Keywords: LVDS, PECL, CML, interfacing high speed ICs, interconnecting high-speed communication systems Related Parts
APPLICATION NOTE 291
HFAN-01.0: Introduction to LVDS, PECL, and CML
Oct 12, 2000
Abstract: As the demand for high-speed data transmission grows, the interface between high-speed ICs becomes critical in achieving high performance, low power, and good noise immunity. Three commonly used interfaces are PECL (positive-referenced emitter-coupled logic), LVDS (low-voltage differential signals), and CML (current mode logic). When designing high-speed systems, people often encounter the problem of how to connect different ICs with different interfaces. To deal with this, it is important to understand the input and output circuit configurations of each interface for proper biasing and termination. This paper describes various ways of interconnecting between PECL, CML, and LVDS for high-speed communication systems, using Maxim products as examples.
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APPLICATION NOTE 291: HFAN-01.0: Introduction to LVDS, PECL, and CML