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MAX9324
One-to-Five LVPECL/LVCMOS Output Clock and Data Driver
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Status
Active: In Production.
Description
The MAX9324 low-skew, low-jitter, clock and data driver distributes a differential LVPECL input to four differential LVPECL outputs and one single-ended LVCMOS output. All outputs default to logic low when the differential inputs equal GND or are left open. The MAX9324 operates from 3.0V to 3.6V, making it ideal for 3.3V systems, and consumes only 25mA (max) of supply current.
The MAX9324 features low 150ps (max) part-to-part skew, low 15ps output-to-output skew, and low 1.7ps RMS jitter, making the device ideal for clock and data distribution across a backplane or board. CLK_EN and SEOUT_Z control the status of the various outputs. Asserting CLK_EN low configures the differential (Q_, Q_) outputs to a differential low condition and SEOUT to a single-ended logic-low state. CLK_EN operation is synchronous with the CLK_ inputs. A logic high on SEOUT_Z places SEOUT in a high-impedance state. SEOUT_Z is asynchronous with the CLK (active-low CLK) inputs.
The MAX9324 is available in space-saving 20-pin TSSOP and ultra-small 20-pin 4mm x 4mm thin QFN packages and operates over the extended (-40°C to +85°C) temperature range.
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Data Sheet
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Key Features
- Differential Output-to-Output Skew
- 1.7psRMS Added Random Jitter
- 150ps (max) Part-to-Part Skew
- 450ps Propagation Delay
- Synchronous Output Enable/Disable
- Single-Ended Monitor Output
- Outputs Assert Low when CLK, active-low CLK are Open or at GND
- 3.0V to 3.6V Supply Voltage Range
- -40°C to +85°C Operating Temperature Range
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Applications/Uses
- Automated Test Equipment (ATE)
- Central Office Backplane Clock Distribution
- Data and Clock Driver and Buffer
- DSLAM Backplane
- Low-Jitter Data Repeater
- Precision Clock Distribution
- Wireless Base Stations
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Key Specifications:
| High-Speed Interconnect (Differential Signaling) |
| Part Number |
Signal Type |
Signal Type |
Functions |
Rx |
Tx |
tPD (ps) |
VSUPPLY (V) |
| Rx |
Tx |
max |
| MAX9324 |
LVPECL |
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Fan-Out Buffer |
1 |
5 |
600 |
3.3 |
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See All High-Speed Interconnect (Differential Signaling) (136)
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Pricing Notes:
This pricing is BUDGETARY, for comparing similar parts. Prices are in U.S. dollars and subject to change. Quantity pricing may vary substantially and international prices may differ due to local duties, taxes, fees, and exchange rates. For volume-specific prices and delivery, please see the price and availability page or contact an authorized distributor.
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Diagram
Typical Operating Circuit
Product Guides
Reliability Reports
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Software/Models
Ordering Information
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Part Number
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Free Sample |
Buy |
Status
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Package:
TYPE PINS FOOTPRINT
DRAWING CODE/VAR *
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Temp |
RoHS/Lead-Free? Materials Analysis
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| MAX9324EUP
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Active |
TSSOP;20 pin;45.2 mm²
Outline Drawing:21-0066 (PDF)
Land Pattern: 90-0116 (PDF)
Use pkgcode/variation: U20-3*
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-40°C to +85°C
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RoHS/Lead-Free: No
Materials Analysis |
| MAX9324EUP+
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Active |
TSSOP;20 pin;45.2 mm²
Outline Drawing:21-0066 (PDF)
Land Pattern: 90-0116 (PDF)
Use pkgcode/variation: U20+3*
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-40°C to +85°C
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RoHS/Lead-Free: Lead Free
Materials Analysis |
| MAX9324EUP+T
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Active |
TSSOP;20 pin;45.2 mm²
Outline Drawing:21-0066 (PDF)
Land Pattern: 90-0116 (PDF)
Use pkgcode/variation: U20+3*
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-40°C to +85°C
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RoHS/Lead-Free: Lead Free
Materials Analysis |
| MAX9324EUP-T
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Active |
TSSOP;20 pin
Land Pattern: Not Available
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-40°C to +85°C
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See data sheet
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Notes:
- Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
- Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
- Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt; -D = drypack; -U/+U on DS parts = cut tape. More: See Full Data Sheet or Maxim Product Naming Conventions.
- * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.
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Information Index
Document Ref.: 19-2576
Rev 0;
2002-10-31
This page last modified: 2007-07-17
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