|
DS34S132DK
Evaluation Kit for the DS34S132
|
Status
Active: In Production.
Description
The DS34S132 evaluation kit (EV kit) is an easy-to-use EV kit for evaluating the DS34S132 32-port TDM-over-packet (TDMoP) IC. The EV kit is a stand-alone system with a TDMoP chip, local oscillator, local control processor, memory, external E1/T1 LIUs and framers, power supply, and user interface software included in a 2.5 RU enclosure. The EV kit is controlled over an RS-232 serial link from an external ASCII terminal (typically using terminal emulation software running on a PC) or through a telnet session. The ASCII user interface is menu driven and hierarchical for easy use. The behavior and performance of the TDMoP IC can be evaluated with a single EV kit where the Ethernet signal is looped back to the kit, or with two EV kits configured as separate end points.
|
|
Data Sheet
|
Key Features
- Complete System: Motherboard and Daughter Cards in a Convenient 2.5 RU Enclosure
- Menu-Driven ASCII Text User Interface Software
- System Processor on a Separate Daughter Card
- Ethernet PHYs, I/O Jacks, E1/T1 Transceivers, and Clock Sources on Motherboard
- Built-In AC Power-Supply Module
- Several Popular TCXO and OCXO Oscillators from Which to Select and BNC Connectors for Lab References
- 9-Pin Serial Jack to Connect an ASCII Terminal for Configuration and Status
- System TCP/IP Stack for Configuration and Status Over IP/Ethernet
- One RJ45 Ethernet Jack for Connection to the Ethernet Network
- One RJ45 Jack for Each E1/T1 Port
- RJ45 External Clock Input Jack
- BNC Common Clock Input Jack
- BNC Reference Clock Input Jack
- 16-Bit CPU Interface to TDMoP IC
|
|
Applications/Uses
- HDLC-Encapsulated Data Over PSN
- TDM Circuit Emulation Over PSN (TDM Leased-Line Services Over PSN, TDM Over BPON/GPON/EPON, TDM Over Cable, TDM Over Wireless, Cellular Backhaul, Multiservice Over Unified PSN)
|
|
|
|
Product Guides
Software/Models
Ordering Information
|
Part Number
|
Free
Sample |
Buy |
Status
|
Package:
TYPE PINS FOOTPRINT
DRAWING CODE/VAR *
|
Temp |
RoHS/Lead-Free?
Materials Analysis
|
| DS34S132DK
|
|
|
Active |
KIT;
Land Pattern: Not Available
|
-40°C to +85°C
|
See data sheet
|
Notes:
- Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
- Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
- Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt; -D = drypack; -U/+U on DS parts = cut tape. More: See Full Data Sheet or Maxim Product Naming Conventions.
- * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.
|
Products with Similar Part Numbers
| DS34S101, DS34S102, DS34S104, ... |
Single/Dual/Quad/Octal TDM-Over-Packet Transport Devices |
| DS34S132 |
32-Port TDM-over-Packet IC |
| DS34T101, DS34T102, DS34T104, ... |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
| DS34T108DK |
Evaluation Kit for the DS34T101, DS34T102, DS34T104, DS34T108, DS34S101, DS34S102, DS34S104, and DS34S108 |
Didn't Find What You Need?
Information Index
Document Ref.: 19-5865
Rev 0;
2011-05-19
This page last modified: 2011-05-19
|
Download
E-Mail