12V, 120mA Flash Memory Programming Supply

Tiny Flash Memory Supply Circuit Fits in 0.3 Sq. Inch

Overview

Technical Documents

Ordering Info

Status

Active: In Production.

Data Sheet

Download	Rev 2	(PDF, 7.2MB)
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Ordering Information

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Temperature:

Tape and Reel

Sample

Part Number	Free Sample	Buy	Status	Package: TYPE PINS FOOTPRINT DRAWING CODE/VAR *	Temp	RoHS/Lead-Free? Materials Analysis
MAX734C/D			Active	DICE SALES;NA pin;DICE; Land Pattern: Not Applicable Use pkgcode/variation: DICE*		See data sheet
MAX734CPA			Active	PDIP(N);8 pin;79.7 mm² Outline Drawing:21-0043 (PDF) Land Pattern: Not Applicable Use pkgcode/variation: P8-2*	0°C to +70°C	RoHS/Lead-Free: No Materials Analysis
MAX734CPA+			Active	PDIP(N);8 pin;79.7 mm² Outline Drawing:21-0043 (PDF) Land Pattern: Not Applicable Use pkgcode/variation: P8+2*	0°C to +70°C	RoHS/Lead-Free: Lead Free Materials Analysis
MAX734CSA			Active	SOIC(N);8 pin;30.9 mm² Outline Drawing:21-0041 (PDF) Land Pattern: 90-0096 (PDF) Use pkgcode/variation: S8-5*	0°C to +70°C	RoHS/Lead-Free: No Materials Analysis
MAX734CSA+			Active	SOIC(N);8 pin;30.9 mm² Outline Drawing:21-0041 (PDF) Land Pattern: 90-0096 (PDF) Use pkgcode/variation: S8+5*	0°C to +70°C	RoHS/Lead-Free: Lead Free Materials Analysis
MAX734CSA+C2A			Active	SOIC(N);8 pin;30.9 mm² Outline Drawing:21-0041 (PDF) Land Pattern: 90-0096 (PDF) Use pkgcode/variation: S8+5*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
MAX734CSA+T			Active	SOIC(N);8 pin;30.9 mm² Outline Drawing:21-0041 (PDF) Land Pattern: 90-0096 (PDF) Use pkgcode/variation: S8+5*	0°C to +70°C	RoHS/Lead-Free: Lead Free Materials Analysis
MAX734CSA-T			Active	SOIC(N);8 pin;30.9 mm² Outline Drawing:21-0041 (PDF) Land Pattern: 90-0096 (PDF) Use pkgcode/variation: S8-5*	0°C to +70°C	RoHS/Lead-Free: No Materials Analysis
MAX734EPA			Active	PDIP(N);8 pin;79.7 mm² Outline Drawing:21-0043 (PDF) Land Pattern: Not Applicable Use pkgcode/variation: P8-2*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
MAX734ESA			Active	SOIC(N);8 pin;30.9 mm² Outline Drawing:21-0041 (PDF) Land Pattern: 90-0096 (PDF) Use pkgcode/variation: S8-5*	-40°C to +85°C	RoHS/Lead-Free: No Materials Analysis
Part Number	Free Sample	Buy	Status	Package: TYPE PINS FOOTPRINT DRAWING CODE/VAR *	Temp	RoHS/Lead-Free? Materials Analysis
MAX734ESA+			Active	SOIC(N);8 pin;30.9 mm² Outline Drawing:21-0041 (PDF) Land Pattern: 90-0096 (PDF) Use pkgcode/variation: S8+5*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
MAX734ESA+T			Active	SOIC(N);8 pin;30.9 mm² Outline Drawing:21-0041 (PDF) Land Pattern: 90-0096 (PDF) Use pkgcode/variation: S8+5*	-40°C to +85°C	RoHS/Lead-Free: Lead Free Materials Analysis
MAX734ESA-T			Active	N.SO;8 pin Land Pattern: Not Available	-40°C to +85°C	See data sheet
MAX734MJA			Active	CDIP(N);8 pin;82.6 mm² Outline Drawing:21-0045 (PDF) Land Pattern: Not Applicable Use pkgcode/variation: J8-2*	-55°C to +125°C	RoHS/Lead-Free: No Materials Analysis

Notes:

Other options and links for purchasing parts are listed at: http://www.maxim-ic.com/sales.
Didn't Find What You Need? Ask our applications engineers. Expert assistance in finding parts, usually within one business day.
Part number suffixes: T or T&R = tape and reel; + = RoHS/lead-free; # = RoHS/lead-exempt; -D = drypack; -U/+U on DS parts = cut tape. More: See Full Data Sheet or Maxim Product Naming Conventions.
* Some packages have variations, listed on the drawing. "PkgCode/Variation" tells which variation the product uses. Note that "+", "#", "-" in the part number suffix describes RoHS status. Package drawings may show a different suffix character.

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Overview		Technical Documents		Ordering Info		Related Products
Description Key Features Applications/Uses Key Specifications Diagram Notes and Comments		Data Sheet Application Notes Evaluation Kits Product Guides Reliability Reports Software/Models		Price and Availability Samples Buy Online Package Information Lead-Free Information		Similar Products by Function Similar Products by Application Evaluation Kits Products with Similar Part Numbers Products Used With This

Document Ref.: 19-4670 Rev 2; 1993-01-01
This page last modified: 2009-11-06