Abstract: This application note will give a brief introduction to thermal theory and general layout considerations that can be applied in order to obtain the benefits of the exposed-paddle packages. A worst-case example of performance degradation due to improper use of the exposed paddle will also be provided using thermal resistance data. The application note you have requested is available in Acrobat PDF format: APPLICATION NOTE 862: HFAN-08.1: Thermal Considerations of QFN and Other Exposed-Paddle Packages (PDF, 139kB) A free Acrobat PDF reader is available from: http://www.adobe.com/products/acrobat/readstep.html Related Parts   APP 862: Jan 10, 2002 MAX3781 2.75Gbps Dual Mux/Buffer MAX3783 2.7Gbps Dual Mux/Buffer with Loopback Full Data Sheet (PDF, 208kB) Free Samples MAX3881 +3.3V, 2.488Gbps, SDH/SONET 1:16 Deserializer with Clock Recovery Full Data Sheet (PDF, 240kB) MAX3891 16:1 Serializer, 3.3V, 2.5Gbps, SDH/SONET, with Clock Synthesis and LVPECL Inputs Full Data Sheet (PDF, 528kB) MAX3950 +3.3V, 10.7Gbps 1:16 Deserializer with LVDS Outputs Full Data Sheet (PDF, 392kB) Automatic Updates Would you like to be automatically notified when new application notes are published in your areas of interest? Sign up for EE-Mail™. We Want Your Feedback!   Download, PDF Format (139kB)  AN862, AN 862, APP862, Appnote862, Appnote 862