PVC), other Brominated Flame Retardants June 18, 2007 N/A N/A (PDF, 46kB) TAIYO (FOR AMKOR) Solder Mask type PSR-4000 AUS308 (UL: PSR-4000EY) "TEST DATA FOR PPM/WT CONTENT OF Cadium (Cd), Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr VI), Polybrominated biphenyls (PBBs) and Polybrominated biphenyl ethers (PBDEs)" July 16, 2007 CE/2007/72757 SGS (PDF, 249kB) TAIYO (FOR AMKOR) Solder Mask types PSR-4000 AUS5/CA-40 AUS2, PSR-4000 AUS303/CA-40 AUS303, PSR-4000 AUS308/CA-40 AUS308, PSR-4000 AUS320/CA-40 AUS320 SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) April 26, 2007 62-0178 N/A (PDF, 199kB) UMC + HITACHI (FOR AMKOR) Subtrate core type MCL-E679FB SUPPLIER DOCUMENT STATEMENT FOR NON USE OF SUBSTANCES: Perfluorooctane sulfonates (PFOS) January 15, 2008 N/A N/A (PDF, 20kB) Material Test Data for Specific Products CIRTEK_ASSY_ALL-PRODUCTS_SDOC-NON-USE_15SUBS_02-01-2008 (PDF, 20kB) DS1386-P-8-120_composite_6subs_11-26-2007 (PDF, 230kB) EPSON WLP/uCSP 10 PROCESSES FOR FAB OF MAXIM PRODUCT SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCE: Perfluorooctane sulfonates (PFOS) April 17, 2008 (PDF, 46kB) ISPL_TDFN-TQFN-SOT-TSOT_SDOC-NON-USE_6SUBS_R02-06-2008 (PDF, 11kB) MAX8676ELM_SbAsBrClFl-Phthalates_11-13-2007 (PDF, 106kB) MD_ASE_VSC452XHW-02 (PDF, 85kB) MD_CASIO-WLCSP_MAX2131S-SERIES_PbFREE_10-01-2007 (PDF, 83kB) MD_CASIO-WLCSP_MAX2160-SERIES_Pb-FREE_11-15-2005 (PDF, 83kB) MD_CASIO-WLCSP_MAX2163S-SERIES_PbFREE_10-04-2007 (PDF, 84kB) MD_CASIO-WLCSP_MAX2839S-SERIES_PbFREE_10-02-2007 (PDF, 85kB) 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UTAC_ASSEMBLY_DEVICES_SDOC-PFOS-NON-USE_01-07-2008 (PDF, 62kB) UTL_SPECIFIC-PRODS-TQFN-TDFN-TSSOP-PKGS_SDOC-NON-USE_12-06-2007 (PDF, 160kB) Material Test Data for Underfill UNDERFILL_CARSEM-HENKEL_FP4530&4549_02-01-2008 (PDF, 41kB) Material Test Data for Coatings BCB_DOW-CYCLOTENE-4026-46-RESIN_DATASHEET-CONTENT_05-21-1998 (PDF, 8kB) COATINGS_CASIO-WLCSP_POLYIMIDE_6SUBS_07-23-2007 (PDF, 295kB) COATINGS_CASIO-WLCSP_RESIN_6SUBS_07-23-2007 (PDF, 232kB) Material Test Data for Redistribution Layer RDL_CASIO-WLCSP_Cu_4SUBS_07-23-2007 (PDF, 73kB) Material Test Data for Liquid Encapsulants ENCAP_LOCTITE-HYSOL_CNB925-4_DATASHEET_05-2003 (PDF, 116kB) ENCAP_LOCTITE-HYSOL_FP4451_TR6SUBS_05-14-2004 (PDF, 96kB) Material Test Data for Flux CASIO UNKNOWN (USED FOR uCSP/WLP PACKAGES) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Chlorine (Cl) February 28, 2008 NA NA (PDF, 39kB) Material Test Data for Solder Paste CASIO UNKNOWN (USED FOR uCSP/WLP PACKAGES) SUPPLIER DOCUMENT STATEMENT FOR CONTENT OF SUBSTANCES: Chlorine (Cl) February 28, 2008 NA NA (PDF, 38kB)