DS2188

T1/CEPT Jitter Attenuator

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Status Explanations for product status codes

Part Number Status Replacement Explanation
DS2188 This product is Not Recommended for New Designs.DS26303
 
Please upgrade to the DS26303 for newer technology, smaller package, lower cost, and lower power consumption. 
 

Data Sheet

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Ordering Information

Filters: Part Number: Package: Temperature: Tape and Reel Sample
Part Number Free
Sample
Buy Status Explanations for product status codes Recommended Replacement Package:
TYPE PINS FOOTPRINT
DRAWING  CODE/VAR *
Temp RoHS/Lead-Free?
Materials Analysis
DS2188    
NRND DS26303

Please upgrade to the DS26303 for newer technology, smaller package, lower cost, and lower power consumption.  
PDIP(N);16 pin;158.4 mm²
Outline Drawing:21-0043 (PDF)
Land Pattern: Not Applicable
Use pkgcode/variation: P16-1*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
DS2188+    
NRND DS26303

 
PDIP(N);16 pin;158.4 mm²
Outline Drawing:21-0043 (PDF)
Land Pattern: Not Applicable
Use pkgcode/variation: P16+1*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
DS2188N    
NRND DS26303

 
PDIP(N);16 pin;158.4 mm²
Outline Drawing:21-0043 (PDF)
Land Pattern: Not Applicable
Use pkgcode/variation: P16-1*
-40°C to +85°C RoHS/Lead-Free: No
Materials Analysis
DS2188S    
NRND DS26303

 
SOIC(W);16 pin;110.6 mm²
Outline Drawing:21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16-2*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
DS2188S+    
NRND DS26303

 
SOIC(W);16 pin;110.6 mm²
Outline Drawing:21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16+2*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
DS2188S+T&R    
NRND DS26303

 
SOIC(W);16 pin;110.6 mm²
Outline Drawing:21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16+2*
0°C to +70°C RoHS/Lead-Free: Lead Free
Materials Analysis
DS2188S-C01+T&R     N/A NRND DS26303

 
SOIC;

Land Pattern: Not Available

0°C to +70°C See data sheet
DS2188S-C01/T&R     N/A NRND DS26303

 
SOIC;

Land Pattern: Not Available

0°C to +70°C See data sheet
DS2188S/T&R    
NRND DS26303

 
SOIC(W);16 pin;110.6 mm²
Outline Drawing:21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16-2*
0°C to +70°C RoHS/Lead-Free: No
Materials Analysis
DS2188S/T&R/     N/A NRND DS26303

 
SOIC;

Land Pattern: Not Available

0°C to +70°C See data sheet
Part Number Free
Sample
Buy Status Explanations for product status codes Recommended Replacement Package:
TYPE PINS FOOTPRINT
DRAWING  CODE/VAR *
Temp RoHS/Lead-Free?
Materials Analysis
DS2188SN    
NRND DS26303

 
SOIC(W);16 pin;110.6 mm²
Outline Drawing:21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16-2*
-40°C to +85°C RoHS/Lead-Free: No
Materials Analysis
DS2188SN+    
NRND DS26303

 
SOIC(W);16 pin;110.6 mm²
Outline Drawing:21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16+2*
-40°C to +85°C RoHS/Lead-Free: Lead Free
Materials Analysis
DS2188SN+T&R    
NRND DS26303

 
SOIC(W);16 pin;110.6 mm²
Outline Drawing:21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16+2*
-40°C to +85°C RoHS/Lead-Free: Lead Free
Materials Analysis
DS2188SN/T&R    
NRND DS26303

 
SOIC(W);16 pin;110.6 mm²
Outline Drawing:21-0042 (PDF)
Land Pattern: 90-0107 (PDF)
Use pkgcode/variation: W16-2*
-40°C to +85°C RoHS/Lead-Free: No
Materials Analysis

Notes:
  1. Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
  2. Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
  3. Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt; -D = drypack; -U/+U on DS parts = cut tape. More: See Full Data Sheet or Maxim Product Naming Conventions.
  4. * Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.

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Rev 1; 2000-10-06
This page last modified: 2007-06-21




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