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DS34S101, DS34S102, DS34S104, DS34S108
Single/Dual/Quad/Octal TDM-Over-Packet Transport Devices
Smallest, Most Robust, Lowest Cost Choice for Delivering TDM Services Over Pseudowires
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Status
Active: In Production.
Description
These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards-based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. The high level of integration available with the DS34S10x devices minimizes cost, board space, and time to market.
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Data Sheet
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An evaluation kit is available: DS34T108DK
Key Features
- Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks
- Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS
- Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes
- On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable
- Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments
- 64 Independent Bundles/Connections
- Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet
- VLAN Support According to 802.1p and 802.1Q
- 10/100 Ethernet MAC Supports MII/RMII/SSMII
- Selectable 32-Bit, 16-Bit or SPI Processor Bus
- Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing
- Glueless SDRAM Buffer Management
- Low-Power 1.8V Core, 3.3V I/O
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Key Specifications:
| TDM-Over-Packet |
| Part Number |
T1/E1/Serial Streams |
T3/E3, STS-1 Serial Ports |
Mapping Methods |
PSN Encapsulation Protocols |
10/100 MAC Interface |
Processor Interface |
Package/Pins |
Smallest Available Pckg.
(mm2) |
Budgetary Price |
| max w/pins |
See Notes |
| DS34S101 |
1 |
1 |
| AAL1 | | CESoPSN | | HDLC | | SAToP | | Structured | | Structured with CAS | | TDMoIP | | Unstructured |
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| L2TPv3 (IPv4, IPv6) | | MEF-8 | | MPLS | | RTP | | UDP (IPv4, IPv6) |
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289 |
$29.55 @1k |
| DS34S102 |
2 |
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289 |
$34.67 @1k |
| DS34S104 |
4 |
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289 |
$42.05 @1k |
| DS34S108 |
8 |
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529 |
$61.38 @1k |
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See All TDM-Over-Packet (9)
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Pricing Notes:
This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific prices and delivery, please see the price and availability page or contact an authorized distributor.
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Application Notes
Product Guides
Reliability Reports
Software/Models
Ordering Information
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Part Number
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Free
Sample |
Buy |
Status
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Package:
TYPE PINS FOOTPRINT
DRAWING CODE/VAR *
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Temp |
RoHS/Lead-Free?
Materials Analysis
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| DS34S101GN
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Active |
CSBGA;256 pin;289 mm²
Outline Drawing:21-0479 (PDF)
Land Pattern: 90-0271 (PDF)
Use pkgcode/variation: X256-9*
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-40°C to +85°C
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See data sheet
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| DS34S101GN+
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Active |
CSBGA;256 pin;289 mm²
Outline Drawing:21-0479 (PDF)
Land Pattern: 90-0271 (PDF)
Use pkgcode/variation: X256+9*
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-40°C to +85°C
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RoHS/Lead-Free: Lead Free
Materials Analysis |
| DS34S102GN
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Active |
CSBGA;256 pin;289 mm²
Outline Drawing:21-0479 (PDF)
Land Pattern: 90-0271 (PDF)
Use pkgcode/variation: X256-9*
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-40°C to +85°C
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See data sheet
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| DS34S102GN+
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Active |
CSBGA;256 pin;289 mm²
Outline Drawing:21-0479 (PDF)
Land Pattern: 90-0271 (PDF)
Use pkgcode/variation: X256+9*
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-40°C to +85°C
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RoHS/Lead-Free: Lead Free
Materials Analysis |
| DS34S104GN
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Active |
CSBGA;256 pin;289 mm²
Outline Drawing:21-0479 (PDF)
Land Pattern: 90-0271 (PDF)
Use pkgcode/variation: X256-9*
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-40°C to +85°C
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See data sheet
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| DS34S104GN+
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Active |
CSBGA;256 pin;289 mm²
Outline Drawing:21-0479 (PDF)
Land Pattern: 90-0271 (PDF)
Use pkgcode/variation: X256+9*
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-40°C to +85°C
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RoHS/Lead-Free: Lead Free
Materials Analysis |
| DS34S108DK-L7
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Active |
N/A;
Land Pattern: Not Available
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0°C to +70°C
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See data sheet
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| DS34S108GN
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Active |
BGA;484 pin;529 mm²
Outline Drawing:21-0447 (PDF)
Land Pattern: 90-0310 (PDF)
Use pkgcode/variation: V484T-4*
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-40°C to +85°C
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RoHS/Lead-Free: No
Materials Analysis |
| DS34S108GN+
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Active |
BGA;484 pin;529 mm²
Outline Drawing:21-0447 (PDF)
Land Pattern: 90-0310 (PDF)
Use pkgcode/variation: V484T+4*
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-40°C to +85°C
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RoHS/Lead-Free: Lead Free
Materials Analysis |
Notes:
- Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
- Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
- Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt; -D = drypack; -U/+U on DS parts = cut tape. More: See Full Data Sheet or Maxim Product Naming Conventions.
- * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.
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Similar Products by Function
Similar Products by Application
Evaluation Kits
| DS34T108DK |
Evaluation Kit for the DS34T101, DS34T102, DS34T104, DS34T108, DS34S101, DS34S102, DS34S104, and DS34S108 |
Products with Similar Part Numbers
| DS34S132DK |
Evaluation Kit for the DS34S132 |
| DS34S132 |
32-Port TDM-over-Packet IC |
| DS34T101, DS34T102, DS34T104, ... |
Single/Dual/Quad/Octal TDM-Over-Packet Chip |
| DS34T108DK |
Evaluation Kit for the DS34T101, DS34T102, DS34T104, DS34T108, DS34S101, DS34S102, DS34S104, and DS34S108 |
Didn't Find What You Need?
Information Index
Rev 3;
2008-11-10
This page last modified: 2011-03-08
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